WO1997026616A3 - Ebauche de carte a puce - Google Patents

Ebauche de carte a puce Download PDF

Info

Publication number
WO1997026616A3
WO1997026616A3 PCT/DE1997/000047 DE9700047W WO9726616A3 WO 1997026616 A3 WO1997026616 A3 WO 1997026616A3 DE 9700047 W DE9700047 W DE 9700047W WO 9726616 A3 WO9726616 A3 WO 9726616A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip
card blank
recess
central zone
card
Prior art date
Application number
PCT/DE1997/000047
Other languages
German (de)
English (en)
Other versions
WO1997026616A2 (fr
Inventor
Erich Hopf
Detlef Houdeau
Peter Stampka
Original Assignee
Siemens Ag
Erich Hopf
Detlef Houdeau
Peter Stampka
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Erich Hopf, Detlef Houdeau, Peter Stampka filed Critical Siemens Ag
Priority to JP9525589A priority Critical patent/JPH11502967A/ja
Priority to RU98115309A priority patent/RU2143741C1/ru
Priority to EP97914052A priority patent/EP0875041A2/fr
Publication of WO1997026616A2 publication Critical patent/WO1997026616A2/fr
Publication of WO1997026616A3 publication Critical patent/WO1997026616A3/fr

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Ebauche de carte à puce (1) présentant un évidement (10) destiné à loger un module puce (30), caractérisé en ce qu'il est prévu, à l'intérieur de l'évidement, un dispositif de retenue entourant entièrement ou partiellement la zone centrale de l'évidement et empêchant un adhésif de se répandre dans ladite zone centrale.
PCT/DE1997/000047 1996-01-16 1997-01-13 Ebauche de carte a puce WO1997026616A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP9525589A JPH11502967A (ja) 1996-01-16 1997-01-13 チップカード
RU98115309A RU2143741C1 (ru) 1996-01-16 1997-01-13 Корпус карточки с встроенным микропроцессором
EP97914052A EP0875041A2 (fr) 1996-01-16 1997-01-13 Ebauche de carte a puce

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19601389A DE19601389A1 (de) 1996-01-16 1996-01-16 Chipkartenkörper
DE19601389.5 1996-01-16

Publications (2)

Publication Number Publication Date
WO1997026616A2 WO1997026616A2 (fr) 1997-07-24
WO1997026616A3 true WO1997026616A3 (fr) 1997-09-04

Family

ID=7782896

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/000047 WO1997026616A2 (fr) 1996-01-16 1997-01-13 Ebauche de carte a puce

Country Status (7)

Country Link
EP (1) EP0875041A2 (fr)
JP (1) JPH11502967A (fr)
KR (1) KR19990077292A (fr)
CN (1) CN1213448A (fr)
DE (1) DE19601389A1 (fr)
RU (1) RU2143741C1 (fr)
WO (1) WO1997026616A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10006515C5 (de) * 2000-02-15 2004-09-16 Datacard Corp., Minnetonka Verfahren zum Einbau von Chips in Kartenkörper
DE10006514C5 (de) * 2000-02-15 2004-08-12 Datacard Corp., Minnetonka Verfahren zum Einbau von Chips in Kartenkörper
DE10139395A1 (de) 2001-08-10 2003-03-06 Infineon Technologies Ag Kontaktierung von Halbleiterchips in Chipkarten
DE102008053368A1 (de) * 2008-10-27 2010-04-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines tragbaren Datenträgers und tragbarer Datenträger
SI2341471T1 (sl) 2009-12-28 2013-06-28 Nagraid S.A. Postopek za izdelavo elektronskih kartic
TW201128756A (en) * 2010-02-02 2011-08-16 Forward Electronics Co Ltd Semiconductor package structure
CN102467677B (zh) * 2010-11-09 2015-09-30 珠海市金邦达保密卡有限公司 防伪造ic卡的生产设备和生产方法
JP6923293B2 (ja) * 2015-09-24 2021-08-18 三菱ケミカル株式会社 微細凹凸構造体および接合体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0197847A1 (fr) * 1985-03-28 1986-10-15 Schlumberger Industries Procédé de fabrication de cartes à mémoire électronique et cartes obtenues suivant ledit procédé
EP0334733A1 (fr) * 1988-03-22 1989-09-27 Schlumberger Industries Procédé de réalisation d'une carte à mémoire électronique et carte telle qu'obtenue par la mise en oeuvre dudit procédé

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9110057U1 (de) * 1991-08-14 1992-02-20 Orga Kartensysteme GmbH, 6072 Dreieich Datenträgerkarte mit eingeklebtem Schaltkreisträger
JPH0885285A (ja) * 1994-07-21 1996-04-02 Hitachi Maxell Ltd セキュリティカード用基板の製造方法、およびセキュリティカード用基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0197847A1 (fr) * 1985-03-28 1986-10-15 Schlumberger Industries Procédé de fabrication de cartes à mémoire électronique et cartes obtenues suivant ledit procédé
EP0334733A1 (fr) * 1988-03-22 1989-09-27 Schlumberger Industries Procédé de réalisation d'une carte à mémoire électronique et carte telle qu'obtenue par la mise en oeuvre dudit procédé

Also Published As

Publication number Publication date
EP0875041A2 (fr) 1998-11-04
KR19990077292A (ko) 1999-10-25
WO1997026616A2 (fr) 1997-07-24
CN1213448A (zh) 1999-04-07
JPH11502967A (ja) 1999-03-09
DE19601389A1 (de) 1997-07-24
RU2143741C1 (ru) 1999-12-27

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