WO1997029379A1

WO1997029379A1 - Carrier for receiving and holding a test base for integrated circuits

Info

Publication number: WO1997029379A1
Application number: PCT/EP1997/000540
Authority: WO
Inventors: Hans-Joachim Kremer
Original assignee: Mci Computer Gmbh
Priority date: 1996-02-09
Filing date: 1997-02-06
Publication date: 1997-08-14

Abstract

The invention concerns a carrier for receiving and holding a test base (28), the carrier being provided with a carrier plate (52) and a plurality of bores (54) which penetrate the carrier plate. A plurality of conductors (44) lead to the carrier plate (52) and a plurality of jacks (24) for receiving and holding test base connection pins (26) extend from one side (58) of the carrier plate (52). The bores (54) accommodating the jacks (24) are arranged in a manner corresponding to the positions of the test base connections (26). The conductors (42) adjoin the jacks in the axial extension thereof or are electrically connected thereto.

Description

Carrier for holding and holding a test socket for integrated circuits

In the manufacture and in particular in the mass production of highly or highly integrated electronic circuits in the form of so-called semiconductor modules or ICs, testing of such electronic circuits is taking place due to the increased competition on the market and, moreover, due to the changing customer and customer awareness , Semiconductor modules or ICs a widening space.

Especially in the mass production of electronic components, a classification into different quality or specification categories based on certain test criteria is desirable in order to give the customer or customer certain batches of equivalent components, i. H. To be able to offer components with very similar properties tailored to the individual application, and in order to be able to achieve an optimal price-performance ratio.

Such tests or final checks after production are often carried out using test electronics, with several semiconductor modules, ICs or components being tested simultaneously using this test electronics and with test results for classifying the individual properties of each individual component, semiconductor module or IC be used.

Several semiconductor modules or ICs in the same orientation and position are combined by one Test board included, which often consists essentially of a plastic plate with corresponding recesses for receiving the semiconductor modules and ICs. These test boards equipped in this way are then fed to the test electronics in a type of assembly line operation which has a multiplicity of test bases of the same type. These test bases in turn have elements for tapping each individual contact of the semiconductor module or IC. In order to establish an optimal contact, the test board carrying the electronic components is brought close to the test sock 1, a semiconductor module or IC and a test socket directly opposing each other. Thereafter, the semiconductor modules or ICs, which are easily movable in corresponding recesses in the test board, are pressed out of the test board into the test socket by pressure elements. This happens simultaneously for all semiconductor modules or ICs of the respective test board. The respective test program is then processed for all semiconductor modules, and the respective result for each individual semiconductor module leads to its sorting out into certain quality and specification categories.

With the increasing complexity of the integrated circuits, the number of the respective connections, which such a semiconductor module or IC has, also increases. Since all connections of the integrated circuit must be tapped simultaneously by the test base during testing and this tap must be forwarded to the respective test electronics, each test base must also have a corresponding number of connecting conductors to the test electronics. This has the result that the number of semiconductor modules or ICs that can be simultaneously recorded on a test board and thus the number of simultaneously testable semiconductor modules or ICs is not determined and limited by their size, but by the size and arrangement of the carriers for the test socket. With a known test arrangement for semiconductor modules or ICs, for example, it is only possible to arrange 2 rows with 8 semiconductor modules each in a test board and thus to test only 16 semiconductor modules simultaneously at the same time.

Since the test procedure for all the semiconductor modules in the test board is carried out essentially simultaneously, an increase in the number of semiconductor modules which can be tested simultaneously would result in an enormous saving of time, which would reduce production costs on the one hand and also at the same cost allows more extensive testing.

The invention has for its object to provide a carrier for receiving and holding a test socket for integrated circuits, on which a large number of test sockets can be arranged in a space-saving manner.

The object is achieved according to the invention by a carrier for receiving and holding a test base, which is provided with: a carrier plate to which a plurality of electrical conductors can be connected, and a plurality of bores penetrating the carrier plate, one extending through the bores

Side of the carrier plate forth several receptacles for receiving and holding connector pins Extend test socket and the bores receiving the receptacles are arranged according to the positions of the test socket connector pins, characterized in that - the conductors are connected to the receptacles in an axial extension or are electrically connected to them.

It is therefore provided according to the invention that the conductors leading to the (through) bores, via which the test base is electrically connected to the test electronics, are electrically connected to the latter in an essentially axial extension. Generally speaking, the conductors therefore lead to the holes on the side of the carrier plate facing away from the test base, in order to be electrically connected directly to the plug sleeves or indirectly (via intermediate conductor layers) to the plug sleeves. The phrase "in essentially axial extension" is intended to express that the lines in the bores, in the area of the bores, end at the plug-in sleeves and / or immediately adjacent to the plug-in sleeves. In the case of the carrier according to the invention, its thickness is of secondary importance in relation to the axial extent of the plug-in sleeves and the (through) bores. In particular, it can be provided that the plug sleeves protrude beyond the back of the carrier plate facing the conductors in order to be contacted with the conductors in this protruding area. If the (through) bores are designed as vias, the lines can be connected to the electrically conductive inner coating or inner lining of the bores, these inner coatings or linings being electrically connected to the plug sleeves. In the carrier according to the invention it can be provided that the thickness of the carrier plate of the carrier is selected so that it exceeds the length of the plug sleeves and also the length of the connections of the test base. This takes place in such a way that in a bore in which a plug-in sleeve is accommodated there is still enough space in the bore which serves as a receiving region for receiving a conductor. Each receptacle and the associated connection of an associated conductor are then arranged together in a bore in the carrier plate.

In particular, it is advantageous that the respective receptacles and conductors accommodated together in a bore are arranged with their end faces opposite one another, so that their longitudinal axes are quasi in axial extension with one another.

The contact between the plug-in sleeve and the connection assigned to it is brought about by direct contact. However, it is particularly easy to create an additional device which both fix the conductors and the receptacles and at the same time make the electrical contacts. This can e.g. B. can be a detachable, mechanical plug connection or common clamping device introduced into the bore. However, it is particularly simple if the plug sleeves and / or the corresponding conductors are kept conductive by a solder or an adhesive and are connected to one another.

The relative arrangement according to the invention of the receptacles and the conductor of the electronics associated therewith in extension with one another results in relation to the lateral extension of the support of the test base a significant space saving, so that the number of test bases per unit area increases.

This is further reinforced by bores, which each receive and hold the shielding conductor assigned to a conductor, are arranged adjacent to the bores which receive the plug sleeves and which receive and hold the respectively shielded conductors. As a result, the lateral extent that is required on the carrier in order to accommodate all shielding conductors is particularly small. Since the shielding conductors are equivalent in many cases, there is a further saving in space, in that at least some of these, in particular, equivalent shielding conductors are arranged in a row and in particular are formed in a conductive connection with one another, because then these Ab ¬ shield conductors are brought particularly close to each other, because there is no need to fear mutual interference due to the same potential applied to them.

In order to be able to fix the carrier of the test base particularly easily on a plate carrying the test electronics or a carrier board, provision is made for fixing bores which are offset inwards from the edge of the carrier plate to receive a connecting means for fixing the carrier to the corresponding carrier board . These fixing means can be rivet pins, screws or the like. In addition, there is a particularly dense and space-saving arrangement of the carriers on a carrier board if semicircular edge recesses are provided on the edges of the respective carrier plates for receiving connecting means for jointly fixing adjacent carriers on a carrier board, because then the respective carrier plates on the carrier board are brought as close as possible to one another, and only a small number of connecting means, in the form of rivets or screws, is necessary in each case because only two connecting means fix two adjacent carrier plates together on the carrier board become.

In order to make the connection of the plug sleeves to the respective conductors and the formation of the conductive connection between them as simple and safe as possible, it is provided to give the bores a specific shape. A cylindrical bore is particularly simple. However, it is particularly advantageous to form a conical bore, in particular the area which receives the plug sleeve in each case has a larger diameter.

Furthermore, it is advantageous to line the bores receiving the plug sleeves on the inside with a conductive layer or with a conductive sleeve, because then a particularly secure electrical contact between the then inserted push-in sleeve and the conductor assigned to it the test electronics is effected.

The invention and in particular its advantages over the prior art are explained in more detail below with the aid of a schematic drawing. In detail show:

1 is a sectional side view of a base support, as is known from the prior art, 2 shows a top view of a base support, as is known from the prior art,

3 shows a sectional side view of a carrier according to the invention for receiving and holding a test base,

4 shows a plan view from above of a carrier according to the invention for receiving and holding a

Test socket, and

5 shows a sectional side view of a carrier according to the invention in accordance with a variant.

Fig. 1 is a sectional side view of a base support 10 ', as is known from the prior art. The base support 10 'consists of a support plate 12 with an upper side 14 and a lower side 16. In this support plate 12 there are a large number of different bores 18, 20 and 22, here designed as cylindrical bores perpendicular to the sides 16 and 14, appropriate. The carrier plate 12 from the prior art is designed as a circuit board. Plug-in sleeves 24 are introduced into the bores 18, through which connecting pins 26 of a test base 28 can be received and fixed. The plug sleeves 24 penetrate the holes 18 assigned to them and thus the support plate 12 completely, so that their ends, when they are inserted from the underside 16 of the support plate 12, protrude on the upper side 14 thereof.

The test socket 28 has a receptacle 30 into and out of which an IC component 32 can be inserted and then removed. The test socket 28 is with contact tongues 34 are provided, which are connected to the connecting pins 26 and serve to contact the legs 36 of the IC component 32. Several IC components are arranged in receiving recesses 38 of a plate-shaped IC carrier body 40 and are inserted into the test sockets 28 assigned to the receiving recesses 38 by means of a mechanism and removed from the test sockets after testing.

The bores 20 receive the signal conductors 42 of the lines 44 of the test electronics. The other bores 22 receive the ground or shield conductor 46 of the lines 44 of the test electronics.

FIG. 2 shows this carrier 10 'known from the prior art for a test socket 28 in a top view of its upper side 14. The bores 18 for the plug sleeves 24 for receiving the plug contacts 26 of the test socket 28, which for the rest are dashed in outline are shown, are arranged in two rows laterally to the test base 28 and offset to a gap and by means of contact points applied on the upper side 14 of the carrier plate 12 via conductor tracks 48 which are also laterally, in the drawing to the right or to the left of the bores 18 extend starting, connected with bores 20 and corresponding contact points provided on the upper side 14 of the carrier plate 12. As already shown in FIG. 1, the signal conductors 42 of the lines 44 of the test electronics are inserted and fixed into these bores 20 with the corresponding contact points.

The holes are laterally offset outwards

22, also provided with contact points on the upper side 14 of the carrier plate 12, for receiving the respective ground or shield connections 46 assigned to the signal conductor 42.

Holes 50 for receiving a connecting means are provided for fixing this known carrier 10 ′ to the carrier board.

3 now shows, in a partially sectioned side view, an exemplary embodiment of a carrier 10 according to the invention for receiving and holding a test base 28. As far as the individual parts of the carrier 10 correspond to or correspond to those of the carrier 10 ', they are with the provided with the same reference numerals.

The carrier plate 52 has first bores 54 and second bores 56, which penetrate the carrier plate 52 from its underside 58 towards its top 60, and which in this exemplary embodiment are shown as cylindrical bores which are made perpendicular to the top 60 of the carrier plate 52.

In the first bores 54 from the underside 58 of the support plate 52, receptacles 24 are inserted for receiving the connecting pins 26 of a test socket 28.

As can be seen in FIG. 3, in the first bores 54, after the plug-in sleeves 24 have been completely inserted, there is still a receiving space 62 extending up to the top 60 of the carrier plate 52, so that the plug-in sleeves 24 are the first bores 54 of the carrier ¬ Do not completely penetrate plate 52. These receiving areas are used to receive the signal conductors 42 of the shielded line 44 of the test electronics, so that the plug contact 26 of the test base 28, the assigned socket 24 and the associated signal conductor 42 are arranged in an axial extension. As a result, the lateral extent, in particular by avoiding the conductor tracks 48 shown in FIG. 2 for the prior art, is very severely limited, which leads to a substantial saving in space.

The second bores 56 in turn serve to receive the assigned shielding conductors 46 of the lines 44 of the test electronics.

The space saving is particularly clear in relation to the lateral expansion of the carrier 10 according to the invention when viewing FIG. 4, which shows a top view of the top 60 of the carrier 10 according to the invention.

Here too, the first bores 54 receiving the sleeves 24 are arranged laterally in two rows and offset to a gap. However, in contrast to the prior art as described in FIGS. 1 and 2, firstly no additional bores 20 for receiving the signal conductors 42 and secondly also no connecting lines 48 on the carrier 10 are necessary.

As was shown in FIG. 3, the signal conductors 42 of the lines 44 of the test electronics are simply inserted into the bores 54 from the top 60 of the carrier plate 52 and by means of a suitable fixing means in the form of a mechanical connector, a conductive adhesive or one Lots fixed.

The shielding conductors 46 assigned to the signal conductors 42 are likewise inserted into the second bores 56 from the top 60 of the carrier plate 52 and through an appropriate fixation means attached. These second bores 56 are arranged so as to be conductively connected to one another in a row by applying corresponding conductive marks on the upper side 60 of the carrier plate 52, and in each case as closely as possible adjacent to the first bores 54 through which the plug sleeves 24 and the Signal conductor 42 of the lines 44 of the test electronics are added.

Furthermore, bores 50 or recesses 64 are provided for fixing the carrier plates on a carrier board, it being particularly advantageous to use two girders 10 closely adjacent to each other via the recesses 64 with a connecting means for receiving and holding the test base 28 on the Fix test board.

5 shows another exemplary embodiment of a carrier 10 ″ according to the invention which, apart from the thickness of its carrier plate 52, is identical to the carrier 10 and in this respect provided with the same reference numerals. The thickness of the carrier plate 52 is selected such that the Plug-in sleeves 24 protrude beyond the upper side 60 facing away from the test socket 28. The signal conductors 42 are connected to the plug-in sleeves 24.

Claims

EXPECTATIONS

1. Carrier for receiving and holding a test base for integrated circuits, with a carrier plate (52) to which a plurality of electrical conductors (42) can be connected, and a plurality of bores (54) penetrating the carrier plate (52), whereby through the Bores (54) extend from one side (58) of the carrier plate (52) a plurality of plug-in sleeves (24) for receiving and holding connecting pins (26) of a test base which receive the plug-in sleeves (24) in the bores (54) Arranged in accordance with the positions of the test socket connecting pins (26) are characterized in that the conductors (44) are connected to the plug sleeves (24) in an axial extension thereof or are electrically connected to them.

2. Carrier according to claim 1, characterized in that the receptacles (24) on the first side (58) of the carrier plate (52) protrude and that the Lei¬ ter (44) in this protruding area are electrically connected to the receptacles (24) .

3. Carrier according to claim 1, characterized in that the thickness of the carrier plate (52) is greater than the axial length of the receptacles (24) or the axial length of the test socket connecting pins (26), such that there is a hole in a (54) inserted socket (24) forms a receiving area for receiving a conductor (42), and that each socket (24) and its associated Nete conductor (42) together from different opposite sides (58, 60) of the carrier plate (52) in a bore (54) of the carrier plate (52) can be received and held in this.

Carrier according to claim 3, characterized in that the bores (54) are designed as plated-through holes with which the plug sleeves (24) and the conductors (42) are electrically connected.

Carrier according to one of claims 1 to 4, characterized in that the respective receptacles (24) and conductors (42) received together in a bore (54) are arranged with their end faces opposite one another in axial extension to one another.

Carrier according to one of the preceding claims, characterized in that the conductors (42) are shielded by shielding conductors (46) and in that further bores (56) or connecting pads are provided in or on the carrier plate (52) with which the shielding conductors (46) are connected and are in particular adjacent to the holes (54) to which the respective conductor (42) leads.

Carrier according to one of the preceding claims, characterized in that at least some of the shielding conductors (46) are arranged in series and in particular in conductive connection with one another.

Carrier according to one of the preceding claims, characterized in that the plug sleeves (24) and / or the conductors (42) are connected by a common one Clamping device or by solder or by an adhesive can be connected to one another in the bores (54) and / or can be held.

9. Carrier according to one of the preceding claims, characterized in that on the carrier plate (52), preferably in the edge region, Fixier¬ bores (50) for receiving a connection means for fixing the carrier plate (52) are provided on a carrier board.

10. Carrier according to one of claims 1 to 9, characterized in that the carrier plate (52) semi-circular edge recesses (64) for receiving a connecting means for jointly fixing adjacent carrier plates (52) are provided on a Träger¬ board.

11. Carrier according to one of the preceding claims, characterized in that the bores (54; 56) are conical or cylindrical.

12. Carrier according to one of the preceding claims, characterized in that the bores (54; 56) are lined on the inside with a conductive layer or with a sleeve.