DE3762298D1 - Verfahren und geraet unter verwendung von infrarotstrahlen zum loeten von bauteilen auf leiterplatten mit infrarotstrahlen. - Google Patents

Verfahren und geraet unter verwendung von infrarotstrahlen zum loeten von bauteilen auf leiterplatten mit infrarotstrahlen.

Info

Publication number
DE3762298D1
DE3762298D1 DE8787300480T DE3762298T DE3762298D1 DE 3762298 D1 DE3762298 D1 DE 3762298D1 DE 8787300480 T DE8787300480 T DE 8787300480T DE 3762298 T DE3762298 T DE 3762298T DE 3762298 D1 DE3762298 D1 DE 3762298D1
Authority
DE
Germany
Prior art keywords
infrared rays
circuits
soldering components
soldering
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787300480T
Other languages
English (en)
Inventor
Stanley Donald Entwistle
Gabriel Marcantonio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Northern Telecom Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Telecom Ltd filed Critical Northern Telecom Ltd
Application granted granted Critical
Publication of DE3762298D1 publication Critical patent/DE3762298D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE8787300480T 1986-02-10 1987-01-21 Verfahren und geraet unter verwendung von infrarotstrahlen zum loeten von bauteilen auf leiterplatten mit infrarotstrahlen. Expired - Fee Related DE3762298D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/827,413 US4725716A (en) 1986-02-10 1986-02-10 Infrared apparatus for infrared soldering components on circuit boards

Publications (1)

Publication Number Publication Date
DE3762298D1 true DE3762298D1 (de) 1990-05-17

Family

ID=25249161

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787300480T Expired - Fee Related DE3762298D1 (de) 1986-02-10 1987-01-21 Verfahren und geraet unter verwendung von infrarotstrahlen zum loeten von bauteilen auf leiterplatten mit infrarotstrahlen.

Country Status (5)

Country Link
US (1) US4725716A (de)
EP (1) EP0237151B1 (de)
JP (1) JPS62248563A (de)
CA (1) CA1240404A (de)
DE (1) DE3762298D1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR910005959B1 (ko) * 1988-01-19 1991-08-09 니혼 덴네쯔 게이기 가부시끼가이샤 리플로우 납땜 방법 및 그 장치
US4973244A (en) * 1988-06-08 1990-11-27 Electrovert Limited Heating system in the manufacture of printed circuit boards, assemblies and the like
US4876437A (en) * 1988-07-14 1989-10-24 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus
DE3841447C1 (de) * 1988-12-09 1990-08-02 Heraeus Quarzschmelze Gmbh, 6450 Hanau, De
FR2647623A1 (fr) * 1989-05-26 1990-11-30 Seico Perfectionnement au procede de soudage de composants sur circuit imprime, et dispositif pour la mise en oeuvre du procede
US5128506A (en) * 1990-10-30 1992-07-07 Westinghouse Electric Corp. Method and apparatus for selective infrared soldering using shielding fixtures
US6021046A (en) * 1993-06-09 2000-02-01 Dallas Semiconductor Corporation Thermal protection of electrical elements systems
US5579206A (en) * 1993-07-16 1996-11-26 Dallas Semiconductor Corporation Enhanced low profile sockets and module systems
US5528463A (en) * 1993-07-16 1996-06-18 Dallas Semiconductor Corp. Low profile sockets and modules for surface mountable applications
US5607609A (en) † 1993-10-25 1997-03-04 Fujitsu Ltd. Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering
US5444814A (en) * 1993-11-01 1995-08-22 Hofius, Sr.; David V. Method of infrared welding on thermoplastic parts utilizing contoured energy reflecting shields
US5785233A (en) * 1996-02-01 1998-07-28 Btu International, Inc. Apparatus and method for solder reflow bottom cooling
US6730541B2 (en) * 1997-11-20 2004-05-04 Texas Instruments Incorporated Wafer-scale assembly of chip-size packages
US6200523B1 (en) * 1998-10-01 2001-03-13 Usf Filtration And Separations Group, Inc. Apparatus and method of sintering elements by infrared heating
US6446855B1 (en) * 1999-02-18 2002-09-10 Speedline Technologies, Inc. Compact reflow and cleaning apparatus
WO2001071463A2 (en) * 2000-03-17 2001-09-27 United States Postal Service Methods and systems for providing a secure electronic mailbox
EP1474260B8 (de) * 2001-11-06 2013-09-11 centrotherm thermal solutions GmbH + Co. KG Verfahren und anordnung zur strahlungsheizung für ein mehrkammer vakuum-lötsystem
US6768083B2 (en) * 2002-09-19 2004-07-27 Speedline Technologies, Inc. Reflow soldering apparatus and method for selective infrared heating
US20040134975A1 (en) * 2003-01-10 2004-07-15 Visteon Global Technologies, Inc. Composite pallet for a vector transient reflow process
US6857559B2 (en) * 2003-04-10 2005-02-22 Visteon Global Technologies, Inc. System and method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process
US7026582B2 (en) * 2003-05-07 2006-04-11 Visteon Global Technologies, Inc. Vector transient reflow of lead free solder for controlling substrate warpage
DE102005039829A1 (de) * 2005-08-22 2007-03-08 Endress + Hauser Gmbh + Co. Kg Verfahren zum Löten von SMD-Bauteilen, Leiterplatte und Reflow-Lötofen dazu
CN101308981A (zh) * 2008-07-11 2008-11-19 永泰电子（东莞）有限公司 一种运用红外线加热的焊接工艺及焊接装置
US8965185B2 (en) * 2009-03-02 2015-02-24 Btu International, Inc. Infrared furnace system
US9296056B2 (en) 2014-07-08 2016-03-29 International Business Machines Corporation Device for thermal management of surface mount devices during reflow soldering
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2674809A (en) * 1950-08-24 1954-04-13 Raduner & Co Ag Apparatus for thermic treatment by infrared radiation
US2820131A (en) * 1951-08-01 1958-01-14 Sprague Electric Co Curing oven
DE1900591A1 (de) * 1968-02-13 1969-10-30 Motorola Inc Verfahren zum Anloeten von Anschlussleitungen an gedruckte Schaltungen
US3710069A (en) * 1970-07-06 1973-01-09 Ibm Method of and apparatus for selective solder reflow
US3937388A (en) * 1971-09-15 1976-02-10 The Johns Hopkins University Method for sealing packages
US3882596A (en) * 1972-11-09 1975-05-13 Vaw Ver Aluminium Werke Ag Method of flux-free soldering of aluminum-containing workpieces in a controlled atmosphere
US4270260A (en) * 1978-10-10 1981-06-02 Krueger Ellison F Method for the salvage and restoration of integrated circuits from a substrate
IT1133926B (it) * 1980-10-16 1986-07-24 Argon Service Srl Procedimento di asciugatura dei fogli,delle bobine,e degli altri prodotti della stampa serigrafia e genere e forno per la realizzazione di detto processo
US4481708A (en) * 1982-01-18 1984-11-13 Analog Devices, Inc. Reduced internal temperature technique for hermetic sealing of enclosures
US4436985A (en) * 1982-05-03 1984-03-13 Gca Corporation Apparatus for heat treating semiconductor wafers
DE3223624C2 (de) * 1982-06-24 1986-08-28 Siemens AG, 1000 Berlin und 8000 München Kühlkörper für elektrische Bauelemente
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
FR2555363B1 (fr) * 1983-11-18 1986-02-21 Cit Alcatel Machine de report de composants pour circuits hybrides

Also Published As

Publication number Publication date
US4725716A (en) 1988-02-16
CA1240404A (en) 1988-08-09
EP0237151A1 (de) 1987-09-16
JPS62248563A (ja) 1987-10-29
EP0237151B1 (de) 1990-04-11

Similar Documents

Publication Publication Date Title
DE3762298D1 (de) Verfahren und geraet unter verwendung von infrarotstrahlen zum loeten von bauteilen auf leiterplatten mit infrarotstrahlen.
DE3580625D1 (de) Verfahren und vorrichtung zum kontaktieren von fluessigkeiten mit feststoffen.
DE3676940D1 (de) Verfahren und vorrichtung zum selbsttaetigen abtasten von fingerabdruecken.
DE68905237D1 (de) Verfahren und vorrichtung zum vergleichen von fingerabdruecken.
DE3579681D1 (de) Verfahren und vorrichtung zum waermebehandeln von schienen.
DE3771110D1 (de) Verfahren und geraet zum gruppieren von gegenstaenden.
DE3779278D1 (de) Verfahren und programmierbare vorrichtung zur umkodierung von zeichenketten.
DE68912573D1 (de) Vorrichtung und verfahren zum abschrecken von glasblättern.
DE68917813D1 (de) Verfahren und Vorrichtung zum Spritzgiessen von Leiterplatten.
DE3778483D1 (de) Vorrichtung fuer linearlager mit vollstaendiger nachstellung und entsprechendes verfahren.
DE69002288D1 (de) Geraet und verfahren zum erhitzen von wasser.
DE3881447D1 (de) Vorrichtung zum anschliessen von karten mit integrierten schaltungen.
DE58907018D1 (de) Vorrichtung und verfahren zum automatischen verbinden von fäden.
DE68908435D1 (de) Vorrichtung und verfahren zum kristallziehen.
DE3771416D1 (de) Verfahren und vorrichtung zum mikroloeten.
DE69205217D1 (de) Vorrichtung und Verfahren zum Zusammenbau von Schaltungsstrukturen.
DE3785430D1 (de) Verfahren und einrichtung zum automatischen lesen von vernier-mustern.
DE3768665D1 (de) Verfahren und vorrichtung zum auftragen von filmen.
DE3782382D1 (de) Vorrichtung und verfahren zum zerteilen von schlacke.
DE3762486D1 (de) Verfahren und vorrichtung zum automatischen zusammenfuegen von verbundglaesern.
ATE77966T1 (de) Verfahren und vorrichtung zum aufkonzentrieren von loesungen.
DE69215415D1 (de) Verfahren und Vorrichtung zum Heizen von langen Glassubstraten
DE3861800D1 (de) Verfahren und vorrichtung zum alignieren von ausruestungsteilen in flugzeugen.
DE3780288D1 (de) Beschichtungsvorrichtung und verfahren zum betrieb dieser vorrichtung.
DE3775886D1 (de) Vorrichtung zum greifen und setzen von bauteilen.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee