WO1998022998A1 - Electron beam pumped semiconductor laser screen and method of forming - Google Patents
Electron beam pumped semiconductor laser screen and method of forming Download PDFInfo
- Publication number
- WO1998022998A1 WO1998022998A1 PCT/US1997/021241 US9721241W WO9822998A1 WO 1998022998 A1 WO1998022998 A1 WO 1998022998A1 US 9721241 W US9721241 W US 9721241W WO 9822998 A1 WO9822998 A1 WO 9822998A1
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- WO
- WIPO (PCT)
- Prior art keywords
- electron beam
- semiconductor laser
- stop layer
- etch stop
- pumped semiconductor
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/0955—Processes or apparatus for excitation, e.g. pumping using pumping by high energy particles
- H01S3/0959—Processes or apparatus for excitation, e.g. pumping using pumping by high energy particles by an electron beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
Definitions
- the present invention relates generally to the field of lasers and more particularly to an electron beam pumped semiconductor laser screen and method of producing the electron beam pumped semiconductor laser screen.
- Electron Beam pumped Semiconductor Lasers are semiconductor lasers that use an electron beam instead of an electrical current to create a population inversion in the semiconductor laser.
- a typical EBSL contains a cathode ray tube that generates and accelerates electrons at a screen.
- the screen is a semiconductor material system similar to standard laser diodes.
- EBSLs have a wide variety of potential applications including; projection displays systems, environmental monitoring and high power lasers.
- Present EBSLs operating in the visible spectrum are made with laser screens using II-VI (i.e., materials from column 2 & 6 of the periodic table) bulk single crystal semiconductors.
- Bulk single crystal semiconductors as used herein means thick film crystals that are sliced form a larger piece of the same homogenous material.
- a method for creating an electron beam pumped semiconductor laser screen that overcomes these and other problems requires growing epitaxially an etch stop layer on a gallium arsenide (GaAs) substrate. Next a gain region is grown epitaxially on the etch stop layer. An output mirror is then formed over the gain region. The output mirror is bonded to a transparent support structure. Then the gallium arsenide substrate is etched. The etch stop layer is then etched. Finally, a back side mirror is formed on the gain region, where the etch stop layer was located.
- GaAs gallium arsenide
- FIG. 1 is a schematic drawing of a substrate, an etch stop layer and a gain region and represents a first step in an embodiment of a method of forming an Electron Beam pumped Semiconductor Laser (EBSL) screen according to the invention
- EBSL Electron Beam pumped Semiconductor Laser
- FIG. 2 is a schematic drawing of a second step in an embodiment of the method of forming an EBSL screen according to the invention
- FIG. 3 is a schematic drawing of a third step in an embodiment of the method of forming an EBSL screen according to the invention.
- FIG. 4 is a schematic drawing of a fourth step in an embodiment of the method of forming an EBSL screen according to the invention.
- FIG. 5 is a schematic drawing of a fifth step in an embodiment of the method of forming an EBSL screen according to the invention.
- FIG. 6 is a schematic drawing of an embodiment of an EBSL screen, having a single quantum well, according to the invention.
- FIG. 7 is a schematic drawing of an embodiment of an EBSL screen, having a plurality of quantum wells, according to the invention.
- FIG. 8 is a schematic drawing of an embodiment of an operating EBSL screen according to the invention.
- An electron beam pumped semiconductor laser (EBSL) screen having an indium gallium aluminum arsenide phosphide (InGaAlAsP) material system for the gain region can be designed to emit in the red region of the optical spectrum.
- the InGaAlAsP material system can be grown epitaxially and as a result does not suffer from the problems of the prior art.
- An etch stop layer 10 is epitaxially grown on a gallium arsenide (GaAs) substrate 12, as illustrated in FIG. 1.
- GaAs gallium arsenide
- a gain region 14 is then grown on the etch stop layer 10.
- the gain region is an InGaAlAsP material system and in this case epitaxial growth is used to form the gain region.
- a lattice matching layer is grown on the substrate 12 before the etch stop layer 10 is grown.
- the epitaxial growth can be performed using any of the growth technologies appropriate to the structure, including metal organic chemical vapor deposition (MOCVD) , molecular beam epitaxy, liquid phase epitaxy, or close spaced vapor transport.
- MOCVD metal organic chemical vapor deposition
- molecular beam epitaxy molecular beam epitaxy
- liquid phase epitaxy liquid phase epitaxy
- close spaced vapor transport close spaced vapor transport.
- the next step is to form an output mirror 16 on a first surface 18 of the active gain region 14.
- the output mirror 16 is formed by epitaxially growing a multi-layered optical output mirror.
- the output mirror 16 is formed by deposition of a plurality of dielectric films. The deposition of the dielectric films can be done using: thermal evaporation, sputtering, ion beam deposition, or electron beam deposition. As is well known in the art, the composition and thickness of the layers can be varied to yield the desired output mirror reflectivity.
- the third step shown in FIG. 3 is to bond the output mirror 16 to a transparent support structure (window, output window) 20.
- a transparent optical epoxy (optically transparent epoxy) 22 is used to bond the window 20 to the output mirror 16. In another embodiment the bonding is done with a low melting point glass or with wafer fusion technology.
- the window 20 is chosen to provide optical transparency to the light emitted by the EBSL, mechanical support, heat conduction from the active gain region 14 to a heatsink and to be chemically inert to any chemical processes that follow.
- Sapphire single crystalline AI2O3 t
- Sapphire crystal is used as the output window 20 in one embodiment .
- the next step, illustrated in FIG. 4, is to remove the substrate 12 by chemical etching.
- the etch stop layer is removed with further chemical etching in an etchant that does not etch the active layer materials.
- the etch stop layer 10 allows the substrate 12 and any lattice matching layers to be chemically dissolved in appropriate etching solutions. Such etchants are well known by those in the art.
- the next step, illustrated in FIG. 5, is to deposit a metallic mirror (back side mirror, input mirror, thin metallic film) 24 on a second surface 26 of the active gain region 14.
- the metal and thickness should be chosen for high reflectivity of the light emitted and low attenuation of the incident high energy electron beam.
- the metallic mirror 24 is made of aluminum (Al) or silver (Ag) with a thickness of lOOnm or less.
- This step completes a semiconductor screen (electron beam pumped semiconductor screen) 30.
- the semiconductor screen 30 is then integrated with a cathode ray tube to complete the EBSL.
- FIG. 6 shows another embodiment of the EBSL screen 30, wherein the active gain region includes a quantum well 32.
- the quantum well 32 provides for more efficient lasing.
- FIG. 7 Another embodiment of the EBSL screen 30 is shown in FIG. 7, where the active gain region includes a multiple, isolated, strained quantum well (MISQW) structure 34.
- MISQW is described in more detail in the patent application, application number 08/705732, entitled “Multiple, Isolated Strain Quantum Well Semiconductor Laser", filed on August 30, 1996, assigned to the same assignee as the present application, and hereby incorporated by reference.
- FIG. 8 is a schematic diagram of the EBSL.
- An electron beam 40 generated by a cathode ray tube for example, impinges on the back side mirror 24.
- the electron beam 40 results in carrier recombination in the EBSL screen 30.
- the carrier recombination process results in optical emission 42 that is amplified in the standard method for a laser.
- a red EBSL can be formed with an InGaAlAsP semiconductor screen.
- an MISQW gain region is used.
- the MISQW contains a plurality of quantum wells of A ⁇ 0.114 Ga 0.296 In 0.59 p each 60 to 120 angstroms thick and embedded in a background of Alg . i7gGao .331I.no .59P. Note that this structure has no arsenic (As) in the layers, and is a special case of the more general AlGalnAsP material. Arsenic containing layers could be incorporated for the substrate removal etching process, but are not actively involved in the laser emission.
- inventions include an EBSL screen formed of a GaAlInSbAs (gallium aluminum indium antimonide arsenide) alloy semiconductor. This alloy can be grown epitaxially on a GaAs substrate and therefor can contain quantum wells in the gain structure.
- GaAlInSbAs gallium aluminum indium antimonide arsenide
- Another embodiment uses a HgCdTe (mercury cadmium telluride) material system. This material system is grown epitaxially on a CdTe (cadmium telluride) substrate and may contain a quantum well structure.
- CdZnSeS cadmium zinc selenide sulfide
- CdSe cadmium zinc selenide sulfide
- ZnCdS zinc cadmium sulfide
- GaAlN gallium aluminum nitride
- the etch stop layer allows numerous semiconductor material systems to be formed for use as an EBSL screen, that otherwise would not be good candidates for an EBSL screen. Using this process it is possible to grow an InGaAlAsP semiconductor screen that lases in the red region of the optical spectrum.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU73041/98A AU7304198A (en) | 1996-11-19 | 1997-11-18 | Electron beam pumped semiconductor laser screen and method of forming |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US75205796A | 1996-11-19 | 1996-11-19 | |
US08/752,057 | 1996-11-19 |
Publications (1)
Publication Number | Publication Date |
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WO1998022998A1 true WO1998022998A1 (en) | 1998-05-28 |
Family
ID=25024664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US1997/021241 WO1998022998A1 (en) | 1996-11-19 | 1997-11-18 | Electron beam pumped semiconductor laser screen and method of forming |
Country Status (2)
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AU (1) | AU7304198A (en) |
WO (1) | WO1998022998A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6757312B2 (en) * | 2000-12-05 | 2004-06-29 | Robert Rex Rice | Electron beam pumped semiconductor laser screen and associated fabrication method |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4539687A (en) * | 1982-12-27 | 1985-09-03 | At&T Bell Laboratories | Semiconductor laser CRT |
US4881236A (en) * | 1988-04-22 | 1989-11-14 | University Of New Mexico | Wavelength-resonant surface-emitting semiconductor laser |
US5131002A (en) * | 1991-02-12 | 1992-07-14 | Massachusetts Institute Of Technology | External cavity semiconductor laser system |
US5313483A (en) * | 1991-12-26 | 1994-05-17 | Principia Optics, Inc. | Laser screen for a cathode-ray tube and method for making same |
US5317583A (en) * | 1991-12-26 | 1994-05-31 | Principia Optics Incorporated | Semiconductor laser screen of a cathode-ray tube |
US5349596A (en) * | 1992-04-17 | 1994-09-20 | Commissariat A L'energie Atomique | Asymmetrical semiconductor heterostructure laser cavity and laser equipped with said cavity |
US5416044A (en) * | 1993-03-12 | 1995-05-16 | Matsushita Electric Industrial Co., Ltd. | Method for producing a surface-emitting laser |
US5461637A (en) * | 1994-03-16 | 1995-10-24 | Micracor, Inc. | High brightness, vertical cavity semiconductor lasers |
US5677923A (en) * | 1996-01-11 | 1997-10-14 | Mcdonnell Douglas Corporation | Vertical cavity electron beam pumped semiconductor lasers and methods |
US5687185A (en) * | 1992-12-28 | 1997-11-11 | Principia Optics, Inc. | Laser cathode-ray tube |
-
1997
- 1997-11-18 WO PCT/US1997/021241 patent/WO1998022998A1/en active Application Filing
- 1997-11-18 AU AU73041/98A patent/AU7304198A/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4539687A (en) * | 1982-12-27 | 1985-09-03 | At&T Bell Laboratories | Semiconductor laser CRT |
US4881236A (en) * | 1988-04-22 | 1989-11-14 | University Of New Mexico | Wavelength-resonant surface-emitting semiconductor laser |
US5131002A (en) * | 1991-02-12 | 1992-07-14 | Massachusetts Institute Of Technology | External cavity semiconductor laser system |
US5313483A (en) * | 1991-12-26 | 1994-05-17 | Principia Optics, Inc. | Laser screen for a cathode-ray tube and method for making same |
US5317583A (en) * | 1991-12-26 | 1994-05-31 | Principia Optics Incorporated | Semiconductor laser screen of a cathode-ray tube |
US5349596A (en) * | 1992-04-17 | 1994-09-20 | Commissariat A L'energie Atomique | Asymmetrical semiconductor heterostructure laser cavity and laser equipped with said cavity |
US5687185A (en) * | 1992-12-28 | 1997-11-11 | Principia Optics, Inc. | Laser cathode-ray tube |
US5416044A (en) * | 1993-03-12 | 1995-05-16 | Matsushita Electric Industrial Co., Ltd. | Method for producing a surface-emitting laser |
US5461637A (en) * | 1994-03-16 | 1995-10-24 | Micracor, Inc. | High brightness, vertical cavity semiconductor lasers |
US5677923A (en) * | 1996-01-11 | 1997-10-14 | Mcdonnell Douglas Corporation | Vertical cavity electron beam pumped semiconductor lasers and methods |
Non-Patent Citations (3)
Title |
---|
APPL. PHYS. LETT., April 1996, Vol. 68, No. 15, SINK R.K. et al., "Cleaved GaN Facets by Wafer Fusion of GaN to InP", pages 2147-2149. * |
JOURNAL OF CRYSTAL GROWTH, 1994, Vol. 145, SCHNEIDER R.P. et al., "Metalorganic Vapor Phase Epitaxial Growth of Red and Infrared Vertical-Cavity Surface-Emitting Laser Diodes", pages 838-845. * |
JPN. J. APPL. PHYS., January 1996, Vol. 35, ZHAO R. et al., "A Comparison of the Selective Etching Characteristics of Conventional and Low-Temperature-Grown GaAs Over AlAs by Various Etching Solutions", pages 22-25. * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6757312B2 (en) * | 2000-12-05 | 2004-06-29 | Robert Rex Rice | Electron beam pumped semiconductor laser screen and associated fabrication method |
Also Published As
Publication number | Publication date |
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AU7304198A (en) | 1998-06-10 |
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