NO993236L - Fremgangsmåte og innretning for oppvarming av en komponent - Google Patents

Fremgangsmåte og innretning for oppvarming av en komponent

Info

Publication number
NO993236L
NO993236L NO993236A NO993236A NO993236L NO 993236 L NO993236 L NO 993236L NO 993236 A NO993236 A NO 993236A NO 993236 A NO993236 A NO 993236A NO 993236 L NO993236 L NO 993236L
Authority
NO
Norway
Prior art keywords
component
heating
heated
circuit board
layers
Prior art date
Application number
NO993236A
Other languages
English (en)
Other versions
NO993236D0 (no
Inventor
Ari Isteri
Original Assignee
Nokia Telecommunications Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Telecommunications Oy filed Critical Nokia Telecommunications Oy
Publication of NO993236L publication Critical patent/NO993236L/no
Publication of NO993236D0 publication Critical patent/NO993236D0/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • General Induction Heating (AREA)
  • Control Of Resistance Heating (AREA)

Abstract

Oppfinnelsen angår en fremgangsmåte og en innretning for oppvarming av minst en komponent (14) i et kretskort som omfatter en eller flere lag (10 og 11). Minst en komponent (14) som skal oppvarmes, varmes da med minst. en varmemotstand (15) i tilknytning til kretskortet.
NO993236A 1996-12-31 1999-06-29 FremgangsmÕte og innretning for oppvarming av en komponent NO993236D0 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI965301A FI965301A (fi) 1996-12-31 1996-12-31 Menetelmä ja järjestely komponentin lämmittämiseksi
PCT/FI1997/000834 WO1998030075A2 (en) 1996-12-31 1997-12-30 Method and arrangement for heating a component

Publications (2)

Publication Number Publication Date
NO993236L true NO993236L (no) 1999-06-29
NO993236D0 NO993236D0 (no) 1999-06-29

Family

ID=8547390

Family Applications (1)

Application Number Title Priority Date Filing Date
NO993236A NO993236D0 (no) 1996-12-31 1999-06-29 FremgangsmÕte og innretning for oppvarming av en komponent

Country Status (6)

Country Link
EP (1) EP0983714A2 (no)
JP (1) JP2001508942A (no)
AU (1) AU728378B2 (no)
FI (1) FI965301A (no)
NO (1) NO993236D0 (no)
WO (1) WO1998030075A2 (no)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI981032A (fi) * 1998-05-08 1999-11-09 Nokia Networks Oy Lämmitysmenetelmä ja piirilevy
DE19851172A1 (de) * 1998-11-06 2000-05-11 Alcatel Sa Anordnung zur Erwärmung einer bestückten gedruckten Schaltung
GB2345453B (en) * 1999-09-14 2000-12-27 Lee John Robinson Laminated reflow soldering
DE202005001163U1 (de) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Leiterplatte oder Platine mit Heizdraht
US11350490B2 (en) * 2017-03-08 2022-05-31 Raytheon Company Integrated temperature control for multi-layer ceramics and method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440407A (en) * 1966-12-29 1969-04-22 Rca Corp Temperature controlled circuit boards
US4769525A (en) * 1986-09-02 1988-09-06 Hughes Aircraft Company Circuit package attachment apparatus and method
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
FR2668876B1 (fr) * 1990-11-07 1992-12-24 Alcatel Espace Circuit electronique controle en temperature.
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
GB9508631D0 (en) * 1995-04-28 1995-06-14 Smiths Industries Ltd Electrical circuits

Also Published As

Publication number Publication date
WO1998030075A3 (en) 1998-08-27
JP2001508942A (ja) 2001-07-03
WO1998030075A2 (en) 1998-07-09
EP0983714A2 (en) 2000-03-08
FI965301A (fi) 1998-07-01
AU728378B2 (en) 2001-01-11
FI965301A0 (fi) 1996-12-31
NO993236D0 (no) 1999-06-29
AU5323998A (en) 1998-07-31

Similar Documents

Publication Publication Date Title
DE19880398T1 (de) Substrattemperatur-Meßvorrichtung, Substrattemperatur-Meßverfahren Substraterwärmungsverfahren und Wärmebehandlungsvorrichtung
GB2319943B (en) Resistive elements for heating an aerofoil, and device for heating an aerofoil incorporating such elements
DE3381162D1 (de) Schaltung und methode zum steuern der substratvorspannung.
EP0662614A3 (en) Test bench for integrated circuit boards and test method.
EP0306967A3 (en) Apparatus for performing heat treatment on semiconductor wafers
DE69018227D1 (de) Laminiertes wärme- oder druckübertragbares Abziehbild.
DE3762298D1 (de) Verfahren und geraet unter verwendung von infrarotstrahlen zum loeten von bauteilen auf leiterplatten mit infrarotstrahlen.
DK0675120T3 (da) Anvendelse af ascorbyl-gamma-linolenat eller et ascorbyldihomo-gamma-linolenat til behandling af astma, cancer, kardiovaskulære og inflammatoriske lidelser
ZA989345B (en) Gas hydrate regassification method and apparatus using steam or other heated gas or liquid.
NO993236L (no) Fremgangsmåte og innretning for oppvarming av en komponent
DK6789D0 (da) Fremgangsmaade og apparat til at undertrykke no dannelse i regenerative braendere.
LV11061A (lv) Ierice un panemiens udens tvaika uzkarsesanas temperaturas regulesanai katios ar cirkulejosu verdoso slani
DK316389D0 (da) Varmeveksler og fremgangsmaade til overvaagning af tryk i varmeveksler
DE3787658D1 (de) Reparaturvorrichtung und Reparaturverfahren für Leiterplatten mit Bauteilen in Oberflächenmontagetechnologie.
DE59600743D1 (de) Anordnung zum anschluss von versorgungsleitungen an ein elektronisches gerät sowie schrank mit einer derartigen anordnung
AU2900797A (en) Heating glass in tempering furnace
ATE188101T1 (de) Gargerät mit heissluft- und/oder dampfbetrieb
ATE211077T1 (de) Verfahren und vorrichtung zum aufbringen eines dekors auf einen gegenstand
NO971752L (no) Kretskomponent og filter med en eller flere slike komponenter
FI915103A (fi) Menetelmä ja laite kuumien kaasujen lämpötilan tasoittamiseksi
HK1041975A1 (en) Method and apparatus to control the temperature ofa component
DE58900389D1 (de) Anordnung zur absenkung der abgastemperatur bei heizeinrichtungen.
DE68908749D1 (de) Wärmebeständiges, isolierendes Substrat, thermischer Druckkopf und thermografischer Apparat.
ATE152660T1 (de) Anlage zum schneidenden zerteilen von kanthölzern in dünne bretter
DE69501889D1 (de) Musterstörung beim wärmetransferdruckverfahren

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application