Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/81—Bodies
  • H10H20/822—Materials of the light-emitting regions
  • H10H20/823—Materials of the light-emitting regions comprising only Group II-VI materials, e.g. ZnO

Definitions

• the present invention relates to a Dynamic Infrared Scene Projector (DIRSP) for use in testing infrared detection systems.
• DIRSP Dynamic Infrared Scene Projector
• Infrared detection systems generally fall into the category of either thermal imaging systems, where an infrared scene is presented to an observer, or seeker systems, where the information from the focal plane is acted upon directly by a computer.
• Dynamic Infrared Scene Projectors also known as thermal picture synthesizers, are currently used for the dynamic testing of these infrared focal plane detector array systems.
• any infrared system undergoes static testing to determine performance capabilities, such as Minimum Resolvable Temperature Difference (MRTD), Noise Equivalent Temperature Difference (NETD) and spatial resolution (MTF), and to monitor any deterioration ofthe system in time.
• MRTD Minimum Resolvable Temperature Difference
• NETD Noise Equivalent Temperature Difference
• MTF spatial resolution
• MRTD Minimum Resolvable Temperature Difference
• NETD Noise Equivalent Temperature Difference
• MTF spatial resolution
• Dynamic testing is useful for all infrared detection systems and. in particular, for missile seeker systems, in order to test the function ofthe whole system, comprising infrared detector, optics, signal processing, gimbals and tracking algorithms.
• the requirement is to simulate, and project, a two dimensional infrared scene which can be altered at a frame rate of up to 1 kHz. Temperature ranges of up to 350 °C may typically be required.
• DIRSP systems There are no DIRSP systems currently available which meet the requirements.
• One class of conventional DIRSP system under development is based on two dimensional arrays of resistively heated pixels, driven by silicon integrated circuitry. However, such systems dissipate a significant and inconvenient amount of heat and the maximum frame rate achievable is approximately 100Hz.
• the present invention proposes the use of an array of infrared light emitting diodes as a Dynamic Infrared Scene Projector for the testing of infrared detection systems.
• the device has particular use in the testing of thermal imaging systems or seeker systems.
• Drive circuits allow both forward and reverse bias to be applied to the diodes to enable the emission of both positive and negative luminescence.
• the light emitting diodes are heterostructure devices [e.g. US patent 5016073] capable of negative luminescence.
• the invention overcomes several ofthe problems associated with conventional systems based on resistive heating. For example, the power dissipation is lower, therefore reducing the need for excessive cooling, and the fundamental switching speed ofthe electroluminescence is such that very fast frame rates are possible. Furthermore, cold scene temperatures well below ambient can be simulated by the use of negative luminescence.
• a device for use as a dynamic infrared scene projector, for the testing of infrared detection systems comprises :-
• the diode structures emit and absorb radiation in the 3-5 ⁇ m or 8-13 ⁇ m wavelength region.
• the diode structures are based on a narrow bandgap semiconductor material.
• the diode structures may be based on mercury cadmium telluride (Hg,. x Cd Te) materials, indium aluminium antimonide (In ⁇ A ⁇ Sb) materials, mercury zinc telluride (Hg ⁇ . x Zn x Te) materials or indium thallium antimonide (In ( . x Tl x Sb) materials, where x is the composition.
• Hg,. x Cd Te mercury cadmium telluride
• In ⁇ A ⁇ Sb indium aluminium antimonide
• Hg ⁇ . x Zn x Te mercury zinc telluride
• In ( . x Tl x Sb) materials indium thallium antimonide
• the device may include an array of optical concentrators on the surface of said diode structures.
• the device may include an array of Winston cones on the surface of said diode structures.
• the device may include an array of lenses on the surface of said diode structures.
• Figure 1 shows a schematic diagram of a system for testing a basic thermal imaging system, the design of which is known in the prior art
• Figure 2 shows a schematic diagram of an array of electroluminescent diodes, as used in the present invention.
• FIGS 3 and 4 show schematic diagrams ofthe multilayer diode structures which may be used in the present invention
• Figure 5 shows the spectrum of emitted radiation from an InSb device under forward and reverse bias
• Figure 6 shows the negative luminescence spectrum and the spectral response for a Hg ⁇ . x Cd x Te device under reverse bias
• Figure 7 shows a schematic diagram of a typical immersion optics arrangement which may be used in the device
• Figure 8 shows a schematic diagram of a typical arrangement of Winston cones which may be used as optical concentrators in the device
• Figure 9 shows an diagram of an electronic circuit which may be used to supply both positive and negative polarity currents to the diode array
• Figure 10 shows a block diagram ofthe row-column addressing circuit for the diode array.
• a typical thermal imaging system comprises an array of infrared detectors 1 and an associated lens or lens arrangement 2.
• the dynamic infrared scene projector comprises a projector array 3 and an associated lens or lens arrangement 4.
• the control electronics for the projector array and the detector array are also shown.
• the array of infrared detectors 1 may, for example, be an array of resistive bolometric detectors or an array of photovoltaic detectors.
• the projector array 3 may be a two dimensional array of resistors driven by a silicon integrated system.
• such systems have several associated problems. For example, they can only operate at low frame rates ( ⁇ 100Hz) and can only achieve cold temperature simulation with extensive cryogenic cooling. They also dissipate a significant and inconvenient amount of heat.
• the projector array 3 is an array of infrared light emitting diode structures capable of emitting both positive and negative luminescence.
• a simple diagram of an array of luminescent diodes (also referred to as electroluminescent diodes) is shown schematically in Figure 2.
• the array may comprise any number of diode elements (or pixels) 5, the optimum number depending on the number of elements in the infrared detector array under test.
• a five rows (6) by five columns (7) array is shown for simplicity, although in practice the array would be much larger.
• the number of pixels in the projector array should be at least equal to that in the detector array under test, and ideally it would be four times that in the detector array (i.e.
• an infrared detection system has a 256 x 256 array of InSb detectors, it would preferably be operated with a 512 x 512 projector array.
• a dynamic infrared scene projector employing electroluminescent diode structures has several advantages over existing systems employing two dimensional resistor arrays. For example, by utilizing the negative luminescence from such devices, it is possible to simulate cold temperatures without the excessive cooling required in existing systems. Such luminescent arrays also permit the use of faster image frame rates than are achievable with existing systems.
• Figures 3 and 4 show schematic diagrams ofthe diode structures. In,. x Al x Sb and Hg, .x Cd x Te respectively, where x is the composition. Initially, the structure is grown epitaxially on a suitable substrate. The array is formed on the substrate using standard techniques, such as mesa etching or ion beam milling. These techniques are conventional to one skilled in the art.
• the device shown may be based on the InSb/ In,. x Al Sb system and has a four layer p + - j_ + - ⁇ - n structure, where the p + layer 8 is ofthe form Ii-o 85 A1 0 15 Sb.
• the example is given for illustrative purposes only and the device may in fact have one of a number of compositions and combinations of doping levels.
• the structure may be grown by molecular beam epitaxy on to an InSb substrate 9, the technique of which is standard to one skilled in the art [T. Ashley et ⁇ l, Semicond. Sci. Tech. 8 S386(1993)].
• the purpose ofthe p + layer 10 is to provide a low resistance, low injection contact to the Ii-o g5 A-o . i 5 Sb region 8.
• the n + region 1 1 is 1 ⁇ m thick and is doped with silicon (Si) to an electrical level of 2 x 10 18 cm '3 .
• the p + (10) and p. + (8) regions are doped with beryllium (Be) to a level of 2 x 10 cm " and have thicknesses of 1 ⁇ m and 200 A respectively.
• the composition, x, ofthe In ( . x Al x Sb barrier 8 is 0.15.
• the central ⁇ region 12 is 1.3 ⁇ m thick and is not deliberately doped.
• Circular diodes of 300 ⁇ m diameter are fabricated by means of mesa etching to the p + region 10.
• Sputtered chromium/gold contacts 13 are applied to the top of each mesa structure and to the p region 10.
• the infrared radiation 14 emitted from the mesa structure is also indicated.
• the surfaces ofthe structure may be coated with an anti reflection coating (not shown), for example, 0.7 ⁇ m of tin oxide.
• the device is based on a Hg,. x Cd x Te system and has a three layer p + - p - n + structure.
• the structure may be grown by metal organic vapour phase epitaxy using the inter- diffused multilayer process on a GaAs substrate [S.J.C. Irvine et ⁇ l., Materials Letters 2, 305(1984)].
• This technique is conventional to one skilled in the art.
• the ⁇ andp + layers are doped with arsenic to levels of 7 x 10 cm ' and 1 x 10 cm " respectively and the n + region is doped with iodine to a level of 3
• the diode structures are defined in a monolith of the material by etching circular trenches to produce linear arrays of the required number of elements with a common contact 18 to the p_ + region.
• the complete mesa device is then passivated with zinc sulphide approximately 0.3 ⁇ m thick (not shown), and metallised with chromium/gold. A typical mesa diameter would be 45 ⁇ m.
• the electrical contact 19 to the mesas may be achieved by indium bump bonding the array on to a gold lead-out pattern 20 on a sapphire carrier 21. This technique is conventional to one skilled in the art.
• the wavelength range over which the thermal imaging camera operates determines the appropriate material structure for use in the luminescent diode array.
• Diode structures based on Hg Nx Cd x Te or In,. x Al x Sb materials emit infrared radiation in the 3-5 ⁇ m wavelength region.
• Devices based on Hg 1-x Cd x Te materials may also emit in the 8-13 ⁇ m wavelength region.
• the diode structures may be formed from other narrow bandgap semiconductor materials, for example Hg
• Figure 6 shows the negative luminescence emission spectrum 27 for a Hg,. x Cd x Te device under reverse bias.
• a single peak 28 is seen at a wavelength of approximately 8.5 ⁇ m, with a long wavelength tail extending to beyond 10 ⁇ m.
• the figure also shows the spectral response ofthe device 29 when used as a detector (operating in reverse mode).
• lenses 30 with a radius of curvature of 120 ⁇ m are formed in degenerately doped InSb by ion beam milling.
• the technique of ion beam milling for this purpose is conventional to one skilled in the art.
• the lenses may be formed from a number of materials.
• the lenses are preferably formed from InSb and for devices based on a Hg ! . x Cd x Te structure, the lenses are preferably formed from CdTe or CdZnTe.
• the diode array elements 5 are 20 ⁇ m in diameter.
• the output radiation 14 is focused into an fl2 cone (where/is the /-number) by the lenses 30.
• the radius of curvature of each lens is such that radiation emitted from each diode element 5 is not reflected back to the diode but is transmitted in a forward direction to the detector array under test.
• the lens arrangement ensures the negative luminescence efficiency is high (the negative luminescence efficiency is the proportion of infrared radiation impinging on the front surface ofthe device which is absorbed by the diode 5).
• the diode array is driven by means of a silicon multiplexing circuit 31 , an example of which is described below.
• desirable efficiencies and current densities may also be achieved by using Winston cones 32.
• the radiation 14 emitted from a 20 ⁇ m diameter diode 5 undergoes total internal reflection at the walls of the cone 33 before eventually reaching the surface ofthe device 34a.
• This surface 34a may be the surface of an anti reflection coating 34 applied to the array of cones.
• the shape ofthe cone is designed so that the emitted radiation 14 incident upon this surface 34a is at such an angle that it is transmitted rather than reflected.
• the surface area ofthe emitting region is kept small, therefore ensuring a low current, whilst a high negative luminescence efficiency is achieved.
• Currents equivalent to a mean current density of around 2 A cm * can be achieved with this arrangement.
• the cones are formed in an InSb substrate and the cone shaping is carried out by ion beam milling. Alternatively, a chemical etching may also be used to manufacture the surface in this way, the technique of which is standard to one skilled in the art.
• An example of the electronic circuit which may be used to supply current to the infrared light emitting diode array is shown in Figure 9.
• the circuit "C” is implemented at each pixel of the silicon addressing circuit.
• the circuit comprises a digital row address select line 40 and a digital column address select line 41 so that each pixel may be addressed individually.
• Two field effect transistors (FETs) 42a and 42b are associated with each pixel 5, one for row select and one for the column select.
• An external analogue voltage is supplied through another input line 43 and would require 2-level metal interconnection.
• the analogue line supplies a voltage to a complete column one at a time, even though only one pixel is addressed at any one time.
• the circuit also comprises an n-channel enhancement FET 44, a p-channel enhancement FET 45, a capacitance 46 and a resistive element 47 for current limiting purposes.
• this capacitance may be the gate capacitance ofthe FETs 44 and 45.
• the infrared light emitting diode 5 is also shown in relation to the addressing circuitry. The characteristics of the two FETs are well know to one skilled in the art and may be understood from the description in "Physics of Semiconductors Devices" (2nd Edition), by Sze (John Wiley and Sons, 1981).
• FIG. 10 A block diagram ofthe row-column addressing circuit for a simple 5 x 5 array (see Figure 2) is shown in Figure 10.
• the circuit "C" (see Figure 9) is implemented at each pixel 5 ofthe array, with the row address lines and column address lines indicated by 47 and 48 respectively.
• the row-column addressing scheme will select the first FET switch and close it to allow charge to be placed on the capacitance 46.
• the charge on the capacitance controls the current through the diode 5 until the next reset is initiated.
• the n-channel enhancement FET 44 is ON and will pass current through the diode 5 in the polarity which produces negative luminescence.
• the n-channel enhancement mode is OFF and the p channel enhancement FET 45 is ON and will pass current through the diode 5 in the polarity which produces positive luminescence.
• Intermediate levels of charge on the diode permit the use of intermediate levels of luminescence, or "grey scales".
• the fundamental switching speed ofthe electroluminescent diodes is in excess of 1 MHz.
• the frame rates which may be achieved with such a system are therefore determined not by the thermal time constant of each pixel but by the frequency ofthe multiplexer drive circuit.

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• Transforming Light Signals Into Electric Signals (AREA)
• Photometry And Measurement Of Optical Pulse Characteristics (AREA)
• Radiation Pyrometers (AREA)
• Testing Of Optical Devices Or Fibers (AREA)
• Light Receiving Elements (AREA)
• Led Devices (AREA)

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• 1995
  • 1995-09-29 GB GBGB9519897.4A patent/GB9519897D0/en active Pending
• 1996
  • 1996-09-26 ES ES96931903T patent/ES2171719T3/es not_active Expired - Lifetime
  • 1996-09-26 GB GB9804051A patent/GB2319664B/en not_active Expired - Fee Related
  • 1996-09-26 KR KR10-1998-0702341A patent/KR100418139B1/ko not_active Expired - Fee Related
  • 1996-09-26 DE DE69620206T patent/DE69620206T2/de not_active Expired - Lifetime
  • 1996-09-26 JP JP51405397A patent/JP4002297B2/ja not_active Expired - Fee Related
  • 1996-09-26 WO PCT/GB1996/002374 patent/WO1997013282A1/en not_active Ceased
  • 1996-09-26 US US09/043,792 patent/US5949081A/en not_active Expired - Lifetime
  • 1996-09-26 EP EP96931903A patent/EP0852818B1/en not_active Expired - Lifetime

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