FR2555363B1 - Machine de report de composants pour circuits hybrides - Google Patents

Machine de report de composants pour circuits hybrides

Info

Publication number
FR2555363B1
FR2555363B1 FR8318379A FR8318379A FR2555363B1 FR 2555363 B1 FR2555363 B1 FR 2555363B1 FR 8318379 A FR8318379 A FR 8318379A FR 8318379 A FR8318379 A FR 8318379A FR 2555363 B1 FR2555363 B1 FR 2555363B1
Authority
FR
France
Prior art keywords
transfer machine
component transfer
hybrid circuits
hybrid
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8318379A
Other languages
English (en)
Other versions
FR2555363A1 (fr
Inventor
Rene Septfons
Jean Chenu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel CIT SA
Original Assignee
Alcatel CIT SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel CIT SA filed Critical Alcatel CIT SA
Priority to FR8318379A priority Critical patent/FR2555363B1/fr
Priority to GB08428371A priority patent/GB2149708B/en
Priority to US06/672,438 priority patent/US4603243A/en
Priority to JP59244322A priority patent/JPS6182971A/ja
Publication of FR2555363A1 publication Critical patent/FR2555363A1/fr
Application granted granted Critical
Publication of FR2555363B1 publication Critical patent/FR2555363B1/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR8318379A 1983-11-18 1983-11-18 Machine de report de composants pour circuits hybrides Expired FR2555363B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR8318379A FR2555363B1 (fr) 1983-11-18 1983-11-18 Machine de report de composants pour circuits hybrides
GB08428371A GB2149708B (en) 1983-11-18 1984-11-09 Fixing components to a substrate by remelting solder
US06/672,438 US4603243A (en) 1983-11-18 1984-11-16 Component fixing machine for hybrid circuits
JP59244322A JPS6182971A (ja) 1983-11-18 1984-11-19 ハイブリツド回路用部品搬送機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8318379A FR2555363B1 (fr) 1983-11-18 1983-11-18 Machine de report de composants pour circuits hybrides

Publications (2)

Publication Number Publication Date
FR2555363A1 FR2555363A1 (fr) 1985-05-24
FR2555363B1 true FR2555363B1 (fr) 1986-02-21

Family

ID=9294276

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8318379A Expired FR2555363B1 (fr) 1983-11-18 1983-11-18 Machine de report de composants pour circuits hybrides

Country Status (4)

Country Link
US (1) US4603243A (fr)
JP (1) JPS6182971A (fr)
FR (1) FR2555363B1 (fr)
GB (1) GB2149708B (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4776508A (en) * 1985-06-28 1988-10-11 Unit Design Inc. Electronic component lead tinning device
US4725716A (en) * 1986-02-10 1988-02-16 Northern Telecom Limited Infrared apparatus for infrared soldering components on circuit boards
DE3787658T2 (de) * 1986-02-13 1994-04-07 Digital Equipment Corp Reparaturvorrichtung und Reparaturverfahren für Leiterplatten mit Bauteilen in Oberflächenmontagetechnologie.
GB8917963D0 (en) * 1989-08-05 1989-09-20 Scras Apparatus for repeated automatic execution of a thermal cycle for treatment of biological samples
US5607009A (en) * 1993-01-28 1997-03-04 Applied Materials, Inc. Method of heating and cooling large area substrates and apparatus therefor
DE69429038T2 (de) * 1993-07-28 2002-03-21 Pe Corp Ny Norwalk Vorrichtung und Verfahren zur Nukleinsäurevervielfältigung
JP3800251B2 (ja) * 1995-10-02 2006-07-26 ソニー株式会社 半田付け装置および半田付け方法
US6050326A (en) * 1998-05-12 2000-04-18 International Business Machines Corporation Method and apparatus for cooling an electronic device
KR100479264B1 (ko) * 2002-11-01 2005-03-28 한국전자통신연구원 주기적 가열과 냉각을 통한 혼성화 방법 및 이를 사용하는폴리뉴클레오타이드 검출 장치
US6955215B2 (en) * 2004-03-09 2005-10-18 King Fahd University Of Petroleum And Minerals Hybrid cooling system and method for cooling electronic devices

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB950048A (en) * 1962-11-29 1964-02-19 Standard Telephones Cables Ltd Improvements in or relating to soldering tools
US3562481A (en) * 1969-04-29 1971-02-09 Laurice J West Substrate soldering system
US3590201A (en) * 1969-05-14 1971-06-29 Aeroquip Corp Photoelectric control systems for brazing tools
US3765475A (en) * 1971-06-04 1973-10-16 Iteck Corp Apparatus for soldering thick film substrates
JPS5551667B2 (fr) * 1972-06-10 1980-12-25
US4034180A (en) * 1972-06-10 1977-07-05 Kokusai Denshin Denwa Kabushiki Kaisha Method of continuously soldering small elements arranged generally in a line by a concentrated radiant energy source
IT981863B (it) * 1973-04-03 1974-10-10 Cie Italiana Montaggi Ind Spa Dispositivo per la trattenuta e lo spostamento controllato lungo il percorso di lavoro di utensi li saldanti
CH639580A5 (de) * 1979-01-23 1983-11-30 Karl Flury Loetanlage zum loeten von leiterplatten und verfahren zu deren betrieb.
GB2063134B (en) * 1979-11-08 1983-05-18 Ferrous Transformers Ltd Apparatus for linearly moving a tool
US4356384A (en) * 1980-03-03 1982-10-26 Arnon Gat Method and means for heat treating semiconductor material using high intensity CW lamps

Also Published As

Publication number Publication date
US4603243A (en) 1986-07-29
JPS6182971A (ja) 1986-04-26
GB2149708A (en) 1985-06-19
FR2555363A1 (fr) 1985-05-24
GB8428371D0 (en) 1984-12-19
GB2149708B (en) 1987-02-04

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Legal Events

Date Code Title Description
ST Notification of lapse