WO1993007647A1 - Optocoupleur monolithique - Google Patents
Optocoupleur monolithique Download PDFInfo
- Publication number
- WO1993007647A1 WO1993007647A1 PCT/SE1992/000580 SE9200580W WO9307647A1 WO 1993007647 A1 WO1993007647 A1 WO 1993007647A1 SE 9200580 W SE9200580 W SE 9200580W WO 9307647 A1 WO9307647 A1 WO 9307647A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- emitting diode
- substrate
- monolithic
- diode
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000004065 semiconductor Substances 0.000 claims abstract description 5
- 230000015556 catabolic process Effects 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 6
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 claims description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 claims 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims 1
- 239000002800 charge carrier Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000003491 array Methods 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 239000002775 capsule Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- -1 helium ions Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by at least one potential or surface barrier
- H01L31/173—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by at least one potential or surface barrier formed in, or on, a common substrate
Definitions
- Optocouplers are, today, common components which func-
- ⁇ 10 are normally comprised of a light-emitting diode and a photo-diode, which are mounted in one and the same capsule.
- a monolithic optocoupler is known from US-A 3,229,104,
- an optocoupler shall be capable of with ⁇ standing 4 kV DC without breakthrough. This can readily be achieved with two separate, capsule-mounted co po-
- a light-emitting diode 2 is placed on one end of a "semi-insulating" substrate 1 35 and a photo-diode is placed on the other end of the substrate.
- the components are embedded in plastic and the light emitted by the light-emitting diode is transmitted through the substrate, which may, for instance, consist of indium phosphide or gallium arsenide.
- Indium phosphide has, for instance, a refraction index of about 3.5 for the wavelengths con-.
- cerned 1.0-1.67 ⁇ m
- the encapsulating material may for example be an epoxy resin which may be provided with a filler which is "white" in the wavelength range.
- light-emitting diode is meant here all types of light-emitting diodes, including simple light-emitting diodes and also light-emitting diodes which produce coherent radiation, so-called semi-conductor lasers with double heterostructures, and so on, these diodes being considered equivalent to one another from the aspect of the present invention.
- the object of the present invention is to provide a monolithic optocoupler which is less prone to breakthrough than known optocouplers.
- This object is achieved in accordance with the invention by forming an electrically conductive channel on the substrate surface between the light-emitting diode and the light detector.
- channel shall not be understood to mean a space-limitation, but may, for instance, be understood to denote a large percentage of the substrate surface located between the components, or even the whole of this surface.
- a further improvement can be achieved by ⁇ placing a filter layer of suitable bandgap between the light-emitting diode and the substrate, thereby enabling a large proportion of those photons from the spectrum of the light-emitting diode that have the highest energy to be eliminated. These photons would otherwise generate charge carriers in the substrate which are disposed towards causing a voltage breakthrough. It is particularly important to eliminate those photons which have the highest energy, since the cross-section of the photoelectric effect tends, in certain cases, to be highly energy dependent. A particularly good effect can be achieved by combining a gradient-equalizing resistive channel with minimization of photons which generate photoconductivity.
- a resistive channel according to the invention can be obtained in different ways. According to one preferred embodiment, in which the substrate is comprised of semi- insulating indium phosphide, there is employed an ion implantation technique using 100 kV helium ions in an
- the main criterion is to obtain a suitably balanced high resistance across the optocoupler, for instance a resis ⁇ tance in the order of 100 Mohm.
- the resistivity is normally highly temperature-dependent, although this does not influence the inventive effect to any great extent.
- Figure 2 is a principle, highly schematic perspective view of the inventive monolithic optocoupler, which has not yet been encapsulated;
- Figure 3 is a sectioned view of one-half of a monolithic optocoupler constructed in accordance with one exempli- fying embodiment of the invention and shows the opto ⁇ coupler in more detail;
- Figure 4 is a view similar to Figure 3 and illustrates another embodiment of the invention.
- FIG. 2 illustrates an opto ⁇ coupler which comprises a substrate 1 having mounted thereon a light-emitting diode 2 and a photo-diode 3.
- the diodes may be different but can also be identically the same, since one and the same diode can serve either as a light-emitting diode or as a photo-diode, depending on how they are connected.
- the photo-diode or detector 3 may have a different construc ⁇ tion, for instance may be constructed as a photo-tran- sistor, without departing from the principle of the invention.
- Figure 3 illustrates by way of example a configuration which, can be used both as a photo-diode and as a light- emitting diode and which is constructed in accordance with the following criteria:
- each of the optocouplers manufactured comprised two mutually spaced diode arrays 2, 3, having a first doped n -layer 20 provided with a lead-in electrode 21, an active not-intentionally doped n -layer 22, a p-layer 23, a contact layer 24 and a lead-in electrode 25 ( Figure 3) .
- a forward voltage is applied, such a diode array will function as a light- emitting diode, and, conversely, will function as a photo-diode when an inverse or reverse voltage is ap ⁇ plied. Ions were implanted in the substrate surface between these two components in two 10 ⁇ bands 7 with
- the substrate was then divided into separate components, 6 mm long and 0.5 mm wide, with diode arrays at each end thereof, said diode arrays being connected by the two ion-implanted bands.
- the components were provided with lead-in conductors in a conventional manner and encapsulated in epoxy resin. A resistance of 100 Moh was measured between two lead-in electrodes 21. When tested, the components were found to withstand in operation a voltage of 4 kV, both DC and AC rms.
- one or both devices in the pair of devices may be placed on top of an appropriately doped layer 30 whose bandgap is so adapted that the high energy tail in the energy distribution of the photons of the light- emitting diode will be absorbed, in accordance with •
- the principle is illustrated in Figure 5. As shown, the light emitted from the light-emitting diode has a dis ⁇ tribution with a high energy tail. The tail photons have a much greater tendency to generate charge carriers in the substrate than the more numerous photons, close to the emission peak.
- the amount of photons detected will, admittedly, be reduced by a certain proportion, although the amount of charge carriers generated through photoelectric effect will, at the same time, be reduced by a much higher proportion, since at room temperature material of the type InP:Fe for instance, has a photo ionization cross-section which (for positive charge carriers) changes by more than two powers of ten over the relevant energy range.
- the provision of at least one resistive channel results in a reduction in the voltage gradients that occur because of the unavoidable presence of charge carriers in the substrate. Furthermore, the provision of a filter between the light source (the pn-junction of the light-emitting diode) and the substrate will also reduce the supply of charge carriers in the substrate, which further improves against breakdown of the coupler.
- the general principles and the conventional manufacturing methods of semi-conductors are well known, reference is made by way of example, with regard to material technology, to the monograph M.
- the InP-material is preferred at present, it is also possible to work with GaAs, which has similar properties with regard to light conduction and refrac ⁇ tive index, or, e.g., GaP in the event that a semi- isolating GaP-substrate will be made available. It is also possible to arrange several pairs of light-emitting diodes and photo-diodes on one and the same substrate.
Abstract
Optocoupleur monolithique constitué par une diode électroluminescente (2) et par une photodiode (3) éloignées réciproquement sur la surface d'un substrat à semi-conducteur, par exemple, un substrat à conductibilité intrinsèque InP. D'après l'invention, un ou plusieurs canaux résistants (7) sont placés entre la diode électroluminescente (2) et la photodiode (3), ce qui améliore considérablement les propriétés de tension disruptive de la structure.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9102844A SE469204B (sv) | 1991-10-01 | 1991-10-01 | Monolitisk optokopplare |
SE9102844-9 | 1991-10-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1993007647A1 true WO1993007647A1 (fr) | 1993-04-15 |
Family
ID=20383878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SE1992/000580 WO1993007647A1 (fr) | 1991-10-01 | 1992-08-24 | Optocoupleur monolithique |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2697592A (fr) |
SE (1) | SE469204B (fr) |
WO (1) | WO1993007647A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2344455A (en) * | 1998-12-01 | 2000-06-07 | Mitel Semiconductor Ab | Semiconductor device with low parasitic capacitance |
WO2005076375A1 (fr) * | 2004-02-05 | 2005-08-18 | Otkrytoe Aktsionernoe Obschestvo 'nauchno-Issledovatelsky Institut Girikond' | Emetteur photoluminescent, cellule photoelectrique a semi-conducteur et octron base sur ces derniers |
RU2642132C1 (ru) * | 2016-07-20 | 2018-01-24 | Федеральное Государственное Бюджетное Образовательное Учреждение Высшего Образования "Новосибирский Государственный Технический Университет" | Оптоэлектронное устройство |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3881113A (en) * | 1973-12-26 | 1975-04-29 | Ibm | Integrated optically coupled light emitter and sensor |
US4021834A (en) * | 1975-12-31 | 1977-05-03 | The United States Of America As Represented By The Secretary Of The Army | Radiation-resistant integrated optical signal communicating device |
US4275404A (en) * | 1979-10-05 | 1981-06-23 | Bell Telephone Laboratories, Incorporated | Monolithic opto-isolator |
EP0318883A1 (fr) * | 1987-12-02 | 1989-06-07 | Asea Brown Boveri Ab | Coupleur optique monolithique |
-
1991
- 1991-10-01 SE SE9102844A patent/SE469204B/sv not_active IP Right Cessation
-
1992
- 1992-08-24 AU AU26975/92A patent/AU2697592A/en not_active Abandoned
- 1992-08-24 WO PCT/SE1992/000580 patent/WO1993007647A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3881113A (en) * | 1973-12-26 | 1975-04-29 | Ibm | Integrated optically coupled light emitter and sensor |
US4021834A (en) * | 1975-12-31 | 1977-05-03 | The United States Of America As Represented By The Secretary Of The Army | Radiation-resistant integrated optical signal communicating device |
US4275404A (en) * | 1979-10-05 | 1981-06-23 | Bell Telephone Laboratories, Incorporated | Monolithic opto-isolator |
EP0318883A1 (fr) * | 1987-12-02 | 1989-06-07 | Asea Brown Boveri Ab | Coupleur optique monolithique |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2344455A (en) * | 1998-12-01 | 2000-06-07 | Mitel Semiconductor Ab | Semiconductor device with low parasitic capacitance |
US6287881B1 (en) | 1998-12-01 | 2001-09-11 | Mitel Semiconductor Ab | Semiconductor device with low parasitic capacitance |
WO2005076375A1 (fr) * | 2004-02-05 | 2005-08-18 | Otkrytoe Aktsionernoe Obschestvo 'nauchno-Issledovatelsky Institut Girikond' | Emetteur photoluminescent, cellule photoelectrique a semi-conducteur et octron base sur ces derniers |
GB2426628A (en) * | 2004-02-05 | 2006-11-29 | Otkrytoe Aktsionernoe Obschest | Photoluminescent radiator, semiconductor photocell and octron based thereon |
GB2426628B (en) * | 2004-02-05 | 2008-04-02 | Otkrytoe Aktsionernoe Obschest | Photoluminescent radiator, semiconductor photocell and optron based thereon |
RU2642132C1 (ru) * | 2016-07-20 | 2018-01-24 | Федеральное Государственное Бюджетное Образовательное Учреждение Высшего Образования "Новосибирский Государственный Технический Университет" | Оптоэлектронное устройство |
Also Published As
Publication number | Publication date |
---|---|
SE9102844L (sv) | 1993-04-02 |
SE9102844D0 (sv) | 1991-10-01 |
SE469204B (sv) | 1993-05-24 |
AU2697592A (en) | 1993-05-03 |
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