WO1992022101A1 - Procede de fabrication de filtres a micro-ondes, et filtres obtenus par ce procede - Google Patents

Procede de fabrication de filtres a micro-ondes, et filtres obtenus par ce procede Download PDF

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Publication number
WO1992022101A1
WO1992022101A1 PCT/US1992/004510 US9204510W WO9222101A1 WO 1992022101 A1 WO1992022101 A1 WO 1992022101A1 US 9204510 W US9204510 W US 9204510W WO 9222101 A1 WO9222101 A1 WO 9222101A1
Authority
WO
WIPO (PCT)
Prior art keywords
blank
housing
microwave filter
cavity
capacitance
Prior art date
Application number
PCT/US1992/004510
Other languages
English (en)
Inventor
Laurice J. West
Joel J. Ravmond
Original Assignee
California Amplifier
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by California Amplifier filed Critical California Amplifier
Publication of WO1992022101A1 publication Critical patent/WO1992022101A1/fr

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/201Filters for transverse electromagnetic waves
    • H01P1/205Comb or interdigital filters; Cascaded coaxial cavities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/007Manufacturing frequency-selective devices

Definitions

  • the present invention pertains to microwave filters and more particularly, to economical fabrication methods therefor and filters resulting therefrom.
  • Cavity microwave filter design is a well established art and practical designs exist, in particular, for combline and interdigital filters.
  • Such filters often are fabricated of several separately fabricated elements (e.g. cavity walls, resonators, frequency and coupling trimming devices and end resonator taps) which then have to be assembled to exacting tolerances to achieve the desired filter transmission parameters.
  • Such fabrication and assembly is costly in terms of labor man hours. Efforts, therefore, have been made to reduce the fabrication cost.
  • U.S. Patent 4,791,717 discloses a construction method, for an interdigital filter integrated into a down converter, which attempts to reduce the number of separate parts to be assembled by bending a specially cut piece of sheet metal to form part of a cavity housing.
  • the present invention is directed to microwave filters formed by a specially cut blank of conductive sheet material.
  • the blank is cut to define wall portions, demarked by bend lines, which can be bent to form a housing defining a substantially closed cavity.
  • extensions are formed integral with the blank for projecting into the cavity when the housing is formed.
  • extensions are formed integral with the blank for external connection to a microstrip circuit.
  • positioning stops are formed integral with the blank to facilitate aligned mounting of the housing on a microstrip circuit board.
  • grounding tabs are formed integral with the blank to facilitate connecting the housing with a microstrip circuit ground plane.
  • FIG. 1A is a plan view of a conductive blank embodiment suitable for forming into a microwave filter housing in accordance with the present invention
  • FIG. IB is a view of the area within the line IB of FIG. 1A illustrating another blank embodiment in accordance with the present invention
  • FIG. 1C is a view similar to FIG. IB illustrating another blank embodiment in accordance with the present invention
  • FIG. 2 is an isometric view illustrating a transitional phase in the formation of a microwave combline filter from the blank of FIG. 1;
  • FIG. 3 is an isometric view illustrating a transitional phase in the formation of a microwave combline filter from the blank of FIG. 1;
  • FIG. 4 is an isometric view illustrating a transitional phase using capacitance and coupling tabs in the formation of a microwave combline filter from the blank of FIG. 1;
  • FIG. 5 is an isometric view illustrating a transitional phase in the formation of a microwave combline filter from the blank of FIG. 1;
  • FIG. 6 is an isometric view of a microwave combline filter embodiment formed from the blank of FIG. 1 in accordance with the present invention
  • FIG. 7 is an isometric view illustrating the microwave combline filter of FIG. 6 installed in a microstrip circuit
  • FIG. 8 is an enlarged view of the area within the line 8 of FIG. 5;
  • FIG. 9 is an enlarged view of the area within the line 9 of FIG. 6;
  • FIG. 10 is an isometric view of another microwave combline filter embodiment in accordance with the present invention.
  • FIG. 11 is an enlarged view of the area within the line 11 of FIG. 10;
  • FIG. 12 is an isometric view of a microwave interdigital filter embodiment in accordance with the present invention;
  • FIG. 13 is a view similar to FIG. 7 illustrating another filter embodiment in accordance with the present invention installed in a microstrip circuit;
  • FIG. 14 is a view similar to FIG. 7 illustrating another filter embodiment in accordance with the present invention installed in a microstrip circuit
  • FIG. 15 is a plan view of another embodiment of a resonator portion of the blank of FIG. 1;
  • FIG. 16 is an isometric view of another resonator embodiment formed of the resonator portion of FIG. 15 ;
  • FIG. 17 is an isometric view of another embodiment of a tap portion of the blank of FIG. 1.
  • the present invention is directed to a method for economically fabricating microwave filters and to the filters produced as a result thereof.
  • a blank 20, fabricated from a sheet of conductive material e.g. copper, brass or aluminum; brass or aluminum may be silver plated to facilitate soldering and improve conductivity
  • FIG. 1A is formed as shown in the transitional steps of FIGS. 2 through 5 into the housing 22 of FIG. 6 defining a cavity 23 therein.
  • the adjoining edges of the formed blank are bonded in a manner well known in the art (e.g. soldering or welding) to complete fabrication of the filter 30.
  • the blank 20 may be fabricated by standard methods (e.g. stamping, etching, cutting, or laser milling) in sufficient numbers for a production run and economically stored until needed for assembly.
  • the fabrication method used for the blank may also be used to simultaneously create bend lines such as bend line 36 in FIG. 1A by weakening the material therealong (e.g. partial removal of material or intermittent holes or slots). Forming of the blank 20 into the housing 22 is then reduced to simple bending along the bend lines.
  • FIG. 1A is a plan view of a blank 20 fabricated from a sheet of electrically conductive material.
  • the blank 20 defines portions which correspond, respectively, to housing elements and structural elements in the housing 22.
  • the housing elements are housing walls, housing ends, resonators, resonator taps and grounding tabs.
  • the structural elements are fingers, stops and resonator stiffening flaps.
  • the blank 20 has contiguous wall portions 40, 42, 44, 46, and 48, 5 end portions 50 and 52 contiguous with wall portion 42, resonator portions 60, 62, 64 and 66 contiguous with wall portion 40, tap portions 70, 72 and grounding tab portions 73 corresponding to the housing walls, ends, resonators, taps and grounding tabs of the housing 22.
  • the tap portions 70, 72 are contiguous with, respectively, resonator portions 60, 66.
  • the 10 grounding tab portions 73 are defined in each of the end portions 50, 52.
  • the blank 20 has finger portions 76, stop portions 78 and flap portions 80 corresponding to the structural fingers, stops and flaps of the cavity 22.
  • the blank 20 also defines notches 81, tuning holes 82, 84, 86 and 15 88 and apertures 90, 92.
  • Bend lines 36, 100, 102, 104, 106, 108, 110, 112, 114, 116, 118 and 119 are defined in a manner similar to that described above relative to bend line 36.
  • exemplary finger portions 76 and notches 81 are designated on FIG.l.
  • Four notches 81a have a function which differs from that of the notches 81. The function of both will 0 be described in conjunction with FIG. 9.
  • FIG. IB illustrates another embodiment of the terminal resonator portions 60, 66 of blank 20.
  • FIG. IB is a view similar to the area within the line IB of FIG. 1A showing a capacitance tap portion 70a contiguous with a resonator portion 60a in a blank 20a.
  • the blank 20a is otherwise similar to 5 the blank 20.
  • Partition line 120 is defined in a manner similar to that described above relative to bend line 36. The purpose of partition line 120 will be described below.
  • FIG. 1C illustrates another embodiment of the terminal resonator portions 60, 66 of blank 20.
  • FIG. 1C is a view similar to FIG. IB showing a 0 coupling loop portion 70b contiguous with a wall portion 40b and adjacent a resonator portion 60b in a blank 20b.
  • the coupling loop portion has a bend line 121.
  • the blank 20b is otherwise similar to the blank 20.
  • the bend line 121 is defined in a manner similar to that described above relative to bend line 36.
  • the resonator portions 60, 62, 64 and 66 have been bent along bend lines 100, 102, 104 and 106 to form resonator elements 140, 142, 144 and 146 while wall portion 40 has been bent along bend line 108 to form a partial housing wall 147.
  • Resonator tap portions 70, 72 have become, respectively, resonator taps 148, 149.
  • wall portion 44 has been bent along bend line 110 to form housing walls 152 and 154
  • wall portion 46 has been partially bent along bend line 36 to form housing wall 156
  • wall portion 48 has been bent along bend line 112 to form partial wall 158.
  • Partial walls 147 and 158 when joined, will form the housing wall opposing housing wall 154.
  • the tuning bracket 24 has been bonded (e.g. soldered or welded) to the housing wall 154.
  • the tuning bracket 24 has capacitance tabs 160, 162, 164, 166 and coupling tabs 171, 173, 175.
  • Each capacitance tab is spaced above a corresponding resonator (e.g. capacitance tab 160 and resonator 140) and each coupling tab is spaced above and substantially equidistant from a corresponding pair of resonators (e.g. coupling tab 171 and resonators 140, 142).
  • Capacitance tabs are used to adjust the capacitance of the resonators while coupling tabs are used to adjust the electromagnetic coupling between resonators by bending them in manners well known in the art.
  • each of the capacitance tabs and coupling tabs is gained through a corresponding one of the tuning holes 82, 84, 86 and 88 (e.g. access to capacitance tab 160 and coupling tab 171 is through tuning hole 82).
  • These tuning elements facilitate adjustment of resonator capacitance and coupling between resonators to tune the transfer function of the filter (30 in FIG. 7).
  • FIG. 6 the bend along bend line 36 has been completed so that partial housing walls 147 and 158 adjoin.
  • end portions 50 and 52 have been bent along bend lines 114 and 116 to form, respectively, housing ends 178, 179 (wall 156 is broken away to show end 179).
  • Resonator tap 148 now extends through aperture 90 (similarly, but not shown, resonator tap 149 extends through aperture 92).
  • Grounding tab portions 73 are bent along bend lines (118 in FIG. 1A) to form grounding tabs 180. All adjoining housing wall and end edges are bonded to complete the fabrication of the housing 22 defining the cavity 23 therein.
  • the filter 30, illustrated in FIG. 6, is comprised of only two elements, the housing 22 and the tuning bracket 24.
  • the finger portions 76 become structural fingers 181 which are received in corresponding notches 81 as shown in FIG. 9 which is an enlarged view of the area enclosed by the line 9 in FIG. 6.
  • the stop portions 78 of the blank 20 become stops 182 as shown in FIG. 9.
  • the stops 182 fit into the notches 81a of the blank 20.
  • the purpose of the stops 182 will be described below.
  • the flap portions 80 of the blank 20 are bent relative to the resonators 140, 142, 144 and 146 along bend lines 119 as shown in FIG. 2 (designated on resonator 146) to become flaps 183 which add structural strength thereto.
  • the end of each flap 183 nearest the partial wall 147 abuts therewith and the line of abutment is soldered for additional strength.
  • the filter 30 is connected to a microstrip circuit 32.
  • resonator tap 148 is aligned along microstrip line 187.
  • the grounding tabs 180 are bonded to ground pads 192 of the microstrip circuit board 190.
  • the ground pads 192 are electrically connected to the microstrip ground plane (far side of board 190) by suitable means (e.g. plated through holes).
  • the resonator taps 148, 149 are bonded, respectively, to microstrip lines 186, 187 in manners well known in the art.
  • FIG. 8 which is an enlarged view of the area enclosed by the line 8 of FIG. 5, illustrates that the blank 20 is bent away from areas 193 of removed material (described relative to bend line 36 above) that define the bend lines of FIG. 1A.
  • the inner housing surface has a smooth transition between walls which prevents creation of electromagnetic discontinuities.
  • FIG. 10 is a isometric view illustrating another embodiment of the capacitance and coupling adjustments shown in FIG. 4.
  • Capacitance tips 230 terminate resonators 240, 242, 244, 246 and are bent relative thereto to adjust the capacitance thereof similar to the functioning of the capacitance tabs 160, 162, 164 and 166 of FIG. 4.
  • the resonators extend from a wall 247.
  • FIG. 11 is an enlarged view of the area enclosed by the line 11 of FIG. 10 and shows a slot 250 that facilitates bending of the capacitance tips 230.
  • the slots 250 would be defined in a blank similar to the blank 20 of FIG. 1A.
  • the housing wall 254 has coupling ears 271, 273 and 275 which may be used to adjust resonator coupling similar to tabs 171, 173 and 175 shown in FIG. 4.
  • the ears 271, 273 and 275 would also be defined in a blank similar to the blank 20 of FIG. 1A.
  • FIG. 12 is an isometric view similar to FIG. 4 illustrating another embodiment in which resonators 341 and 343 are interdigitated with resonators 340, 342 and 344 extending from the partial housing wall 347.
  • the resonators 341 and 343 are defined on a resonator bracket 352 which mounts on housing wall 354.
  • FIG. 13 is a view similar to FIG. 7 illustrating another filter embodiment installed in the microstrip circuit 32.
  • the filter 30a has a capacitance tap 148a soldered to the microstrip line 186 in capacitive coupling association with the resonator 140a.
  • the capacitance tap 148a and resonator 140a are formed from, respectively, the capacitance tap portion 70a and resonator portion 60a illustrated in FIG. IB by breaking the capacitance tap portion 70a away from the resonator portion 60a along the partition line 120.
  • a similar cavity coupling arrangement can be used to couple to the microstrip line 187.
  • FIG. 14 is a view similar to FIG. 7 illustrating another filter embodiment installed in the microstrip circuit 32.
  • the filter 30b has an inductance loop 148b soldered to the microstrip line 186 in inductive coupling association with the resonator 140b.
  • the inductive loop 148b and resonator 140b are formed from, respectively, the inductive loop portion 70b and resonator portion 60b illustrated in FIG. 1C.
  • the inductive loop portion 70b is bent along the bend line 121 (shown in FIG. 1C) to form the inductive loop 148b.
  • a similar cavity coupling arrangement can be used to couple to the microstrip line 187.
  • FIG. 15 is a plan view of another embodiment of a resonator portion 462 similar to the resonator portion 62 of FIG. 1A.
  • the resonator portion 462 has sub-portions 463, 464, 465, 466 and 467.
  • the resonator portion 462 is formed and bonded into the resonator embodiment 542 (similar to resonator 142) shown in FIG. 16 in which the location of the sub-portions is indicated.
  • the resonator 542 may be bonded at its base to the housing wall 547.
  • An impedance matching tab 630 extending from a tab embodiment 648 on a resonator 640 and a housing wall 647 is illustrated in the isometric view of FIG. 17.
  • the tab 630 would be used to match the line impedance of a stripline circuit in which the resonator 640 would be integrated.
  • the tab 630 would be defined in a blank similar to the blank 20 of FIG. 1A.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

Le procédé de fabrication d'un filtre à micro-ondes (30) consiste à utiliser un boîtier intégral (22) définissant une cavité (23), ce boîtier étant obtenu à partir d'une ébauche (20) découpée dans une feuille conductrice. L'ébauche est pliée pour former le boîtier. Le boîtier obtenu comprend des résonateurs, des prises de résonateur, des trous de syntonisation et des ouvertures des prises. Des fiches plates de capacitance et des fiches plates de couplage sont ajoutées au boîtier pour la syntonisation du filtre. Les fiches plates sont ajustées en ayant accès à travers les trous de syntonisation ménagés dans l'ébauche. L'ébauche définit des butées qui alignent les prises avec des lignes d'un circuit micro-bande lorsque le filtre est installé à l'intérieur et des fiches plates de mise à la terre sont prévues sur le plan de terre de la micro-bande. Le filtre peut avoir une configuration en peigne ou interdigitale.
PCT/US1992/004510 1991-06-04 1992-05-29 Procede de fabrication de filtres a micro-ondes, et filtres obtenus par ce procede WO1992022101A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US71009291A 1991-06-04 1991-06-04
US710,092 1991-06-04

Publications (1)

Publication Number Publication Date
WO1992022101A1 true WO1992022101A1 (fr) 1992-12-10

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Application Number Title Priority Date Filing Date
PCT/US1992/004510 WO1992022101A1 (fr) 1991-06-04 1992-05-29 Procede de fabrication de filtres a micro-ondes, et filtres obtenus par ce procede

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WO (1) WO1992022101A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0766333A1 (fr) * 1995-09-26 1997-04-02 Solitra Oy Filtre à résonateur coaxial et son procédé de fabrication
WO2016058627A1 (fr) * 2014-10-13 2016-04-21 Gapwaves Ab Composant rf à micro-ondes ou ondes millimétriques assemblé avec la technologie du bras-transfert
WO2017013305A1 (fr) * 2015-07-20 2017-01-26 Tongyu Technology Oy Procédé de fabrication d'un composant pour filtre rf, composant et filtre rf
CN106537682A (zh) * 2014-05-14 2017-03-22 加普韦夫斯公司 在平行导电平面之间的间隙中的波导和传输线
EP3451440A1 (fr) * 2017-09-01 2019-03-06 Nokia Technologies Oy Filtre de fréquence radio

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4829274A (en) * 1986-07-25 1989-05-09 Motorola, Inc. Multiple resonator dielectric filter

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4829274A (en) * 1986-07-25 1989-05-09 Motorola, Inc. Multiple resonator dielectric filter

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0766333A1 (fr) * 1995-09-26 1997-04-02 Solitra Oy Filtre à résonateur coaxial et son procédé de fabrication
US5892419A (en) * 1995-09-26 1999-04-06 Adc Solitra Oy Integral resonators for a filter and a method for manufacturing thereof
CN106537682A (zh) * 2014-05-14 2017-03-22 加普韦夫斯公司 在平行导电平面之间的间隙中的波导和传输线
US10263310B2 (en) 2014-05-14 2019-04-16 Gapwaves Ab Waveguides and transmission lines in gaps between parallel conducting surfaces
CN106537682B (zh) * 2014-05-14 2020-04-21 加普韦夫斯公司 在平行导电平面之间的间隙中的波导和传输线
WO2016058627A1 (fr) * 2014-10-13 2016-04-21 Gapwaves Ab Composant rf à micro-ondes ou ondes millimétriques assemblé avec la technologie du bras-transfert
WO2017013305A1 (fr) * 2015-07-20 2017-01-26 Tongyu Technology Oy Procédé de fabrication d'un composant pour filtre rf, composant et filtre rf
EP3326232A4 (fr) * 2015-07-20 2018-07-25 Tongyu Technology Oy Procédé de fabrication d'un composant pour filtre rf, composant et filtre rf
EP3451440A1 (fr) * 2017-09-01 2019-03-06 Nokia Technologies Oy Filtre de fréquence radio

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