WO1996032744A1 - Process for producing a support and device for implementing it - Google Patents

Process for producing a support and device for implementing it Download PDF

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Publication number
WO1996032744A1
WO1996032744A1 PCT/DE1996/000637 DE9600637W WO9632744A1 WO 1996032744 A1 WO1996032744 A1 WO 1996032744A1 DE 9600637 W DE9600637 W DE 9600637W WO 9632744 A1 WO9632744 A1 WO 9632744A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact elements
semiconductor chip
lead frame
contact
mold
Prior art date
Application number
PCT/DE1996/000637
Other languages
German (de)
French (fr)
Inventor
Jürgen Fischer
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1996032744A1 publication Critical patent/WO1996032744A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • carrier elements In card-shaped data carriers, so-called chip cards, semiconductor chip housings referred to as carrier elements are introduced, for example glued, into a card-shaped plastic housing.
  • Today's carrier elements usually consist of a copper-laminated glass epoxy film, structures being etched from the copper laminate, which represent contact fields and which are connected, for example by means of bonding wires, to a semiconductor chip arranged on the glass epoxy film or in a recess in the glass epoxy film, in order to communicate of the semiconductor chip with a reader into which the chip card is inserted.
  • carrier elements are also known in which the semiconductor chips are arranged on one of a plurality of electrically conductive contact elements which are connected to a lead frame during production and protrude from this lead frame in the middle thereof, and free ends there the. These contact elements are separated from one another by slots within the frame.
  • a leadframe carrying such contact elements is usually referred to as a leadframe.
  • the semiconductor chip and at least some of the contact elements are usually encapsulated with a plastic compound.
  • the two parts of a casting mold are brought into contact with the two sides of the lead frame and the cavities of the casting mold are filled with a plastic compound, so that the semiconductor chip and the bonding wires connecting it to the contact elements are surrounded by the plastic compound, so that the plastic compound provides protection against external influences.
  • part of the casting mold must have a flat surface have, so that no plastic mass reaches this side of the leadframe and thus the plastic mass protecting the semiconductor chip is formed only around this and in the slots between the contact elements.
  • FIG. 2 A section through the mold parts and the lead frame is shown there, the section running through a slot between the outer contact elements 1 and thus only the middle contact element 1 a being shown in section.
  • the first, lower mold part 6 has a flat surface on which the contact elements 1, la of the leadframe rest.
  • the second, upper mold part 7 has a cavity 13 into which the semiconductor chip 3 and the bonding wires 12 connecting it to the contact elements 1 come to rest.
  • Slits 2 are formed between the outer contact elements 1 and the middle contact element 1 a, which bring about electrical insulation of the contact elements 1, 1 a.
  • the object of the present invention is therefore to occur in a method for producing a carrier element von Bleed and Flash to prevent and specify a device for performing such a method.
  • the contact elements are pressed so firmly against the plane mold part during the filling of the plastic mass into the mold that no plastic mass gets from the cavity between the mold parts and the contact elements can.
  • the hold-down devices remain in their predetermined position in the manner according to the invention during the entire casting process.
  • the resulting holes in the plastic compound enveloping the semiconductor chip can advantageously be filled with an adhesive in a further process step. Since an adhesive with the plastic compound and also with the contact element regions closing the holes in the base area has better adhesion than the plastic compound with the contact elements, overall better adhesion of the plastic compound to the lead frame is achieved. It is particularly advantageous here if the hold-downs have a conical shape, so that the adhesive plug which also forms in the chronically running holes has a quasi-rivet effect.
  • FIG. 1 shows a cross section through a casting mold according to the invention with the lead frame and located between the casting mold parts
  • FIG. 3 shows a perspective illustration of a carrier element produced by means of the method according to the invention.
  • FIG. 1 shows a cross section through parts of a device according to the invention for carrying out the method according to the invention.
  • Contact elements 1, 1 a have been brought between the two parts of a casting mold 6, 8 by means not shown.
  • the cut runs through slots between the outer contact elements 1 and cuts a middle contact element 1 a.
  • a semiconductor chip 3 is arranged on the middle contact element 1 a and is electrically connected to the outer contact elements 1 by means of bonding wires 12.
  • two or more such lead frames are formed side by side in an endless band, on the outer edges of which there is a perforation.
  • the means for introducing the lead frame between the two parts of the casting mold 6, 8 can thus be, for example, toothed wheels, the teeth of which engage in these perforation holes and thus transport the tape containing the lead frames.
  • a first casting mold part 6, which has a flat surface, and a second casting mold part 8, which has a cavity is brought into contact with the lead frame.
  • the semiconductor chip 3 and the bond wires 12 come to lie in the cavity.
  • the second mold part 8 has at least one hold-down device 9 which presses the free ends of the contact elements 1, 1 a against the flat surface of the first mold part 6.
  • FIG. 3 shows such a support element.
  • the contact elements 1, 1 a are now held only by the plastic compound 4.
  • This has holes where the hold-down devices were previously. These can be filled with an adhesive in the manner according to the invention. Since an adhesive has better adhesion to both the plastic mass and the regions of the contact elements that close the lower region of the holes than the plastic mass with the contact elements, this leads to a significantly increased stability of the carrier element.
  • the hold-down devices 9 have a conical shape as shown in FIG. 1, the adhesive hardened in the holes in the plastic compound 4 also has a conical shape and thus has a quasi riveting effect.
  • the adhesive is of course expediently filled into the holes when the contact elements are still in connection with the lead frame and can thus be transported in the perforated band by means of gearwheels from the processing station to the processing station.
  • the means for moving the mold parts can be any arms connected to the mold parts, which can be moved, for example by means of a motor, in such a way that the mold parts can be moved between an open and a closed position.

Abstract

In order to prevent bleed and flash in the extrusion coating of a semiconductor chip (3) fitted on a lead frame (1) pressure pads (9) are provided in one of two casting mould halves (6, 8) in such a way that the free ends of the lead frame contacts (1, 1a) are pressed by one mould half (8) against the other (6). The holes thus made in the plastic material (4) surrounding the semiconductor chip (3) are advantageously filled with adhesive.

Description

Beschreibungdescription
Verfahren zum Herstellen eines Trägereie entes und Vorrich- tung zur Durchführung des VerfahrensProcess for producing a carrier and device for carrying out the process
Bei kartenförmigen Datenträgern, sogenannten Chipkarten, wer¬ den als Trägerelemente bezeichnete Halbleiterchipgehäuse in ein kartenförmiges Plastikgehäuse eingebracht, beispielsweise geklebt. Heutige Trägerelemente bestehen meist aus einem kup¬ ferlaminierten Glasepoxidfilm, wobei aus den Kupferlaminat Strukturen geätzt sind, die Kontaktfelder darstellen und die beispielsweise mittels Bonddrähte mit einem auf dem Glasepo¬ xidfilm oder in einer Aussparung des Glasepoxidfilms angeord- neten Halbleiterchip verbunden sind, um eine Kommunikation des Halbleiterchips mit einem Lesegerät, in das die Chipkarte eingeführt ist, zu ermöglichen.In card-shaped data carriers, so-called chip cards, semiconductor chip housings referred to as carrier elements are introduced, for example glued, into a card-shaped plastic housing. Today's carrier elements usually consist of a copper-laminated glass epoxy film, structures being etched from the copper laminate, which represent contact fields and which are connected, for example by means of bonding wires, to a semiconductor chip arranged on the glass epoxy film or in a recess in the glass epoxy film, in order to communicate of the semiconductor chip with a reader into which the chip card is inserted.
Es sind jedoch auch schon Trägerelemente bekannt, bei denen die Halbleiterchips auf einem von mehreren elektrisch leitfä¬ higen Kontaktelementen angeordnet ist, die während der Ferti¬ gung mit einem Leiterrahmen verbunden sind und von diesem Leiterrahmen in dessen Mitte ragen, und dort freie Enden bil¬ den. Diese Kontaktelemente sind innerhalb des Rahmens durch Schlitze voneinander getrennt. Ein solcher Kontaktelemente tragender Leiterrahmen wird üblicherweise als Leadframe be¬ zeichnet. Der Halbleiterchip und zumindest ein Teil der Kon¬ taktelemente wird meist mit einer Kunststoffmasse umgössen. Hierzu werden die zwei Teile einer Gießform in Kontakt mit den zwei Seiten des Leadframes gebracht und die Hohlräume der Gießform mit einer Kunststoffmasse gefüllt, so daß der Halb¬ leiterchip und die ihn mit den Kontaktelementen verbindenden Bonddrähte von der Kunststoffmasse umgeben sind, so daß die Kunststoffmasse einen Schutz vor äußeren Einflüssen bewirkt.However, carrier elements are also known in which the semiconductor chips are arranged on one of a plurality of electrically conductive contact elements which are connected to a lead frame during production and protrude from this lead frame in the middle thereof, and free ends there the. These contact elements are separated from one another by slots within the frame. A leadframe carrying such contact elements is usually referred to as a leadframe. The semiconductor chip and at least some of the contact elements are usually encapsulated with a plastic compound. For this purpose, the two parts of a casting mold are brought into contact with the two sides of the lead frame and the cavities of the casting mold are filled with a plastic compound, so that the semiconductor chip and the bonding wires connecting it to the contact elements are surrounded by the plastic compound, so that the plastic compound provides protection against external influences.
Wenn auf einer Seite des Trägerelements eine plane Fläche ge¬ wünscht ist, so muß ein Teil der Gießform eine plane Fläche aufweisen, so daß auf diese Seite des Leadframes keine Kunst- Stoffmasse gelangt und somit die den Halbleiterchip schüt¬ zende Kunststoffmasse nur um diesen und in den Schlitzen zwi¬ schen den Kontaktelementen ausgebildet ist.If a flat surface is desired on one side of the carrier element, part of the casting mold must have a flat surface have, so that no plastic mass reaches this side of the leadframe and thus the plastic mass protecting the semiconductor chip is formed only around this and in the slots between the contact elements.
Dieser Fall ist in Figur 2 dargestellt. Dort ist ein Schnitt durch die Gießformteile und das Leadframe gezeigt, wobei der Schnitt durch einen Schlitz zwischen den äußeren Kontaktele¬ menten 1 verläuft und somit nur das mittlere Kontaktelement la geschnitten dargestellt ist. Das erste, untere Gießform¬ teil 6 weist eine plane Fläche auf, auf der die Kontaktele¬ mente 1, la des Leadframes aufliegen. Das zweite, obere Gie߬ formteil 7 weist einen Hohlraum 13 auf, in den der Halblei¬ terchip 3 und die ihn mit den Kontaktelementen 1 verbindenden Bonddrähte 12 zu liegen kommen. Zwischen den äußeren Kontakt¬ elementen 1 und dem mittleren Kontaktelement la sind Schlitze 2 ausgebildet, die eine elektrische Isolierung der Kontakt¬ elemente 1, la bewirken. Wird nun eine Kunststoffmasse in den Hohlraum 13 der Gießform 6, 7 eingefüllt, was meist unter Druck geschieht, so kommt es häufig vor, daß zum einen Kunst- stoffmasse auch unter den Rand des ersten Gießformteils 7 ge¬ langt und dort als sogenannter Bleed 10 aushärtet. Zum ande¬ ren wird die Kunststoffmasse auch in die Schlitze 2 gedrückt und kann von dort zwischen die Kontaktelemente und das erste Gießformteil 6 gelangen und dort als sogenannter Flash 10 aushärten. Bleed und Flash 10 sind teils nur Schönheitsfeh¬ ler, führen aber auch bei nachfolgenden Prozessen wie Löten, Oberflächengalvanik oder den Kontaktieren zu Haftungs- und aufgrund ungenügender elektrischer Leitfähigkeit zu Funkti- onsfehlern. Bleed und Flash müssen deshalb mit herkömmlichen Verfahren in einem zusätzlichen Arbeitsgang, dem "Deflashen" , entfernt werden. Dies geschieht entweder mit Wasserhochdruck, chemisch oder auch mechanisch mit Glaskugeln, Kirschkerngra¬ nulat oder ähnlichem.This case is shown in Figure 2. A section through the mold parts and the lead frame is shown there, the section running through a slot between the outer contact elements 1 and thus only the middle contact element 1 a being shown in section. The first, lower mold part 6 has a flat surface on which the contact elements 1, la of the leadframe rest. The second, upper mold part 7 has a cavity 13 into which the semiconductor chip 3 and the bonding wires 12 connecting it to the contact elements 1 come to rest. Slits 2 are formed between the outer contact elements 1 and the middle contact element 1 a, which bring about electrical insulation of the contact elements 1, 1 a. If a plastic mass is now poured into the cavity 13 of the casting mold 6, 7, which usually happens under pressure, it often happens that, on the one hand, plastic mass also reaches under the edge of the first casting mold part 7 and there as a so-called bleed 10 hardens. On the other hand, the plastic mass is also pressed into the slots 2 and from there it can get between the contact elements and the first mold part 6 and harden there as a so-called flash 10. Bleed and Flash 10 are only minor defects, but they also lead to functional defects in subsequent processes such as soldering, surface electroplating or contacting, leading to liability and, due to insufficient electrical conductivity. Bleed and flash must therefore be removed using conventional methods in an additional operation, the "deflashing". This is done either with high water pressure, chemically or mechanically with glass balls, cherry stone granules or the like.
Die Aufgabe vorliegender Erfindung ist es somit , bei einem Verfahren zum Herstellen eines Trägerelementes das Auftreten von Bleed und Flash zu verhindern sowie eine Vorrichtung zur Durchführung eines solchen Verfahrens anzugeben.The object of the present invention is therefore to occur in a method for producing a carrier element von Bleed and Flash to prevent and specify a device for performing such a method.
Die Aufgabe wird durch ein Verfahren gemäß dem Anspruch 1 und eine Vorrichtung gemäß dem Anspruch 4 gelöst. Vorteilhafte Weiterbildungen der Erfindung sind in den Unteransprüchen angegeben.The object is achieved by a method according to claim 1 and a device according to claim 4. Advantageous developments of the invention are specified in the subclaims.
Durch die erfindungsgemäße Verwendung von Niederhaltern in dem den Hohlraum aufweisenden Gießformteil werden die Kon¬ taktelemente während des Einfüllens der Kunststoffmasse in den Hohlraum der Gießform so fest gegen das plane Gießform¬ teil gedrückt, daß keine Kunststoffmasse aus dem Hohlraum zwischen die Gießformteile und die Kontaktelemente gelangen kann. Die Niederhalter verharren dabei in erfindungsgemäßer Weise während des gesamten Gießvorgangε in ihrer vorgegebenen Position. Die dadurch entstehenden Löcher in der den Halblei¬ terchip umhüllenden Kunststoffmasse können in einem weiteren Verfahrensschritt in vorteilhafter Weise mit einem Klebstoff aufgefüllt werden. Da ein Klebstoff mit der Kunststoffmasse und auch mit den die Löcher im Bodenbereich abschließenden Kontaktelementbereichen eine bessere Haftung eingeht als die Kunststoffmasse mit den Kontaktelementen, wird dadurch eine insgesamt bessere Haftung der Kunststoffmasse auf dem Lead- frame erreicht. Besonders vorteilhaft ist es hierbei, wenn die Niederhalter eine konische Form aufweisen, so daß der sich in den ebenfalls chronisch verlaufenden Löchern ausbil¬ dende Klebstoffpfropf eine Quasi-Niet-Wirkung hat.Through the use of hold-down devices according to the invention in the mold part having the cavity, the contact elements are pressed so firmly against the plane mold part during the filling of the plastic mass into the mold that no plastic mass gets from the cavity between the mold parts and the contact elements can. The hold-down devices remain in their predetermined position in the manner according to the invention during the entire casting process. The resulting holes in the plastic compound enveloping the semiconductor chip can advantageously be filled with an adhesive in a further process step. Since an adhesive with the plastic compound and also with the contact element regions closing the holes in the base area has better adhesion than the plastic compound with the contact elements, overall better adhesion of the plastic compound to the lead frame is achieved. It is particularly advantageous here if the hold-downs have a conical shape, so that the adhesive plug which also forms in the chronically running holes has a quasi-rivet effect.
Die Erfindung soll nachfolgend anhand eines Ausführungsbei- spiels mit Hilfe von Figuren näher erläutert werden. Dabei zeigen:The invention will be explained in more detail below on the basis of an exemplary embodiment with the aid of figures. Show:
Figur 1 einen Querschnitt durch eine erfindungsgemäße Gie߬ form mit sich zwischen den Gießformteilen befinden- den Leadframe und Figur 3 eine perspektivische Darstellung eines mittels des erfindungsgemäßen Verfahrens hergestellten Träger¬ elements.FIG. 1 shows a cross section through a casting mold according to the invention with the lead frame and located between the casting mold parts FIG. 3 shows a perspective illustration of a carrier element produced by means of the method according to the invention.
Figur 1 zeigt einen Querschnitt durch Teile einer erfindungs¬ gemäßen Vorrichtung zur Durchführung des erfindungsgemäßen Verfahrens. Kontaktelemente 1, la sind mit nicht dargestell¬ ten Mitteln zwischen die zwei Teile einer Gießform 6, 8 ge¬ bracht worden. Der Schnitt verläuft dabei durch Schlitze zwi- sehen den äußeren Kontaktelementen 1 und schneidet ein mitt¬ leres Kontaktelement la. Auf dem mittleren Kontaktelement la ist ein Halbleiterchip 3 angeordnet, der mittels Bonddrähte 12 mit den äußeren Kontaktelementen 1 elektrisch verbunden ist. Üblicherweise sind zwei oder mehrere solcher Leadframes nebeneinander in einem Endlosband gebildet, an dessen äußeren Rändern sich eine Perforierung befindet. Das Mittel zum Ein¬ bringen des Leadframes zwischen die zwei Teile der Gießform 6, 8 können somit zum Beispiel Zahnräder sein, deren Zähne in diese Perforierungslöcher eingreifen und damit das die Lead- frames beinhaltende Band transportieren. Nachdem das Lead¬ frame in die gewünschte Position gebracht ist, wird ein er¬ stes, eine plane Fläche aufweisendes Gießformteil 6 und ein zweites, einen Hohlraum aufweisendes Gießformteil 8 in Kon¬ takt mit dem Leadframe gebracht. Dabei kommt der Halbleiter- chip 3 und die Bonddrähte 12 in dem Hohlraum zu liegen. Das zweite Gießformteil 8 weist zumindest einen Niederhalter 9 auf, der die freien Enden der Kontaktelemente 1, la gegen die plane Fläche des ersten Gießformteils 6 drückt. Wenn nun eine Kunststoffmasse in den Hohlraum des ersten Gießformteils 8 gepreßt wird, so wird diese durch die Niederhalter in erfin¬ dungsgemäßer Weise daran gehindert, zwischen die Kontaktele¬ mente 1, la und die mit diesen in Kontakt stehenden Bereiche der Gießformteile 6, 8 zu gelangen. Auf diese Weise kann kein Bleed und Flash entstehen, so daß ein nachfolgender Bearbei- tungsvorgang, um Bleed und Flash wieder zu entfernen, entfal¬ len kann. Nach dem Aushärten der Kunststoffmasse werden die Gießformteile 6, 8 wieder von dem Leadframe entfernt. Die Kontaktelemente können nun aus dem sie tragenden Leiterrahmen ausgestanzt werden, so daß ein Trägerelement entsteht, das in eine Plastikkarte eingebracht, beispielsweise eingeklebt, werden kann.FIG. 1 shows a cross section through parts of a device according to the invention for carrying out the method according to the invention. Contact elements 1, 1 a have been brought between the two parts of a casting mold 6, 8 by means not shown. The cut runs through slots between the outer contact elements 1 and cuts a middle contact element 1 a. A semiconductor chip 3 is arranged on the middle contact element 1 a and is electrically connected to the outer contact elements 1 by means of bonding wires 12. Usually two or more such lead frames are formed side by side in an endless band, on the outer edges of which there is a perforation. The means for introducing the lead frame between the two parts of the casting mold 6, 8 can thus be, for example, toothed wheels, the teeth of which engage in these perforation holes and thus transport the tape containing the lead frames. After the lead frame is brought into the desired position, a first casting mold part 6, which has a flat surface, and a second casting mold part 8, which has a cavity, is brought into contact with the lead frame. The semiconductor chip 3 and the bond wires 12 come to lie in the cavity. The second mold part 8 has at least one hold-down device 9 which presses the free ends of the contact elements 1, 1 a against the flat surface of the first mold part 6. If a plastic mass is now pressed into the cavity of the first mold part 8, this is prevented by the hold-down device in accordance with the invention between the contact elements 1, 1 a and the areas of the mold parts 6, 8 that are in contact with them reach. In this way, no bleed and flash can occur, so that a subsequent processing operation to remove bleed and flash can be omitted. After the plastic compound has hardened, the mold parts 6, 8 are removed again from the lead frame. The Contact elements can now be punched out of the lead frame carrying them, so that a carrier element is created which can be inserted, for example glued, into a plastic card.
Figur 3 zeigt ein solches Trägerelement. Die Kontaktelemente 1, la werden nun nur noch durch die Kunststoffmasse 4 gehal¬ ten. Diese weist dort, wo zuvor die Niederhalter waren, Lö¬ cher auf. Diese können in erfindungsgemäßer Weise mit einem Klebstoff gefüllt werden. Da ein Klebstoff sowohl mit der Kunststoffmasse als auch mit dem den unteren Bereich der Löcher abschließenden Bereichen der Kontaktelemente eine bes¬ sere Haftung eingeht als die Kunststoffmasse mit den Kontakt¬ elementen, führt dies zu einer deutlich erhöhten Stabilität des Trägerelements. Wenn die Niederhalter 9 wie in Figur 1 dargestellt, eine konische Form haben, so weist auch der in den Löchern der Kunststoffmasse 4 ausgehärtete Klebstoff eine konische Form auf und hat somit quasi eine Nietwirkung. Der Klebstoff wird natürlich zweckmäßigerweise in die Löcher ein- gefüllt, wenn die Kontaktelemente noch in Verbindung mit dem Leiterrahmen sind und somit in den perforierten Band mittels Zahnrädern von Bearbeitungsstation zu Bearbeitungsstation transportiert werden können.Figure 3 shows such a support element. The contact elements 1, 1 a are now held only by the plastic compound 4. This has holes where the hold-down devices were previously. These can be filled with an adhesive in the manner according to the invention. Since an adhesive has better adhesion to both the plastic mass and the regions of the contact elements that close the lower region of the holes than the plastic mass with the contact elements, this leads to a significantly increased stability of the carrier element. If the hold-down devices 9 have a conical shape as shown in FIG. 1, the adhesive hardened in the holes in the plastic compound 4 also has a conical shape and thus has a quasi riveting effect. The adhesive is of course expediently filled into the holes when the contact elements are still in connection with the lead frame and can thus be transported in the perforated band by means of gearwheels from the processing station to the processing station.
Die Mittel zum Bewegen der Gießformteile können beliebige, mit den Gießformteilen verbundene Arme sein, die beispiels¬ weise mittels eines Motors derart bewegt werden können, daß sich die Gießformteile zwischen einer offenen und einer ge¬ schlossenen Position bewegen lassen. The means for moving the mold parts can be any arms connected to the mold parts, which can be moved, for example by means of a motor, in such a way that the mold parts can be moved between an open and a closed position.

Claims

Patentansprüche claims
1. Verfahren zum Herstellen eines Trägerelementes, insbe¬ sondere zum Einbau in einen kartenförmigen Datenträger, wobei das Trägerelement mit einer Anzahl elektrisch leitfä¬ higer Kontaktelemente (1), die durch isolierende Schlitze (2) voneinander getrennt sind und von denen zumindest eines einen Halbleiterchip (3) trägt, gebildet ist und wobei der Halbleiterchip (3) derart von einer KunstStoffmasse (4) umgössen ist, daß ein Teilbereich (5) jedes Kontaktele¬ mentes (1) einseitig mit der Kunststoffmasse (4) in Kontakt ist und von dieser gehalten wird mit den Schritten: die mit einem Leiterrahmen verbundenen, von dem Leiterrah- men in dessen Mitte ragenden Kontaktelemente (1) mit zu¬ mindest einem darauf montierten Halbleiterchip (3) werden zwischen die zwei Teile einer Gießform (6, 8) gebracht, das erste, eine plane Fläche aufweisende Gießformteil (6) wird mit der dem Halbleiterchip (3) abgewandten Seite der Kontaktelemente (1) und das zweite, einen Hohlraum mit zu¬ mindest einem darin angeordneten Niederhalter (9) aufwei¬ sende Gießformteil (8) mit der dem Halbleiterchip (3) zu¬ gewandten Seite der Kontaktelemente (1) derart in Kontakt gebracht, daß nicht mit dem Leiterrahmen verbundene Enden der Kontaktelemente (1) durch den oder die Niederhalter (9) gegen das zweite Gießformteil (6) gedrückt werden, - der sich in dem Hohlraum des zweiten Gießformteils (8) befindenden Halbleiterchip (3) wird mit einer Kunststoff¬ masse (4) umgössen, - nach Aushärtung der Kunststoffmasse (4) werden die Gie߬ formteile (6, 8) von den Kontaktflächen (1) entfernt.1. A method for producing a carrier element, in particular for installation in a card-shaped data carrier, the carrier element having a number of electrically conductive contact elements (1) which are separated from one another by insulating slots (2) and at least one of which is a semiconductor chip (3) carries, is formed and the semiconductor chip (3) is encased in a plastic material (4) such that a partial area (5) of each contact element (1) is in contact with the plastic material (4) on one side and by the latter Holding is carried out with the steps: the contact elements (1) connected to a lead frame and projecting from the lead frame in the middle thereof with at least one semiconductor chip (3) mounted thereon are brought between the two parts of a casting mold (6, 8), the first casting mold part (6), which has a flat surface, is connected to the side of the contact elements (1) facing away from the semiconductor chip (3) and the second, a cavity with at least It is brought into contact with a hold-down part (8) arranged therein with the side of the contact elements (1) facing the semiconductor chip (3) in such a way that ends of the contact elements (1) which are not connected to the lead frame are brought into contact by the or the hold-down devices (9) are pressed against the second mold part (6), - the semiconductor chip (3) located in the cavity of the second mold part (8) is cast with a plastic compound (4), - after the plastic compound has hardened ( 4) the mold parts (6, 8) are removed from the contact surfaces (1).
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß in einem weiteren Schritt der oder die in der Kunststoffmasse (4) durch den oder die Niederhalter (9) bewirkten Löcher mit einem Klebe¬ mittel aufgefüllt werden. 2. The method according to claim 1, characterized in that in a further step the or in the plastic mass (4) through the or the hold-down (9) holes are filled with an adhesive.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet , daß in einem weiteren Schritt das Trägerelement aus dem Leiterrahmen ausgestanzt wird.3. The method according to claim 1 or 2, characterized in that in a further step the carrier element is punched out of the lead frame.
4. Vorrichtung zur Durchführung des Verfahrens gemäß An¬ spruch 1,4. Device for carrying out the method according to claim 1,
- mit Mitteln zum Zuführen des die Kontaktelemente (1) tra- genden Leiterrahmens zwischen die Teile einer Gießform (6,- With means for feeding the lead frame carrying the contact elements (1) between the parts of a casting mold (6,
8) , und8), and
- mit Mitteln zum Bewegen der Gießformteile (6, 8) gegen die zwei Seiten der Kontaktelemente derart, daß die nicht mit dem Leiterrahmen verbundenen Enden der Kontaktelemente (5) von in den zweiten Gießformteil (8) angeordneten Nieder¬ haltern (9) gegen das plane erste Gießformteil (6) ge¬ drückt werden. - With means for moving the mold parts (6, 8) against the two sides of the contact elements in such a way that the ends of the contact elements (5) which are not connected to the leadframe are held down in the second mold part (8) by holding-down devices (9) against the plane first mold part (6) are pressed.
PCT/DE1996/000637 1995-04-11 1996-04-10 Process for producing a support and device for implementing it WO1996032744A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19513797.3 1995-04-11
DE1995113797 DE19513797A1 (en) 1995-04-11 1995-04-11 Method for producing a carrier element and device for carrying out the method

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Publication Number Publication Date
WO1996032744A1 true WO1996032744A1 (en) 1996-10-17

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DE19732915C1 (en) * 1997-07-30 1998-12-10 Siemens Ag Manufacturing method for chip-module e.g. for credit card
DE19741921A1 (en) * 1997-09-23 1999-02-25 Siemens Ag Carrier element for semiconductor chip card data type carrier

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JPH02232943A (en) * 1989-03-07 1990-09-14 Mitsubishi Electric Corp Manufacture of resin molding
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