WO1997015837A2 - Flexibly suspended heat exchange head for a dut - Google Patents
Flexibly suspended heat exchange head for a dut Download PDFInfo
- Publication number
- WO1997015837A2 WO1997015837A2 PCT/US1996/016930 US9616930W WO9715837A2 WO 1997015837 A2 WO1997015837 A2 WO 1997015837A2 US 9616930 W US9616930 W US 9616930W WO 9715837 A2 WO9715837 A2 WO 9715837A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat exchange
- dut
- module
- plate
- thermoconductive
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
Definitions
- the present invention relates broadly to the field of IC or chip manufacture and use and particularly to a device for precisely controlling and measuring the temperature of a DUT.
- chips typically undergo three separate test cycles: (1) in-process testing, such as continuous monitoring of sheets resistivities, junction depths, and other pertinent device parameters, such as current gain and voltage breakdown; (2) a preliminary electrical testing called burn-in; and (3) a detailed final testing for reliability and performance to grade or sort the chips.
- in-process testing such as continuous monitoring of sheets resistivities, junction depths, and other pertinent device parameters, such as current gain and voltage breakdown
- burn-in a preliminary electrical testing called burn-in
- the present invention relates to improvements in the last type of testing.
- each chip After burn-in, it is conventional for the chips to undergo a number of functional tests to evaluate their performance. One by one, each chip is subjected to a series of long and short functional tests. The number and complexity of these functional tests varies from chip maker to chip maker. Long functional testing of digital memory chips generally involves the pattern testing of each chip on an individual basis. Commonly used routines are checkerboard patterns of Is and Os or floating of a 1 or 0 from cell to cell while the adjacent cells are maintained in the opposite state. For larger memories, the generation of these test patterns requires a larger number of functional tests. Generally, the time required for adequate pattern testing increases at a rate which is proportional to the square of the number of bits of storage in the digital memory chip.
- Short functional testing of chips involves the testing of each chip on an individual basis to determine whether it meets the specs set down in the data sheet, e.g. operating speed, and voltage and current parameters. These so-called short functional tests generally require much less testing time than pattern testing. Both the long and short functional tests have heretofore been performed by chip makers in various sequences and at various temperature levels. After the functional tests are completed, the chips that have satisfactorily undergone all tests are subjected to quality control testing.
- the functional tests are designed to test the chips at a constant temperature, usually the junction temperature.
- a constant temperature usually the junction temperature.
- chips with low power dissipation eg ⁇ 1 watt
- maintaining the temperature constant by convection, flowing a fluid (air stream) across a DUT surface is usually sufficient.
- P D power dissipation
- P D also increases, proportionately, with increasing clock rate (for the common CMOS devices).
- R clock rate
- Performance or useful work performed by a chip per time (R) is usually directly proportional to the clock rate or frequency.
- Current and proposed design P D 's are becoming prohibitive (the chips are getting too hot).
- Chips are designed to operate in highly temperature variable environments. The heat generated by a chip affects its temperature and thus feedback exists. It is always desirable to operate the chip at a constant internal temperature (junction temperature).
- this internal temperature is set to be less than the maximum allowable to allow for the violability and power consumption goals of the chip design.
- the total heat impinging on the chip increases significantly (due either to external temperature increases or to increases in the system clock frequency).
- a chip is performance tested at its maximum capacity and maximum system clock frequency, it is necessary to control the ambient temperature to maintain the junction temperature of the chip constant in order to provide a reliable frame of reference or standard against which each chip is tested.
- a chip is tested, it is referred to as a device under test (DU ) .
- the prior art systems are not capable of precisely controlling the DUT temperatures at > 3-5 watts of power dissipation.
- thermocouples are used to measure the temperature differential between two surfaces. The sensed temperature difference controls a heater which is adjusted so that heat flow between the surfaces is prevented. The first surface is shielded from the environment to prevent heat flow therefrom to this surface.
- This device is not suitable for measuring the performance of a cooling device such as a heat sink or heat transfer device used in a semiconductor module for cooling a semiconductor chip or the like.
- U.S. Pat. No. 3,745,460 Another method is illustrated in U.S. Pat. No. 3,745,460. In this approach, a current pulse is fed into the semiconductor causing heat to be generated therein. The detected time interval between cessation of the pulse and detection of maximum heat transfer leads to a determination of the thermal resistance.
- a further method is described in U.S. Pat. No.4,396,300.
- the apparatus includes an electric heater for heating a block which surrounds and engages part of the tube. A liquid is pumped through the tube and a thermistor is used to measure the fluid temperature. A pressure drop sensor is provided to sense the drop in pressure across the block. The sensed data is transferred to a computer for computing the heat transfer resistance.
- thermoconductive module is also applicable for the testing of other devices such as hybrids, multi-chip modules, dc/dc converters, etc.
- the invention comprises a thermoconductive module which provides for superior conductive heat transfer from a DUT.
- the module comprises a housing having a heat exchange chamber.
- a flexible heat exchange plate is secured to the housing and interfaces with the exposed surface of the DUT.
- the plate is in thermal communication with the heat exchange chamber.
- the plate is biased outwardly from the housing such that the plate maps the topography of the surface of the DUT.
- a DUT sensor in the housing measures the temperature of the DUT.
- a sensor in the housing measures the temperature of the heat exchange fluid. Based on the readings from these two sensors, the flow of the heat exchange fluid is controlled.
- the surface is secured to the housing by at least one flexible web bellows.
- a vacuum is drawn in the interface between the heat exchange plate and the engaged surface of the DUT.
- the invention comprises a thermoconductive module which provides for superior conductive heat transfer from a DUT.
- the module comprises a mixing assembly wherein fluids at different temperatures and flow rates can be introduced and combined.
- the fast response time of the module is due to the mixing of the fluids within the module. Without this mixing in the module, the time lag would be unacceptable in many applications.
- a heat exchange surface which includes a heat exchange chamber, is biased outwardly from the mixing assembly.
- the heat exchange assembly has a flexible heat exchange plate which engages the top surface of a DUT.
- the heat exchange plate is in thermal communication with the heat exchange chamber.
- the plate is biased outwardly from the heat exchange chamber such that the plate maps the topography of the surface of the DUT.
- a vacuum is drawn in the interface between the heat exchange plate and the surface of the DUT to ensure maximum surface contact.
- a sensor in the heat exchange assembly which is thermally isolated from the heat exchange fluid measures the temperature of the DUT.
- the sensor in the heat exchange fluid measures the temperature of the heat exchange fluid. Based on the readings from these two sensors the flow of the heat exchange fluid is controlled to maintain the temperature of the DUT at a target temperature, typically the case temperature but also the junction temperature if desired.
- the vacuum concept is also advantageously employed with the module to pick up devices by means of the vacuum. This allows devices to be engaged and transferred and disengaged without a mechanical device other than the vacuum feature of the module.
- a plurality of spring biased pins engage the heat exchange plate. This allows the plate to contour to the surface of the DUT.
- Fig. 1 is a front, partially sectional view of a thermoconductive module of the invention
- Fig. 2 is a front view of a mixing assembly
- Fig. 3 is a top view of the mixing assembly of Fig. 2;
- Fig. 4 is a front view of a pin block assembly
- Fig. 5 is a bottom view of the pin block assembly of Fig. 4;
- Fig. 6 is an illustration of the interface between a heat exchange plate and the top surface of a DUT;
- Fig. 7 is a block diagram of a system embodying the invention.
- thermoconductive module is shown generally at 10.
- the module comprises a support plate 12 having an inlet 14 and an inlet 16. Fluids, e.g. water, may be introduced into the inlets at the same or different temperatures. Also secured to the support plate are outlets 18 and 20 (not shown) to remove heat exchange fluid from the module as will be described. Lastly, secured to the support plate 12 is a vacuum outlet 22.
- the mixing assembly comprises a mixing chamber 26 in communication with the inlets 14 and 16, a conduit 28 and a distribution head 30.
- Return channels 32 and 34 are formed in the outer surface of the walls of the mixing assembly 24 and communicate with the outlets 18 and 20.
- a pin block assembly 40 depending from the mixing assembly 24 is a pin block assembly 40.
- the pin block assembly 40 is characterized by a central through aperture 42 and four equally spaced feed conduits 44, shown most clearly in Fig. 5.
- the pin block assembly 40 further comprises cylindrical recesses 46 in which are received springs 48.
- pins 50 are received in the cylinders 46 and are biased outwardly from the pin block assembly by the springs 48.
- a flexible wall 52 comprising bellows 54 is secured at one end to the support plate 12.
- a heat exchanger 60 Secured to the flexible wall at its other end is a heat exchanger 60 having an upper wall 62 and a reduced lower cylindrical wall 64.
- a flexible heat exchange plate 66 Secured to the lower wall 64 is a flexible heat exchange plate 66.
- a gasket 68 is secured to the heat exchange plate 66.
- the gasket 68 is not required.
- the heat exchanger 60 defines with the pin block assembly 40, a heat exchanger chamber 70. As shown, the pins 50 pass through the heat exchange chamber 70 and contact and bias outwardly the heat exchange plate 66.
- the pins 50 in addition to ensuring flush engagement of the heat exchange plate 66 with the top surface of the DUT, also provide baffling for the heat exchange fluid flowing therethrough as will be described. Pins 50 also provide for additional heat transfer from the plate 66 to the pins 50 to the fluid. Extending through the heat exchange plate is a thermocouple 72 which is biased outwardly. The thermocouple, as described in my aforementioned patents, is thermally isolated from the heat exchange chamber.
- a vacuum line 74 is sealingly secured to the heat exchange plate 66 and extends through the central aperture 42 and the mixing assembly 24 and connects to the vacuum outlet 22. Extending into the heat exchange chamber is a thermocouple 76. The thermocouple 76 is attached to an arm 77 which in turn is secured to the bottom of the pin block assembly 40. The paired wires for the thermocouple 76 return through the return channel (shown as a single line for clarity) and into the outlet 18. The paired wires are removed from the outlet 18 in a seal tight manner.
- thermocouple 72 travels through the vacuum line 74 and then are removed (not shown) from the vacuum line in a seal tight manner after they pass through the support plate 12.
- a DUT 80 is represented as a three dimensional solid body. For reasons of clarity, connecting pins in the substrate on which the chip is mounted are not shown.
- the DUT is seated in a tester of the manufacturer's specification which performs the functional test on the DUT. As shown, when the heat exchange plate 66 engages the DUT, it maps the top surface. Additionally, a vacuum is drawn at the interface for improved thermal performance and for device pick up if required.
- the thermoconductive module 10 of the invention is shown schematically in a system.
- the heat exchange plate 66 of the module is interfaced with a DUT as shown in Fig. 6.
- the vacuum line 22 communicates with a vacuum source 90 and the vacuum is controlled by valve 92.
- the paired wires from the thermocouples 72 and 76 (shown schematically in Fig. 1) are shown collectively as 94 and communicate with a programmable logic controller 100.
- the heat exchange fluid inlet and outlet conduits 14, 16, 20, and 22 communicate with a source of heat exchange fluid 110 and have associated valves 102, 104, 106 (not shown) and 108 respectively. These valves communicate with the controller 100 via lines 112, 114, 116 (not shown) and 118.
- the heat exchange supply 110 includes first and second reservoirs (not shown) to maintain separate sources of heat exchange fluid at separate temperatures. Also, the return conduits 18 and 20 flow to a reservoir for later recycling and/or reuse.
- thermocouple 76 reads the temperature of the heat exchange fluid rather than the temperature of a heat exchange device. Also, the control of the flow rates of heat exchange fluids based on sensed temperatures is well within the skill of the art.
- the operation of the invention will be described with reference to a DUT 68 with a power dissipation of 0 to 100 watts.
- the DUT has a top surface area 82 of approximately one in 2 .
- the DUT must be maintained at a junction temperature of 85°C for 5 minutes.
- the DUT 80 is seated in a tester as shown in Fig. 7.
- the thermoconductive module 10 is placed into contacting engagement with the top surface 82 of the DUT 80.
- Any suitable device may be used to effect this placement such as a robotic hand, pneumatic rods, etc., it being understood (referring to Fig. 7) that the conduits 14, 16, 18, 20, and 22 are flexible.
- the heat exchange fluid used for this illustrative embodiment is water.
- the heat exchange plate 66 is preferably stainless steel 0.001" thick with an outside surface coating of a precious metal, such as gold, in a thickness of about 50 millionths.
- the thermocouple 72 engages the top surface of the DUT and measures its temperature.
- the bellowed wall 52 allows the heat exchange plate 66 to move with reference to the support plate in a gimbal-like fashion. As shown in Fig. 6, the pins bias the plate 66 to ensure maximum surface contact between the heat exchange plate and the top surface of the DUT 80.
- the pogo pins 50 allow the heat exchange plate 66 to map the topography of the surface 82. For this specific example described herein, the pogo pins are uniformly arrayed such as shown in Fig. 5 and each has a spring tension of approximately 0.5 ounces.
- a vacuum is drawn through the conduit 42 in a range of 29 in Hg.
- Water flows through the inlet 14 at a flow rate of about 1 gpm and at a temperature of about 60°C. Water flows through the inlet 16 at a temperature of about 20°C and a flow rate of 1 gpm.
- the water is mixed in the mixing chamber 26, flows through the conduit 28 and into the distribution head 30. The mixed water then flows through the four feed conduits 44 and into the heat exchange chamber 70. The water leaves the heat exchange chamber, flows through the return channels 32 and 34 and then to the outlets 18 and 20. Once the system has reached equilibrium, the tester commences the functional testing of the DUT.
- the flow rates and temperatures of the water through the inlets 14 and 16 will change to ensure that the DUT is maintained at its junction temperature.
- the flow rate of the cooler water would increase from the initial flow rate just described while the flow rate of the warmer water would decrease from the initial flow rate just described.
- the flow rates will vary during the test period.
- other fluids such as silicone oils, flourinets, glycols, etc. may be used.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96936847A EP0857304A2 (en) | 1995-10-23 | 1996-10-23 | Flexibly suspended heat exchange head for a dut |
US09/043,098 US6392431B1 (en) | 1996-10-23 | 1996-10-23 | Flexibly suspended heat exchange head for a DUT |
AU74670/96A AU7467096A (en) | 1995-10-23 | 1996-10-23 | Flexibly suspended heat exchange head for a dut |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3316895P | 1995-10-23 | 1995-10-23 | |
US60/033,168 | 1995-10-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1997015837A2 true WO1997015837A2 (en) | 1997-05-01 |
WO1997015837A3 WO1997015837A3 (en) | 1997-05-29 |
Family
ID=21868907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1996/016930 WO1997015837A2 (en) | 1995-10-23 | 1996-10-23 | Flexibly suspended heat exchange head for a dut |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0857304A2 (en) |
AU (1) | AU7467096A (en) |
WO (1) | WO1997015837A2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5966940A (en) * | 1997-11-18 | 1999-10-19 | Micro Component Technology, Inc. | Semiconductor thermal conditioning apparatus and method |
GB2346703B (en) * | 1997-10-07 | 2002-06-19 | Reliability Inc | Burn-in board with adaptable heat sink device |
US6628132B2 (en) | 2001-08-10 | 2003-09-30 | Teradyne, Inc. | Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques |
US6717115B1 (en) | 2000-04-25 | 2004-04-06 | Teradyne, Inc. | Semiconductor handler for rapid testing |
WO2009046945A2 (en) * | 2007-10-05 | 2009-04-16 | Multitest Elektronische Systeme Gmbh | Plunger for holding and moving electrical components in particular ic's |
WO2009046946A1 (en) * | 2007-10-05 | 2009-04-16 | Multitest Elektronische Systeme Gmbh | Plunger for holding and moving electronic components in particular ic's with a heat conducting body |
EP1936663A3 (en) * | 2006-12-22 | 2009-07-22 | Espec Corp. | System for testing the durability of objects under thermally hard circumstances |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0341156A1 (en) * | 1988-05-06 | 1989-11-08 | Carrier S.A. | Device for supporting and thermally regulating a piece and semi-conductor circuit plates testing apparatus comprising such a device |
US4918928A (en) * | 1987-12-17 | 1990-04-24 | Kabushiki Kaisha Kobe Seikosho | Apparatus for testing IC devices at low temperature and cooling bag for use in testing IC devices at low temperature |
US5084671A (en) * | 1987-09-02 | 1992-01-28 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
US5148003A (en) * | 1990-11-28 | 1992-09-15 | International Business Machines Corporation | Modular test oven |
WO1994022029A1 (en) * | 1993-03-19 | 1994-09-29 | Ej Systems, Inc. | Burn-in module |
-
1996
- 1996-10-23 EP EP96936847A patent/EP0857304A2/en not_active Withdrawn
- 1996-10-23 WO PCT/US1996/016930 patent/WO1997015837A2/en not_active Application Discontinuation
- 1996-10-23 AU AU74670/96A patent/AU7467096A/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5084671A (en) * | 1987-09-02 | 1992-01-28 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
US4918928A (en) * | 1987-12-17 | 1990-04-24 | Kabushiki Kaisha Kobe Seikosho | Apparatus for testing IC devices at low temperature and cooling bag for use in testing IC devices at low temperature |
EP0341156A1 (en) * | 1988-05-06 | 1989-11-08 | Carrier S.A. | Device for supporting and thermally regulating a piece and semi-conductor circuit plates testing apparatus comprising such a device |
US5148003A (en) * | 1990-11-28 | 1992-09-15 | International Business Machines Corporation | Modular test oven |
WO1994022029A1 (en) * | 1993-03-19 | 1994-09-29 | Ej Systems, Inc. | Burn-in module |
Non-Patent Citations (1)
Title |
---|
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 33, no. 12, May 1991, NEW YORK US, pages 85-86, XP000121597 "MODULE PROBE PACKAGE" * |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2346703B (en) * | 1997-10-07 | 2002-06-19 | Reliability Inc | Burn-in board with adaptable heat sink device |
US5966940A (en) * | 1997-11-18 | 1999-10-19 | Micro Component Technology, Inc. | Semiconductor thermal conditioning apparatus and method |
US6717115B1 (en) | 2000-04-25 | 2004-04-06 | Teradyne, Inc. | Semiconductor handler for rapid testing |
US6628132B2 (en) | 2001-08-10 | 2003-09-30 | Teradyne, Inc. | Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques |
EP1936663A3 (en) * | 2006-12-22 | 2009-07-22 | Espec Corp. | System for testing the durability of objects under thermally hard circumstances |
WO2009046945A2 (en) * | 2007-10-05 | 2009-04-16 | Multitest Elektronische Systeme Gmbh | Plunger for holding and moving electrical components in particular ic's |
WO2009046946A1 (en) * | 2007-10-05 | 2009-04-16 | Multitest Elektronische Systeme Gmbh | Plunger for holding and moving electronic components in particular ic's with a heat conducting body |
WO2009046945A3 (en) * | 2007-10-05 | 2009-06-25 | Multitest Elektronische Syst | Plunger for holding and moving electrical components in particular ic's |
US8232815B2 (en) | 2007-10-05 | 2012-07-31 | Multitest Elektronische Systeme Gmbh | Plunger for holding and moving electronic components in particular ICS |
US8303008B2 (en) | 2007-10-05 | 2012-11-06 | Multitest Elektronische Systeme Gmbh | Plunger for holding and moving electrical components |
Also Published As
Publication number | Publication date |
---|---|
EP0857304A2 (en) | 1998-08-12 |
AU7467096A (en) | 1997-05-15 |
WO1997015837A3 (en) | 1997-05-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6392431B1 (en) | Flexibly suspended heat exchange head for a DUT | |
US6091062A (en) | Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly | |
US6476627B1 (en) | Method and apparatus for temperature control of a device during testing | |
US7616018B2 (en) | Integrated circuit probing apparatus having a temperature-adjusting mechanism | |
US6084215A (en) | Semiconductor wafer holder with spring-mounted temperature measurement apparatus disposed therein | |
US20090230985A1 (en) | Burn-in system with measurement block accomodated in cooling block | |
JPH0653298A (en) | Temperature control system of dry interface thermal chuck for semiconductor wafer test | |
KR20070114310A (en) | Temperature sensing and prediction in ic sockets | |
JP2004503924A (en) | Apparatus and method for controlling temperature of wafer and device under test using integrated temperature sensing diode | |
CN101137911A (en) | Method and device for testing semiconductor wafers using a chuck device whose temperature can be regulated | |
EP3799111A1 (en) | Inspection device and temperature control method | |
US8035405B2 (en) | Semiconductor devices testing apparatus with temperature-adjusting design | |
EP0857304A2 (en) | Flexibly suspended heat exchange head for a dut | |
CN109406573A (en) | It is a kind of for testing the test device and test method of thermal conductive silicon rubber mat thermal conductivity | |
US20080272795A1 (en) | Prober Apparatus and Operating Method Therefor | |
US20220334175A1 (en) | Inspection system and inspection method | |
JP2005265665A (en) | Burn-in device | |
CN106596163B (en) | Comprehensive experiment system for testing heat radiation performance of heating equipment | |
KR100938363B1 (en) | The reliability testing for temperature regulation system of memory module | |
CN108780114B (en) | Method and system for temperature control of devices in an electronic tester | |
KR20220081410A (en) | Test handler for electronic component | |
KR101121946B1 (en) | Unit of Chuck in Prober for Wafer Test | |
CN216484463U (en) | Measuring device | |
CN214422643U (en) | Temperature detection mechanism and amplification instrument | |
US20230314500A1 (en) | Temperature control device, electronic component handling apparatus, electronic component test apparatus, and dut temperature control method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AL AM AT AU AZ BB BG BR BY CA CH CN CZ DE DK EE ES FI GB GE HU IL IS JP KE KG KP KR KZ LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK TJ TM TR TT UA UG US UZ VN AM AZ BY KG KZ MD RU TJ TM |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): KE LS MW SD SZ UG AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA |
|
AK | Designated states |
Kind code of ref document: A3 Designated state(s): AL AM AT AU AZ BB BG BR BY CA CH CN CZ DE DK EE ES FI GB GE HU IL IS JP KE KG KP KR KZ LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK TJ TM TR TT UA UG US UZ VN AM AZ BY KG KZ MD RU TJ TM |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): KE LS MW SD SZ UG AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1996936847 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 09043098 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 1996936847 Country of ref document: EP |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
NENP | Non-entry into the national phase in: |
Ref country code: JP Ref document number: 97516728 Format of ref document f/p: F |
|
NENP | Non-entry into the national phase in: |
Ref country code: CA |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 1996936847 Country of ref document: EP |