WO1998019845A3 - Broche ejectrice etanche - Google Patents

Broche ejectrice etanche Download PDF

Info

Publication number
WO1998019845A3
WO1998019845A3 PCT/NL1997/000603 NL9700603W WO9819845A3 WO 1998019845 A3 WO1998019845 A3 WO 1998019845A3 NL 9700603 W NL9700603 W NL 9700603W WO 9819845 A3 WO9819845 A3 WO 9819845A3
Authority
WO
WIPO (PCT)
Prior art keywords
ejector pin
mould
sealing
opening
ejectorpin
Prior art date
Application number
PCT/NL1997/000603
Other languages
English (en)
Other versions
WO1998019845A2 (fr
Inventor
Johannes Lambertus Ge Venrooij
Marcel Gerardus Anton Tomassen
Original Assignee
Fico Bv
Johannes Lambertus Ge Venrooij
Marcel Gerardus Anton Tomassen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv, Johannes Lambertus Ge Venrooij, Marcel Gerardus Anton Tomassen filed Critical Fico Bv
Priority to AU58838/98A priority Critical patent/AU5883898A/en
Priority to EP97954501A priority patent/EP0923444B1/fr
Priority to US09/269,984 priority patent/US6179599B1/en
Priority to DE1997627685 priority patent/DE69727685T2/de
Publication of WO1998019845A2 publication Critical patent/WO1998019845A2/fr
Priority to HK99106012A priority patent/HK1021347A1/xx
Publication of WO1998019845A3 publication Critical patent/WO1998019845A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B29C45/401—Ejector pin constructions or mountings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B29C45/401—Ejector pin constructions or mountings
    • B29C2045/4015—Ejector pins provided with sealing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C2045/4094—Ejectors located on the fixed mould half
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/047—Seal ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne une broche éjectrice logée dans une partie de moule conçue pour encapsuler des composants électroniques montés sur un support. Cette broche éjectrice sensiblement cylindrique présente une paroi latérale qui comporte au moins un enfoncement à côté de l'extrémité qui entre en contact avec la pièce destinée à être éjectée. L'invention concerne également une partie de moule qui présente un orifice conçu pour guider une broche éjectrice, la paroi du dit orifice présentant au moins un enfoncement. L'invention concerne enfin un moule conçu pour encapsuler des composants électroniques, ainsi qu'un procédé pour étancher un espacement situé entre une broche éjectrice et un orifice dans une partie de moule.
PCT/NL1997/000603 1996-11-06 1997-11-04 Broche ejectrice etanche WO1998019845A2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU58838/98A AU5883898A (en) 1996-11-06 1997-11-04 Sealing ejectorpin
EP97954501A EP0923444B1 (fr) 1996-11-06 1997-11-04 Broche ejectrice etanche
US09/269,984 US6179599B1 (en) 1996-11-06 1997-11-04 Sealing ejector pin
DE1997627685 DE69727685T2 (de) 1996-11-06 1997-11-04 Dichtender auswurfzapfen
HK99106012A HK1021347A1 (en) 1996-11-06 1999-12-21 Sealing ejector pin

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1004460A NL1004460C2 (nl) 1996-11-06 1996-11-06 Ejectorpen, vormdeel en mal voor het omhullen van electronische componenten alsmede een werkwijze voor het afdichten van een tussenruimte.
NL1004460 1996-11-06

Publications (2)

Publication Number Publication Date
WO1998019845A2 WO1998019845A2 (fr) 1998-05-14
WO1998019845A3 true WO1998019845A3 (fr) 2002-10-03

Family

ID=19763817

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL1997/000603 WO1998019845A2 (fr) 1996-11-06 1997-11-04 Broche ejectrice etanche

Country Status (8)

Country Link
US (1) US6179599B1 (fr)
EP (1) EP0923444B1 (fr)
AU (1) AU5883898A (fr)
DE (1) DE69727685T2 (fr)
HK (1) HK1021347A1 (fr)
NL (1) NL1004460C2 (fr)
TW (1) TW407120B (fr)
WO (1) WO1998019845A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2791596B1 (fr) * 1999-04-02 2001-04-27 Renault Dispositif d'ejection pour moule avec injection de resine
GB2351930B (en) * 1999-07-15 2003-09-24 Sternford Ltd A method and a mould for moulding an article
JP3784597B2 (ja) * 1999-12-27 2006-06-14 沖電気工業株式会社 封止樹脂及び樹脂封止型半導体装置
JP3394516B2 (ja) * 2000-10-06 2003-04-07 エヌイーシーセミコンダクターズ九州株式会社 樹脂封止金型
SG103364A1 (en) * 2002-10-11 2004-04-29 Tung Jung Chen Mold article ejecting device used for an injection molding apparatus
US7300268B2 (en) * 2005-12-15 2007-11-27 Lear Corporation Low-density part injection molding system
US20080057528A1 (en) * 2006-08-30 2008-03-06 Kimberly-Clark Worldwide, Inc. Detection of hydrogen peroxide released by enzyme-catalyzed oxidation of an analyte
JP2016013675A (ja) * 2014-07-03 2016-01-28 株式会社小糸製作所 光学部品の製造方法、製造装置および光学部品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0229314A (ja) * 1988-07-19 1990-01-31 Fujitsu Miyagi Electron:Kk モールド金型
JPH03258519A (ja) * 1990-03-08 1991-11-18 Toshiba Corp 成形金型
JPH0596583A (ja) * 1991-10-11 1993-04-20 Inoac Corp ゴム用射出成形金型の成形品突き出し機構
WO1995031004A1 (fr) * 1994-05-09 1995-11-16 Fico B.V. Appareil pour enrober de matiere plastique une grille de connexion a puces

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3897929A (en) * 1974-08-12 1975-08-05 Nat Tool And Manufacturing Co Recessed sprue bushing for a three-plate mold set
JP2524955B2 (ja) * 1993-04-22 1996-08-14 トーワ株式会社 電子部品の樹脂封止成形方法及び装置
JP2943637B2 (ja) * 1994-11-25 1999-08-30 住友電装株式会社 管状弾性品の離型装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0229314A (ja) * 1988-07-19 1990-01-31 Fujitsu Miyagi Electron:Kk モールド金型
JPH03258519A (ja) * 1990-03-08 1991-11-18 Toshiba Corp 成形金型
JPH0596583A (ja) * 1991-10-11 1993-04-20 Inoac Corp ゴム用射出成形金型の成形品突き出し機構
WO1995031004A1 (fr) * 1994-05-09 1995-11-16 Fico B.V. Appareil pour enrober de matiere plastique une grille de connexion a puces

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 9320, Derwent World Patents Index; Class A32, AN 93-163923 *
PATENT ABSTRACTS OF JAPAN vol. 14, no. 174 (M - 959)<4117> 5 April 1990 (1990-04-05) *
PATENT ABSTRACTS OF JAPAN vol. 16, no. 62 (M - 1211) 17 February 1992 (1992-02-17) *
PATENT ABSTRACTS OF JAPAN vol. 17, no. 433 (M - 1461) 11 August 1993 (1993-08-11) *

Also Published As

Publication number Publication date
EP0923444A3 (fr) 2002-11-20
AU5883898A (en) 1998-05-29
TW407120B (en) 2000-10-01
NL1004460C2 (nl) 1998-05-08
WO1998019845A2 (fr) 1998-05-14
DE69727685T2 (de) 2005-01-13
DE69727685D1 (de) 2004-03-25
EP0923444A2 (fr) 1999-06-23
EP0923444B1 (fr) 2004-02-18
US6179599B1 (en) 2001-01-30
HK1021347A1 (en) 2000-06-09

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