AU7467096A - Flexibly suspended heat exchange head for a dut - Google Patents

Flexibly suspended heat exchange head for a dut

Info

Publication number
AU7467096A
AU7467096A AU74670/96A AU7467096A AU7467096A AU 7467096 A AU7467096 A AU 7467096A AU 74670/96 A AU74670/96 A AU 74670/96A AU 7467096 A AU7467096 A AU 7467096A AU 7467096 A AU7467096 A AU 7467096A
Authority
AU
Australia
Prior art keywords
dut
heat exchange
exchange head
flexibly suspended
suspended heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU74670/96A
Inventor
Elmer R. Jones
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aetrium Inc
Original Assignee
Aetrium Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aetrium Inc filed Critical Aetrium Inc
Publication of AU7467096A publication Critical patent/AU7467096A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
AU74670/96A 1995-10-23 1996-10-23 Flexibly suspended heat exchange head for a dut Abandoned AU7467096A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3316895P 1995-10-23 1995-10-23
US033168 1995-10-23
PCT/US1996/016930 WO1997015837A2 (en) 1995-10-23 1996-10-23 Flexibly suspended heat exchange head for a dut

Publications (1)

Publication Number Publication Date
AU7467096A true AU7467096A (en) 1997-05-15

Family

ID=21868907

Family Applications (1)

Application Number Title Priority Date Filing Date
AU74670/96A Abandoned AU7467096A (en) 1995-10-23 1996-10-23 Flexibly suspended heat exchange head for a dut

Country Status (3)

Country Link
EP (1) EP0857304A2 (en)
AU (1) AU7467096A (en)
WO (1) WO1997015837A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6744269B1 (en) * 1997-10-07 2004-06-01 Reliability Incorporated Burn-in board with adaptable heat sink device
US5966940A (en) * 1997-11-18 1999-10-19 Micro Component Technology, Inc. Semiconductor thermal conditioning apparatus and method
US6717115B1 (en) 2000-04-25 2004-04-06 Teradyne, Inc. Semiconductor handler for rapid testing
US6628132B2 (en) 2001-08-10 2003-09-30 Teradyne, Inc. Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques
JP2008159762A (en) * 2006-12-22 2008-07-10 Espec Corp Heating medium supply device and temperature control apparatus
DE102007047740B4 (en) * 2007-10-05 2010-11-04 Multitest Elektronische Systeme Gmbh Plunger for moving electronic components, in particular IC's
DE102007047679B4 (en) * 2007-10-05 2011-03-10 Multitest Elektronische Systeme Gmbh Plunger for moving electronic components, in particular ICs, with Wärmeleitkörper

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084671A (en) * 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system
US4918928A (en) * 1987-12-17 1990-04-24 Kabushiki Kaisha Kobe Seikosho Apparatus for testing IC devices at low temperature and cooling bag for use in testing IC devices at low temperature
FR2631010B1 (en) * 1988-05-06 1991-03-22 Sagem DEVICE FOR SUPPORTING AND THERMALLY CONTROLLING A WORKPIECE AND APPARATUS FOR TESTING SEMICONDUCTOR CIRCUIT PLATES INCLUDING SUCH A DEVICE
US5148003A (en) * 1990-11-28 1992-09-15 International Business Machines Corporation Modular test oven
US5420521A (en) * 1992-10-27 1995-05-30 Ej Systems, Inc. Burn-in module

Also Published As

Publication number Publication date
WO1997015837A2 (en) 1997-05-01
WO1997015837A3 (en) 1997-05-29
EP0857304A2 (en) 1998-08-12

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