WO2009105411A3 - Thermally conductive periodically structured gap fillers and method for utilizing same - Google Patents
Thermally conductive periodically structured gap fillers and method for utilizing same Download PDFInfo
- Publication number
- WO2009105411A3 WO2009105411A3 PCT/US2009/034246 US2009034246W WO2009105411A3 WO 2009105411 A3 WO2009105411 A3 WO 2009105411A3 US 2009034246 W US2009034246 W US 2009034246W WO 2009105411 A3 WO2009105411 A3 WO 2009105411A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermally conductive
- utilizing same
- gap fillers
- compressive force
- periodically structured
- Prior art date
Links
- 239000000945 filler Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200980105745.1A CN101946319A (en) | 2008-02-21 | 2009-02-17 | Thermally conductive periodically structured gap fillers and method for utilizing same |
JP2010547707A JP2011512690A (en) | 2008-02-21 | 2009-02-17 | Thermally conductive periodic structure gap filler and method of using the same |
EP09712137A EP2248167A2 (en) | 2008-02-21 | 2009-02-17 | Thermally conductive periodically structured gap fillers and method for utilizing same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/034,734 US20090213548A1 (en) | 2008-02-21 | 2008-02-21 | Thermally conductive periodically structured gap fillers and method for utilizing same |
US12/034,734 | 2008-02-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009105411A2 WO2009105411A2 (en) | 2009-08-27 |
WO2009105411A3 true WO2009105411A3 (en) | 2009-12-17 |
Family
ID=40578748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/034246 WO2009105411A2 (en) | 2008-02-21 | 2009-02-17 | Thermally conductive periodically structured gap fillers and method for utilizing same |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090213548A1 (en) |
EP (1) | EP2248167A2 (en) |
JP (1) | JP2011512690A (en) |
KR (1) | KR20100108598A (en) |
CN (1) | CN101946319A (en) |
WO (1) | WO2009105411A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5487704B2 (en) * | 2009-04-27 | 2014-05-07 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
JP5316397B2 (en) * | 2009-12-18 | 2013-10-16 | 富士電機株式会社 | WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR MODULE |
JP2012104713A (en) * | 2010-11-11 | 2012-05-31 | Kitagawa Ind Co Ltd | Heat-conducting material and method of producing the same |
CN102917574B (en) * | 2012-10-24 | 2015-05-27 | 华为技术有限公司 | Heat-conducting pad, method for manufacturing heat-conducting pad, radiating device and electronic device |
JP2014212182A (en) * | 2013-04-18 | 2014-11-13 | 三菱電機株式会社 | Thermal conductive bonding material, and semiconductor device using the same |
JP6524461B2 (en) * | 2014-10-11 | 2019-06-05 | 国立大学法人京都大学 | Heat dissipation structure |
KR20220166101A (en) * | 2021-06-09 | 2022-12-16 | 삼성전자주식회사 | Electronic device including heat dissipation structure |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997011491A1 (en) * | 1995-09-21 | 1997-03-27 | Unisys Corporation | Heat transfer module incorporating liquid metal squeezed from a compliant body, and sub-assembly of same |
US5658831A (en) * | 1993-03-31 | 1997-08-19 | Unisys Corporation | Method of fabricating an integrated circuit package having a liquid metal-aluminum/copper joint |
WO2001016968A1 (en) * | 1999-08-26 | 2001-03-08 | Fdk Corporation | Sheet capable of absorbing heat and electromagnetic radiation |
US20010047858A1 (en) * | 1999-05-06 | 2001-12-06 | Mccullough Kevin A. | Conforming heat sink assembly |
US20060286712A1 (en) * | 2005-05-20 | 2006-12-21 | International Business Machines Corporation | Thermal interface with a patterned structure |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6037658A (en) * | 1997-10-07 | 2000-03-14 | International Business Machines Corporation | Electronic package with heat transfer means |
US7208192B2 (en) * | 2002-05-31 | 2007-04-24 | Parker-Hannifin Corporation | Thermally or electrically-conductive form-in-place gap filter |
US20060035413A1 (en) * | 2004-01-13 | 2006-02-16 | Cookson Electronics, Inc. | Thermal protection for electronic components during processing |
-
2008
- 2008-02-21 US US12/034,734 patent/US20090213548A1/en not_active Abandoned
-
2009
- 2009-02-17 KR KR1020107018458A patent/KR20100108598A/en not_active Application Discontinuation
- 2009-02-17 CN CN200980105745.1A patent/CN101946319A/en active Pending
- 2009-02-17 JP JP2010547707A patent/JP2011512690A/en not_active Abandoned
- 2009-02-17 WO PCT/US2009/034246 patent/WO2009105411A2/en active Application Filing
- 2009-02-17 EP EP09712137A patent/EP2248167A2/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5658831A (en) * | 1993-03-31 | 1997-08-19 | Unisys Corporation | Method of fabricating an integrated circuit package having a liquid metal-aluminum/copper joint |
WO1997011491A1 (en) * | 1995-09-21 | 1997-03-27 | Unisys Corporation | Heat transfer module incorporating liquid metal squeezed from a compliant body, and sub-assembly of same |
US20010047858A1 (en) * | 1999-05-06 | 2001-12-06 | Mccullough Kevin A. | Conforming heat sink assembly |
WO2001016968A1 (en) * | 1999-08-26 | 2001-03-08 | Fdk Corporation | Sheet capable of absorbing heat and electromagnetic radiation |
US20060286712A1 (en) * | 2005-05-20 | 2006-12-21 | International Business Machines Corporation | Thermal interface with a patterned structure |
Also Published As
Publication number | Publication date |
---|---|
EP2248167A2 (en) | 2010-11-10 |
US20090213548A1 (en) | 2009-08-27 |
CN101946319A (en) | 2011-01-12 |
JP2011512690A (en) | 2011-04-21 |
WO2009105411A2 (en) | 2009-08-27 |
KR20100108598A (en) | 2010-10-07 |
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