WO1996034730A1 - Procede de production de cartes ou de disques en matiere plastique munis d'une etiquette imprimee sur une ou sur leurs deux faces - Google Patents

Procede de production de cartes ou de disques en matiere plastique munis d'une etiquette imprimee sur une ou sur leurs deux faces Download PDF

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Publication number
WO1996034730A1
WO1996034730A1 PCT/CH1996/000151 CH9600151W WO9634730A1 WO 1996034730 A1 WO1996034730 A1 WO 1996034730A1 CH 9600151 W CH9600151 W CH 9600151W WO 9634730 A1 WO9634730 A1 WO 9634730A1
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WO
WIPO (PCT)
Prior art keywords
label
labels
printed
plastic
card
Prior art date
Application number
PCT/CH1996/000151
Other languages
German (de)
English (en)
Inventor
Hans Auer
Original Assignee
Hans Auer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hans Auer filed Critical Hans Auer
Priority to AU53302/96A priority Critical patent/AU5330296A/en
Publication of WO1996034730A1 publication Critical patent/WO1996034730A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14106—Positioning or centering articles in the mould using electrostatic attraction or static electricity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3456—Antennas, e.g. radomes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to the field of injection molding technology. It relates to a process for the production of plastic cards or disks provided with a printed label on one or both sides, in particular in the form of smart cards, according to the in-mold labeling (IML) method, in which process a thin, large-area label film is used is printed from a first plastic, the printed label film is divided into a plurality of individual printed labels, at least one of the labels is placed in an injection mold, and a card substrate made of a second plastic is molded onto the inserted label , which, together with the label, forms the plastic card or disk, the inserted label being held flat against a wall of the injection mold during the injection molding process.
  • IML in-mold labeling
  • IML in-mold labeling
  • a printed carrier film is inserted into the mold instead of a printed label.
  • the printed image detaches from the carrier film and binds to the injected plastic.
  • the carrier film can be removed later.
  • the transfer of the printed image can be facilitated by appropriate separating layers between the printed image and the carrier film and adhesive layers over the printed image.
  • Examples of the IML and transfer process are in connection with the production of chip cards from the aforementioned EP-A1-0 340 099, EP-B1-0 350 179, EP-A2-0 488 485 or EP- A2-0 606 118 known.
  • the transfer process (EP-A2-0 488 485; FIGS. 13 and 13 in EP-A2-0 606 118; FIGS. 2a, b, 3 and 10 in EP-Al-0 340 099) uses the carrier film is tightly clamped laterally between the two (or three) parts of the injection mold.
  • the plastic injected into the mold with high pressure on the inside of the carrier film then presses the carrier film over the entire surface against the wall of the mold and completely fills the interior of the mold, so that the card has a smooth surface.
  • the injected plastic has no possibility of pressing behind the carrier film and thus partially covering the printed image.
  • a disadvantage of the transfer method is that the carrier film protruding beyond the shape must be positioned exactly by means of additional devices so that the transferred printed image is placed exactly in the correct place on the finished card.
  • Another disadvantage is that in the case of an uneven print image or in the case of uneven temperature and pressure conditions in the form of the image transfer, it is not seldom only partially, which leads to a comparatively high reject rate.
  • the finished card does not form a layer composite which is distinguished by particularly favorable mechanical properties.
  • this procedure must ensure that the label or labels are injected of the plastic - in particular if the injection opening is arranged on the side - lie as closely as possible over the whole area and immovably against the wall of the injection mold, so that the label is not displaced by the plastic which is under pressure or the plastic creeps under the label.
  • a close contact between the label and the (cooled) mold ensures that the hot plastic does not melt the label and the adhesion of the printed image to the label is not reduced by the action of heat.
  • the object is achieved in a method of the type mentioned at the outset in that the label is held electrostatically on the wall of the injection mold. Due to the electrostatic attraction between the wall and the plastic label, it is easy to achieve a full-surface contact of the label on the wall without any openings having to be provided in the wall.
  • the injected plastic thus has no way of crawling behind the label, moving the label, or causing any marks.
  • electrostatic attraction between the label and the wall is achieved in a particularly simple manner by electrostatically charging the label before inserting it into the injection mold and inserting the charged label into the injection mold becomes.
  • the label can be guided past corresponding tip electrodes, for example, before being inserted, or can be processed by means of an insertion device which itself has electrodes arranged in the vicinity of the label.
  • a second preferred embodiment of the method according to the invention is characterized in that the label is preferably pressed over the entire surface of the respective wall of the injection mold when it is inserted. This ensures that the electrostatic attraction is uniformly effective over the entire surface of the label, in particular also in the peripheral edge area, and that the injected plastic has no possibility of shifting the label or crawling under the label.
  • the labels are printed with graphic elements. All conventional printing methods such as offset printing, screen printing, flexographic printing etc. can be used for this become. Likewise, conventional solvent-based inks or UV-crosslinkable, solvent-free inks can be used for printing.
  • the label film is coated with an adhesion promoter layer before the colors are printed becomes.
  • an adhesion promoter a polyamide mixture dissolved in isopropyl alcohol and toluene is used as the adhesion promoter (primer).
  • the surface can be further improved and a high gloss can be achieved if, according to another embodiment, the labels are also applied to the top side before the injection be provided with a preferably transparent cover layer.
  • the finished card is also high-gloss and scratch-resistant.
  • a further preferred embodiment is characterized in that the labels are provided with functional elements in the form of magnetic strips, kinegrams or conductor tracks designed as antennas before the injection. If such a conductor track is specifically arranged on the underside of the label and is electrically connected to a chip likewise applied to the underside of the label, a contactlessly interrogable chip card can be produced in a very simple manner by the IML method. Further embodiments result from the dependent claims.
  • FIG. 2 shows an exemplary embodiment for the electrostatic charging of a label, as is used in an embodiment of the method according to the invention
  • FIG. 3 shows the insertion of the label into the injection mold after charging according to FIG. 2;
  • FIG. 4 shows various steps in the production of a chip card printed on one side according to an exemplary embodiment of the method according to the invention in the injection mold according to FIG. 3;
  • FIG. 6 shows a top view and a cross section of various prefabricated labels for use in the method according to the invention
  • 7 shows method steps comparable to FIG. 5, in which a label with a punched-out opening is used in the region of the projecting molded part
  • printed labels are first produced, which are used in the subsequent IML process.
  • 1 shows an example of the various steps leading to a single printed label.
  • the starting point is a simple label film 1 (FIG. 1 a) made of a first plastic, which has an upper side 1 a and a lower side 1 b.
  • the label film 1 can be in the form of a wide roll, or in the form of individual, large sheets.
  • the material and thickness of the label film, but also the plastic to be injected, can be selected in the same way as described in the publication CH-A5-684 528 by the same inventor, which is expressly included in the description as a reference.
  • the label film 1 is coated over the entire surface on the upper side la with a thin adhesion promoter layer 2, which improves the adhesion of the subsequently applied printing ink and so the print image is better protected from damage (detachment) when the hot plastic is molded on etc.) protects.
  • a polyamide mixture (adhesive) dissolved in isopropyl alcohol (80%) and toluene (20%) is preferably used as the adhesion promoter (primer).
  • the desired print image 3 for the label is then printed (FIG. 1c).
  • the sheets can be covered over their entire area with a covering layer (36 in FIG. 6).
  • a covering layer for this purpose, either a transparent film can be laminated on or a varnish, preferably a UV-curable, solvent-free varnish, can be applied.
  • windows 41 are provided in the printed images and these windows 41 are not intended to be covered with a cover layer, appropriate precautions must be taken in order to avoid the window areas being coated.
  • a photopolymerizable paint of the type Wessco 7001 which is commercially available from the Swiss company Schmid Rhyner AG, Adliswil-Zurich, has proven itself as a paint.
  • the cover layer 36 is on the one hand an additional protection for the printed image both during the injection process and in the finished card. On the other hand, the cover layer 36 also gives the finished card a high-gloss surface, which is visually particularly appealing. After the printed sheet is finished in this way, the individual labels 4 are punched out of the sheet, for example by a punching process (FIGS. Le and lf).
  • FIG. 8 An exemplary and preferred method for punching out the labels is shown in FIG. 8.
  • the printed label films 1 are first cut (for example in stacks by means of a numerically controlled cutting machine) along the individual printed images (3; 3a,) into individual raw labels which are rectangular and have a protruding edge in relation to the sprayed card (dashed line in Fig. le).
  • Stacks 53 are then formed from the individual raw labels, from which the individual printed labels 4 and 4a-f are punched out in a punching device 42 in a punching process.
  • the exemplary punching device 42 shown in FIG. 8 comprises a punching knife 43 with a closed peripheral cutting edge 44.
  • the cutting edge is worked with high precision by suitable methods, so that the contour of the cutting edge is exactly (ie with very narrow tolerances) the edge of the edge to be sprayed Card matches.
  • a support piston 46 which is movable in the punching direction and which supports the stack 53 of the raw labels during the punching process.
  • the stack 53 of the cut raw labels is inserted into a stack holder 47 for punching (FIG. 8a).
  • the stack holder 47 essentially consists of a bottom 49, a rear side wall 48 and a rear wall 50, which are each perpendicular to one another. The stack is placed in the stack holder in such a way that the raw labels are oriented parallel to the rear wall 50 and thus perpendicular to the punching direction (arrows in FIG. 8b).
  • stack holder 47 and knife are moved relative to one another and towards one another, so that punch knife 43 is removed from stack 53 of the raw labels successively punched out a part stack 53a with finished labels that became larger.
  • the support piston 46 is also withdrawn in the punching knife, in such a way that the stack as a whole is always sufficiently compressed.
  • Remaining ring-shaped cutting remnants 54 remain.
  • an additional knife 45 can be arranged on the periphery of the cutting edge 44, which cuts the punched-out ring-shaped cutting remnants 54 at one point, so that they better move sideways ⁇ can fall.
  • a movable support plate 51 is inserted in the rear wall 50 of the stack holder 47, which e.g. can be resiliently mounted by means of springs 52 and withdraws when the punching knife 43 hits the rear wall 50. Due to the stacked punching out, a large number of printed labels can be produced in a short time, the dimensions of which are highly precise and fit optimally into the injection mold.
  • the individual labels 4 can then be fed to an injection molding machine, in which a plastic substrate is injection molded onto them in the IML process.
  • the various steps for producing a chip card printed on one side are shown in FIG. 4.
  • the printed label 4 (shown only in one layer in FIG. 4 for the sake of simplicity) is placed in an injection mold 11, which is usually composed of two parts, an upper and lower half mold 12 and 13 with corresponding walls 14 and 15 (the vertical scale 4 shows a greatly enlarged view so that the individual layers can be recognized better, in reality a chip card with a length of 85 mm and a width of 55 mm has a thickness (height) of only about 0.8 mm ).
  • the closed injection mold 11 encloses an injection chamber 19, the dimensions of which correspond to the dimensions of the finished card.
  • An injection channel 17 leads laterally into the injection chamber 19 and is connected to the injection nozzle of the injection molding machine.
  • the lateral arrangement of the injection channel 17 basically has the advantage that the plastic attachment remaining at the channel outlet after injection molding can easily be removed by punching without the optical quality of the large side surfaces of the card being impaired in any way.
  • this arrangement has the advantage in the production of cards printed on both sides (FIG. 5) that a hole does not have to be punched in either of the two labels before being inserted, in order to allow one in the walls 14, 15 or 30, 31 arranged injection channel to create an injection opening in the space between the labels.
  • the label 4 is inserted into the injection mold 11 in such a way that its printed upper side lies as far as possible over the entire surface of the wall 14 of the upper half mold 12. It is particularly important that the label, at least on the side on which the injection channel 17 opens into the injection chamber 19, is as tight as possible over the entire width of the wall 14, so that the hot (> 150 ° C.) under high pressure injected plastic cannot crawl between label 4 and wall 14 and thus partially covers the outer surface of the label and thus the printed image and renders the card unusable. It is particularly expedient if the label with its entire peripheral edge area, better still with its entire surface, lies firmly against the wall 14 and is held there because unevenness is avoided and the print image is cooled from the wall over the entire surface. It is also helpful if the label 4 has exactly the same dimensions as the molded card, so that there is practically no free space remains between the edge of the label 4 and the peripheral side wall of the injection chamber 19.
  • the label 4 is held on the wall 14 in an electrostatic manner, that is, by an electrostatic attraction between the wall 14 and the label 4.
  • the label 4 is preferably charged electrostatically before being inserted into the open injection mold 11, as shown in FIG 2 and 3 is shown in one embodiment.
  • the printed labels 4, which are kept in bulk on the injection molding machine, are individually picked up by a label holding device 5 which can be moved by means of an arm 7, and the free side of which is moved past an arrangement of tip electrodes 10 at a suitable distance, each with a high voltage are charged from several kV to a few 10 kV and statically charge the label 4 (FIG. 2).
  • the charged label 4 is then placed in the mold (FIG. 3) and held there due to the electrostatic forces.
  • suction openings 20 (FIGS. 3, 4) that support the electrostatic attraction and secure it in critical cases can also be provided in the injection mold 11 (for example, encircling a ring).
  • a disadvantage here is the printing of the openings 20 on the surface of the finished card, as has already been mentioned at the beginning.
  • the label 4 can be held during transport by means of conventional round (rubber) suction cups which, for example, engage in the middle of the label. However, it is particularly favorable to hold the label 4 at least in its entire peripheral edge area, even better over the entire surface, and to insert it into the injection mold 11 so that the label clings to the wall 14 over the entire surface and without the formation of cavities due to the charging can (Fig. 3).
  • the label holder device 5 can, for example according to FIGS. Pressure chamber 6, which is connected to a vacuum connection 8, and from which a plurality of suction openings 9 on the suction side lead outwards in order to hold the label 4 uniformly over the entire label surface.
  • the plastic can be injected into the injection chamber 19.
  • the injected plastic solidifies into a card substrate 21 which is thick in comparison with the label 4 (FIG. 4b). It connects inseparably to the label 4 and forms with it a stable layer structure which can be removed as a plastic card 22 after the injection mold 11 has been opened (FIG. 4c). This layer structure is retained even if the same plastic is used for the label film 1 and the substrate 21, because the film is usually drawn while the substrate is being sprayed.
  • a depression 18 can be formed in the card at the same time during the injection molding process, for later acceptance of the chip.
  • a correspondingly shaped, projecting molded part 16 is arranged in the lower wall 15 (as shown in FIGS. 3, 4) or in the upper wall 14 .
  • the molded part 16 can be integrally formed on the wall 15. But it can also be designed as a vertically displaceable stamp. In this way, a card with a precisely fitting recess 18 for inserting the chip can be produced in one work step, without the need for complex and complicated post-processing.
  • the analog constellation shown in FIG. 5 results.
  • two labels 4a and 4b are placed in the injection mold 23 consisting of the semi-molds 24 and 25 and are held electrostatically on the upper and lower walls 30 and 31 and possibly with the support of suction openings 26, 28 ( Fig. 5a).
  • the lower label 4b stretches over the molded part 32 for the chip holder.
  • the plastic for the card substrate 33 is then injected into the injection chamber 29 through the injection channel 27 (FIG. 5b) and connects to the two labels 4a and 4b).
  • the lower label 4b is pressed against the wall 31 at the same time such that it is "punched" by the molded part 32.
  • the plastic card 35 printed on both sides with the recess 34 for the chip can be removed from the opened mold (FIG. 5c).
  • the lower label 4b is of particular importance in connection with the recess 34.
  • the "punched" part of the lower label, which is located on the bottom of the recess 34, must be of such a surface that the chip to be inserted into the recess can be stuck on easily and safely. If the printing inks of the printed image printed on the lower label 4b and / or the cover layer prevent the chip from being stuck securely due to their nature, it is expedient and advantageous to print or coat the later lower label 4b to leave open the window 41 shown in FIG. 1 in the area of the later recess 34, measurements corresponds exactly to the dimensions of the recess 34. In this way, the readily adhesive label film (with or without primer coating) is exposed in the recess 34 in the finished molded card and the chip can be securely bonded into the recess 34.
  • a further possibility consists in completely punching out the lower labels 4b in the area of the window 41 after printing.
  • the spraying process then takes place as shown in FIG. 7.
  • the lower label 4b can be inserted into the lower half mold 25 without difficulty because of the punched-out window 41, the projecting molded part 32 protruding unhindered through the punched-out area (FIG. 7a).
  • a finished card can be removed from the injection mold 23 (FIG. 7c), which has a depression 34, the bottom of which is not covered with a label section and is therefore freely accessible.
  • the labels can be printed with graphic elements (pictures, numbers, letters, etc.), as was assumed in the previous explanation in FIG. 1.
  • a label 4c has the structure shown again in plan view and cross section in FIG. 6a with the label film 1, the printed image 3 and possibly an overlying cover layer 36 (the additional adhesive layer possibly present between the label film 1 and the printed image) is not shown here).
  • a label (4d in FIG. 6b) it is also conceivable for a label (4d in FIG. 6b) to be embedded on the upper side in the printed image 3 or printed over the printed image 3 to carry a magnetic strip 37 on which information is electronically stored and read out in a manner known per se can.
  • a cover layer 36 it can also be advisable here to provide a cover layer 36. But basically it is too conceivable to print the magnetic strip 37 on the underside of the label 4d. The magnetic strip 37 is thus securely embedded in the plastic when the substrate is molded on.
  • a loop-shaped conductor track 38 formed as an antenna and made of an electrically conductive printing ink is printed on the underside of the label 4e.
  • the printed conductor 38 is preferably formed by depositing a metal layer, e.g. by galvanic means or by another method such as, for example, "electroless plating", reinforced and then connected at both ends to a glued-on chip 39.
  • conductor track 38 and chip 39 are also securely embedded in the plastic. This makes it much easier to manufacture such a chip card than is possible with known methods (see, for example, EP-B1-0 350 179) in which the circuit is initially set up separately.
  • a kinegram 40 or hologram in a label 4f according to FIG. 6d, which is either embedded in the printed image 3 or applied above it.
  • a kinegram or hologram which covers the entire card or at least a large area of the later card.
  • the printed image 3 is printed on the kinegram / hologram.
  • the die-cut labels and the injection mold have exactly the outer dimensions of the finished plastic card, so that when the IML process is carried out, the finished card is produced, of which, at most, the card was produced during the injection molding process Burrs must be removed sen.
  • the IML method is carried out in the same way as it was already explained in connection with FIGS. 1-5 above, with the difference that the outer dimensions of the stamped labels and the injection mold compared to the finished plastic card have an excess of one or more millimeters.
  • the resulting raw cards are then reduced to the final dimensions of the card by means of a punching process, a peripheral edge preferably being removed. This punching process advantageously also removes the burrs that formed on the edge of the raw card during the spraying process.
  • the raw cards can be punched individually or in a stack.
  • the same device and method can be used for punching in the stack, which are shown in FIG. 8 and have already been described in connection with the punching of the raw labels.
  • the stack 53 is the stack of raw cards
  • the partial stack 53a is the partial stack of the finished cards.
  • the production process for labeled plastic cards can be made even more reliable by the production of raw cards with excessive dimensions and subsequent punching out of the finished cards. In particular, this means that the requirements for the application of the labels in the injection molding form can be reduced, so that in individual cases there is even no need to electrically charge the labels.
  • the invention results in a method with which a plastic card or disk printed on one or two sides with graphic or functional elements can be produced simply and securely

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Procédé de production de cartes (22) ou de disques en matière plastique, en particulier sous forme de cartes intelligentes, munies d'une étiquette (4) imprimée sur une ou sur leurs deux faces, suivant la méthode d'étiquetage dans le moule (IML), procédé dans lequel on imprime une feuille d'étiquette mince, de grande surface, composée d'une première matière plastique, la feuille d'étiquette imprimée est subdivisée en une pluralité d'étiquettes imprimées individuelles (4), au moins l'une des étiquettes (4) est insérée dans un moule à injection (11), cependant qu'un substrat de carte (21) composé d'une deuxième matière plastique est injecté sur l'étiquette insérée (4), ce substrat formant, avec l'étiquette (4), la carte (22) ou le disque en matière plastique, l'étiquette insérée (4) étant maintenue à plat sur une paroi (14) du moule à injection (11), lors du processus d'injection. Une production largement exempte de défauts est obtenue grâce au fait que le maintien de l'étiquette (4) sur la paroi (14) du moule à injection (11) s'effectue électrostatiquement.
PCT/CH1996/000151 1995-05-02 1996-04-25 Procede de production de cartes ou de disques en matiere plastique munis d'une etiquette imprimee sur une ou sur leurs deux faces WO1996034730A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU53302/96A AU5330296A (en) 1995-05-02 1996-04-25 Process for producing plastic cards or discs with a printed label on one or both sides

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CH1251/95-6 1995-05-02
CH125195 1995-05-02
US56304895A 1995-11-27 1995-11-27
US08/563,048 1995-11-27
CH102/96 1996-01-15
CH10296 1996-01-15

Publications (1)

Publication Number Publication Date
WO1996034730A1 true WO1996034730A1 (fr) 1996-11-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH1996/000151 WO1996034730A1 (fr) 1995-05-02 1996-04-25 Procede de production de cartes ou de disques en matiere plastique munis d'une etiquette imprimee sur une ou sur leurs deux faces

Country Status (2)

Country Link
AU (1) AU5330296A (fr)
WO (1) WO1996034730A1 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997018075A1 (fr) * 1995-11-10 1997-05-22 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Stratifie de recouvrement pour cartes en matiere plastique
WO1997043103A1 (fr) * 1996-05-14 1997-11-20 Hans Auer Procede pour produire des corps moules munis d'etiquettes imprimees suivant le procede d'etiquetage dans le moule (iml) et etiquette appropriee s'utilisant dans un procede d'etiquetage dans un moule (iml)
EP0872332A2 (fr) * 1997-04-15 1998-10-21 KLÖCKNER DESMA SCHUHMASCHINEN GmbH Procédé de fabrication de chaussures
GB2326372A (en) * 1997-06-21 1998-12-23 Movevirgo Limited Moulding method and apparatus
WO2000067004A1 (fr) * 1999-05-03 2000-11-09 General Electric Company Systeme et procede pour quantifier les defauts de presentation dans des pieces plastiques moulees
US6416706B1 (en) * 2000-02-15 2002-07-09 Sas Automation Ltd. Molding apparatus and method using a robot to introduce and insert into a mold
FR2827310A1 (fr) * 2001-07-16 2003-01-17 Cit Alcatel Procede de galvanisation partielle d'une piece obtenue par moulage-injection
DE10204348A1 (de) * 2002-02-05 2003-11-20 Orga Kartensysteme Gmbh Spritzgusswerkzeug zur Herstellung einer Kunststoffkarte, insbesondere einer Chipkarte, sowie ein Verfahren zur Herstellung einer derartigen Kunststoffkarte
GB2408960A (en) * 2003-12-12 2005-06-15 Nokia Corp In-mould labelling
FR2895118A1 (fr) * 2005-12-15 2007-06-22 Arjowiggins Security Soc Par A Film de pelliculage incorporant une puce
DE102007050525A1 (de) * 2007-10-19 2009-04-23 Mann + Hummel Gmbh Filtereinrichtung und Verfahren zur Herstellung derselben
EP2378846A1 (fr) * 2011-01-25 2011-10-19 Bayer Material Science AG Surface de produit décorative dotée d'une fonction de plaque conductrice

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1372909A (fr) * 1963-10-25 1964-09-18 Procédé de fabrication d'objets décorés par moulage de résines artificielles
US3270101A (en) * 1963-04-01 1966-08-30 Kaumagraph Co Method of using static charge to decorate molded thermoplastic articles
EP0249363A2 (fr) * 1986-06-11 1987-12-16 Peerless Plastics Packaging Limited Fabrication d'articles en plastique moulés
JPH02289317A (ja) * 1989-04-28 1990-11-29 Pentel Kk インモールド成形装置
EP0412893A1 (fr) * 1989-08-07 1991-02-13 Schlumberger Industries Procédé de réalisation de corps de carte et de cartes à graphisme, et corps de carte ainsi obtenus
DE4013071A1 (de) * 1990-04-21 1991-06-13 Gerhard Busch Gmbh Graphische Vertkale stanzvorrichtung
EP0481557A1 (fr) * 1990-10-19 1992-04-22 Schlumberger Industries Procédé de fabrication de carte à mémoire apte à recevoir une image photographique et carte ainsi obtenue
EP0488485A2 (fr) * 1990-11-27 1992-06-03 MANNESMANN Aktiengesellschaft Procédé et dispositif pour fabriquer une carte, à circuit intégré, décorée
EP0606118A2 (fr) * 1989-05-26 1994-07-13 ESEC (Far East) Limited Procédé de fabrication d'une carte en matière plastique
CH684528A5 (de) * 1994-02-05 1994-10-14 Hans Auer Verfahren zur Herstellung von bedruckten Smart Cards.

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3270101A (en) * 1963-04-01 1966-08-30 Kaumagraph Co Method of using static charge to decorate molded thermoplastic articles
FR1372909A (fr) * 1963-10-25 1964-09-18 Procédé de fabrication d'objets décorés par moulage de résines artificielles
EP0249363A2 (fr) * 1986-06-11 1987-12-16 Peerless Plastics Packaging Limited Fabrication d'articles en plastique moulés
JPH02289317A (ja) * 1989-04-28 1990-11-29 Pentel Kk インモールド成形装置
EP0606118A2 (fr) * 1989-05-26 1994-07-13 ESEC (Far East) Limited Procédé de fabrication d'une carte en matière plastique
EP0412893A1 (fr) * 1989-08-07 1991-02-13 Schlumberger Industries Procédé de réalisation de corps de carte et de cartes à graphisme, et corps de carte ainsi obtenus
DE4013071A1 (de) * 1990-04-21 1991-06-13 Gerhard Busch Gmbh Graphische Vertkale stanzvorrichtung
EP0481557A1 (fr) * 1990-10-19 1992-04-22 Schlumberger Industries Procédé de fabrication de carte à mémoire apte à recevoir une image photographique et carte ainsi obtenue
EP0488485A2 (fr) * 1990-11-27 1992-06-03 MANNESMANN Aktiengesellschaft Procédé et dispositif pour fabriquer une carte, à circuit intégré, décorée
CH684528A5 (de) * 1994-02-05 1994-10-14 Hans Auer Verfahren zur Herstellung von bedruckten Smart Cards.

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 15, no. 57 (M - 1080) 12 February 1991 (1991-02-12) *

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997018075A1 (fr) * 1995-11-10 1997-05-22 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Stratifie de recouvrement pour cartes en matiere plastique
WO1997043103A1 (fr) * 1996-05-14 1997-11-20 Hans Auer Procede pour produire des corps moules munis d'etiquettes imprimees suivant le procede d'etiquetage dans le moule (iml) et etiquette appropriee s'utilisant dans un procede d'etiquetage dans un moule (iml)
EP0872332A2 (fr) * 1997-04-15 1998-10-21 KLÖCKNER DESMA SCHUHMASCHINEN GmbH Procédé de fabrication de chaussures
DE19715551A1 (de) * 1997-04-15 1998-10-22 Kloeckner Desma Schuhmaschinen Verfahren zur Schuhherstellung
DE19715551C2 (de) * 1997-04-15 2000-01-27 Kloeckner Desma Schuhmaschinen Verfahren zur Schuhherstellung
EP0872332A3 (fr) * 1997-04-15 2000-03-22 KLÖCKNER DESMA SCHUHMASCHINEN GmbH Procédé de fabrication de chaussures
GB2326372A (en) * 1997-06-21 1998-12-23 Movevirgo Limited Moulding method and apparatus
GB2326372B (en) * 1997-06-21 2002-01-30 Movevirgo Ltd Moulding method and apparatus
US6868371B1 (en) 1999-05-03 2005-03-15 General Electric Company System and method to quantify appearance defects in molded plastic parts
WO2000067004A1 (fr) * 1999-05-03 2000-11-09 General Electric Company Systeme et procede pour quantifier les defauts de presentation dans des pieces plastiques moulees
US6416706B1 (en) * 2000-02-15 2002-07-09 Sas Automation Ltd. Molding apparatus and method using a robot to introduce and insert into a mold
FR2827310A1 (fr) * 2001-07-16 2003-01-17 Cit Alcatel Procede de galvanisation partielle d'une piece obtenue par moulage-injection
US6764626B2 (en) 2001-07-16 2004-07-20 Alcatel Method of galvanizing part of a piece obtained by injection molding
EP1277852A1 (fr) * 2001-07-16 2003-01-22 Alcatel Procede de galvanisation partielle d'une piece obtenue par moulage-injection
DE10204348A1 (de) * 2002-02-05 2003-11-20 Orga Kartensysteme Gmbh Spritzgusswerkzeug zur Herstellung einer Kunststoffkarte, insbesondere einer Chipkarte, sowie ein Verfahren zur Herstellung einer derartigen Kunststoffkarte
GB2408960A (en) * 2003-12-12 2005-06-15 Nokia Corp In-mould labelling
GB2408960B (en) * 2003-12-12 2008-01-30 Nokia Corp In-mould labelling
FR2895118A1 (fr) * 2005-12-15 2007-06-22 Arjowiggins Security Soc Par A Film de pelliculage incorporant une puce
WO2007071866A2 (fr) * 2005-12-15 2007-06-28 Arjowiggins Security Film de pelliculage incorporant une puce
WO2007071866A3 (fr) * 2005-12-15 2007-08-16 Arjowiggins Security Film de pelliculage incorporant une puce
DE102007050525A1 (de) * 2007-10-19 2009-04-23 Mann + Hummel Gmbh Filtereinrichtung und Verfahren zur Herstellung derselben
EP2378846A1 (fr) * 2011-01-25 2011-10-19 Bayer Material Science AG Surface de produit décorative dotée d'une fonction de plaque conductrice

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