WO1997011491A1 - Heat transfer module incorporating liquid metal squeezed from a compliant body, and sub-assembly of same - Google Patents

Heat transfer module incorporating liquid metal squeezed from a compliant body, and sub-assembly of same Download PDF

Info

Publication number
WO1997011491A1
WO1997011491A1 PCT/US1996/015043 US9615043W WO9711491A1 WO 1997011491 A1 WO1997011491 A1 WO 1997011491A1 US 9615043 W US9615043 W US 9615043W WO 9711491 A1 WO9711491 A1 WO 9711491A1
Authority
WO
WIPO (PCT)
Prior art keywords
compliant body
seal ring
liquid metal
compliant
sub
Prior art date
Application number
PCT/US1996/015043
Other languages
French (fr)
Inventor
Wilbur Terry Layton
Ronald Allen Norell
James Andrew Roecker
Original Assignee
Unisys Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/531,434 external-priority patent/US5572404A/en
Priority claimed from US08/531,433 external-priority patent/US5561590A/en
Application filed by Unisys Corporation filed Critical Unisys Corporation
Publication of WO1997011491A1 publication Critical patent/WO1997011491A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat transfer module (Fig. 1) comprises: a heat generating unit (11) and a heat receiving unit (15) which are separated by a gap (space between 11 and 15); a compliant body (12), having microscopic voids therethrough, which is compressed into the gap; and a liquid metal alloy (12a and 12b in Figs. 2B and 2C) that is absorbed in the microscopic voids in the compliant body (12). Further, the heat transfer module also includes a seal ring (13) in the gap which surrounds the compliant body and which is spaced apart from the compliant body; and, the compliant body is intentionally compressed (Figs. 2B and 2C) so much that a portion of the liquid metal alloy is squeezed from the compliant body into the space between the compliant body and the seal ring. Squeezing liquid metal alloy from the compliant body lowers the thermal resistance (RT in table 1) between the heat generating unit (11) and the heat receiving unit (15) by increasing the area through which heat is transferred and by increasing the thermal conductivity through the compliant body.

Claims

-21-WHAT IS CLAIMED IS:
1. A heat transfer module, comprising: a heat generating unit and a heat receiving unit which are separated by a gap; a compliant body, having microscopic voids therethrough, which is in said gap; a liquid metal alloy that is absorbed in said microscopic voids in said compliant body; a seal ring, in said gap, which surrounds said compliant body and is spaced, at least in part, from said compliant body; and, a clamping means which squeezes all of the above recited components together and compresses said compliant body being compressed so much that a portion of said liquid metal alloy is squeezed from said compliant body into the space between said compliant body and said seal ring.
2. A module according to claim 1 wherein said liquid metal alloy which is squeezed from said compliant body fills a portion of said space, between said compliant body and said seal ring, which is at least one-tenth as large as said compliant body.
3. A module according to claim 1 wherein said liquid metal alloy which is squeezed from said compliant body fills at least 10%, but less than 100%, of said space between said compliant body and said seal ring.
. A module according to claim 1 wherein said liquid metal alloy which is squeezed from said compliant body -22-
fills 100% of said space between said compliant body and said seal ring.
5. A module according to claim 1 wherein said heat generating unit is an integrated circuit package.
6. A module according to claim 1 wherein said heat generating unit is an electrical power converter.
7. A module according to claim 1 wherein said heat receiving unit is a liquid cooled unit.
8. A module according to claim 1 wherein said heat receiving unit is an air cooled unit.
9. A module according to claim 1 wherein said seal ring has projections which contact said compliant body and hold the remainder of said seal ring spaced from said compliant body.
10. A module according to claim 1 wherein said compliant body has projections which contact said seal ring and hold the remainder of said compliant body spaced from said seal ring.
11. A module according to claim 1 wherein said seal ring is spaced, in its entirety, from said compliant body.
12. A module according to claim 11 wherein said seal ring is held apart from said compliant body by a separate retaining member which bridges the space there between. -23-
13. A module according to claim 1 wherein said seal ring contacts the entire perimeter of said compliant body and said compliant body has a central opening for receiving said liquid metal alloy which is squeezed from said compliant body.
14. A module according to claim 1 wherein said seal ring contacts the entire perimeter of said compliant body and said compliant body has several internal openings for receiving said liquid metal alloy which is squeezed from said compliant body.
15. A sub-assembly for transferring heat between two units which are separated by a gap, comprising: a compliant body having microscopic voids therethrough; a liquid metal alloy that is absorbed in said microscopic voids in said compliant body; a seal ring which surrounds said compliant body; and, a retaining member which is attached to said compliant body and said seal ring, and which holds said compliant body spaced apart from said seal ring.
16. A sub-assembly according to claim 15 wherein said retaining member includes a periphery portion which attaches to said seal ring, and arms which extend away from said periphery portion and attach to said compliant body.
17. A sub-assembly according to claim 16 wherein said arms have hooks and said compliant body is caught on said hooks. -24-
18. A sub-assembly according to claim 16 wherein said arms have hooks which point away from each other, and said compliant body is stretched from one hook to another hook.
19. A sub-assembly according to claim 16 wherein said arms number from two to ten.
20. A sub-assembly according to claim 16 wherein said periphery portion attaches to said seal ring with an adhesive.
21. A sub-assembly according to claim 16 wherein each arm has a single hook.
22. A sub-assembly according to claim 16 wherein each arm has multiple hooks.
23. A sub-assembly according to claim 16 wherein said retaining member is flat and lies in a single plane except that said arms have hooks which lie at an acute angle to said plane.
24. A sub-assembly according to claim 16 wherein said retaining member has a predetermined thickness and said compliant body has a larger thickness.
25. A method of fabricating a sub-assembly for transferring heat between two units which are separated by a gap; said method including the steps of: providing a compliant body having microscopic voids therethrough; -25-
absorbing a liquid metal alloy in said microscopic voids in said compliant body; surrounding said compliant body with a seal ring; and, attaching a retaining member to said compliant body and said seal ring such that said compliant body is held spaced apart from said seal ring.
26. A method according to claim 25 and further including the steps of: including on said retaining member a periphery portion which attaches to said seal ring, and arms with hooks which extend away from said periphery portion; and, attaching said compliant body to said arms by catching said compliant body on said hooks.
27. A method according to claim 26 wherein said compliant body with its absorbed liquid metal alloy is stretched from one hook to another hook.
28. A method according to claim 26 wherein said compliant body with its absorbed liquid metal alloy is pushed onto said hooks.
PCT/US1996/015043 1995-09-21 1996-09-20 Heat transfer module incorporating liquid metal squeezed from a compliant body, and sub-assembly of same WO1997011491A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/531,434 US5572404A (en) 1995-09-21 1995-09-21 Heat transfer module incorporating liquid metal squeezed from a compliant body
US08/531,433 US5561590A (en) 1995-09-21 1995-09-21 Heat transfer sub-assembly incorporating liquid metal surrounded by a seal ring
US08/531,433 1995-09-21
US08/531,434 1995-09-21

Publications (1)

Publication Number Publication Date
WO1997011491A1 true WO1997011491A1 (en) 1997-03-27

Family

ID=27063545

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1996/015043 WO1997011491A1 (en) 1995-09-21 1996-09-20 Heat transfer module incorporating liquid metal squeezed from a compliant body, and sub-assembly of same

Country Status (1)

Country Link
WO (1) WO1997011491A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009105411A2 (en) * 2008-02-21 2009-08-27 Alcatel-Lucent Usa Inc. Thermally conductive periodically structured gap fillers and method for utilizing same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0009605A1 (en) * 1978-10-02 1980-04-16 International Business Machines Corporation Cooling structure for a semiconductor module
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0009605A1 (en) * 1978-10-02 1980-04-16 International Business Machines Corporation Cooling structure for a semiconductor module
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009105411A2 (en) * 2008-02-21 2009-08-27 Alcatel-Lucent Usa Inc. Thermally conductive periodically structured gap fillers and method for utilizing same
WO2009105411A3 (en) * 2008-02-21 2009-12-17 Alcatel-Lucent Usa Inc. Thermally conductive periodically structured gap fillers and method for utilizing same

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