WO1998030075A3 - Procede et dispositif servant a rechauffer un composant - Google Patents

Procede et dispositif servant a rechauffer un composant Download PDF

Info

Publication number
WO1998030075A3
WO1998030075A3 PCT/FI1997/000834 FI9700834W WO9830075A3 WO 1998030075 A3 WO1998030075 A3 WO 1998030075A3 FI 9700834 W FI9700834 W FI 9700834W WO 9830075 A3 WO9830075 A3 WO 9830075A3
Authority
WO
WIPO (PCT)
Prior art keywords
component
heating
arrangement
heated
circuit board
Prior art date
Application number
PCT/FI1997/000834
Other languages
English (en)
Other versions
WO1998030075A2 (fr
Inventor
Ari Isteri
Original Assignee
Nokia Telecommunications Oy
Ari Isteri
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Telecommunications Oy, Ari Isteri filed Critical Nokia Telecommunications Oy
Priority to JP52965898A priority Critical patent/JP2001508942A/ja
Priority to EP97950212A priority patent/EP0983714A2/fr
Priority to AU53239/98A priority patent/AU728378B2/en
Publication of WO1998030075A2 publication Critical patent/WO1998030075A2/fr
Publication of WO1998030075A3 publication Critical patent/WO1998030075A3/fr
Priority to NO993236A priority patent/NO993236L/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • General Induction Heating (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Laminated Bodies (AREA)
  • Resistance Heating (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un procédé et un dispositif servant à réchauffer au moins un composant (14) d'une plaquette de circuit imprimé comprenant une ou plusieurs couches (10 et 11). On réchauffe au moins un composant (14) à réchauffer au moyen d'au moins une résistance thermique (15) associée à la plaquette de circuit imprimé.
PCT/FI1997/000834 1996-12-31 1997-12-30 Procede et dispositif servant a rechauffer un composant WO1998030075A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP52965898A JP2001508942A (ja) 1996-12-31 1997-12-30 部品を加熱する方法及び構成体
EP97950212A EP0983714A2 (fr) 1996-12-31 1997-12-30 Procede et dispositif servant a rechauffer un composant
AU53239/98A AU728378B2 (en) 1996-12-31 1997-12-30 Method and arrangement for heating a component
NO993236A NO993236L (no) 1996-12-31 1999-06-29 Fremgangsmåte og innretning for oppvarming av en komponent

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI965301 1996-12-31
FI965301A FI965301A (fi) 1996-12-31 1996-12-31 Menetelmä ja järjestely komponentin lämmittämiseksi

Publications (2)

Publication Number Publication Date
WO1998030075A2 WO1998030075A2 (fr) 1998-07-09
WO1998030075A3 true WO1998030075A3 (fr) 1998-08-27

Family

ID=8547390

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI1997/000834 WO1998030075A2 (fr) 1996-12-31 1997-12-30 Procede et dispositif servant a rechauffer un composant

Country Status (6)

Country Link
EP (1) EP0983714A2 (fr)
JP (1) JP2001508942A (fr)
AU (1) AU728378B2 (fr)
FI (1) FI965301A (fr)
NO (1) NO993236L (fr)
WO (1) WO1998030075A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI981032A (fi) 1998-05-08 1999-11-09 Nokia Networks Oy Lämmitysmenetelmä ja piirilevy
DE19851172A1 (de) * 1998-11-06 2000-05-11 Alcatel Sa Anordnung zur Erwärmung einer bestückten gedruckten Schaltung
GB2345453B (en) * 1999-09-14 2000-12-27 Lee John Robinson Laminated reflow soldering
DE202005001163U1 (de) 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Leiterplatte oder Platine mit Heizdraht
US11350490B2 (en) * 2017-03-08 2022-05-31 Raytheon Company Integrated temperature control for multi-layer ceramics and method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440407A (en) * 1966-12-29 1969-04-22 Rca Corp Temperature controlled circuit boards
US4769525A (en) * 1986-09-02 1988-09-06 Hughes Aircraft Company Circuit package attachment apparatus and method
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
US5268558A (en) * 1990-11-07 1993-12-07 France Telecom Temperature-controlled electronic circuit
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
GB2300340A (en) * 1995-04-28 1996-10-30 Smiths Industries Plc Heating electrical components

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440407A (en) * 1966-12-29 1969-04-22 Rca Corp Temperature controlled circuit boards
US4769525A (en) * 1986-09-02 1988-09-06 Hughes Aircraft Company Circuit package attachment apparatus and method
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
US5268558A (en) * 1990-11-07 1993-12-07 France Telecom Temperature-controlled electronic circuit
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
GB2300340A (en) * 1995-04-28 1996-10-30 Smiths Industries Plc Heating electrical components

Also Published As

Publication number Publication date
FI965301A (fi) 1998-07-01
JP2001508942A (ja) 2001-07-03
WO1998030075A2 (fr) 1998-07-09
AU728378B2 (en) 2001-01-11
AU5323998A (en) 1998-07-31
NO993236D0 (no) 1999-06-29
FI965301A0 (fi) 1996-12-31
NO993236L (no) 1999-06-29
EP0983714A2 (fr) 2000-03-08

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