WO1992020489A1 - Procedes et dispositifs de preparation de faisceaux de fils electriques souples et extremement longs - Google Patents

Procedes et dispositifs de preparation de faisceaux de fils electriques souples et extremement longs Download PDF

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Publication number
WO1992020489A1
WO1992020489A1 PCT/US1992/003881 US9203881W WO9220489A1 WO 1992020489 A1 WO1992020489 A1 WO 1992020489A1 US 9203881 W US9203881 W US 9203881W WO 9220489 A1 WO9220489 A1 WO 9220489A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
harness
conductive paths
conductor pattern
extended length
Prior art date
Application number
PCT/US1992/003881
Other languages
English (en)
Inventor
Joseph C. Fjelstad
Leo G. Svendsen
Gary Ira Geschwind
Raymond Joseph Noel, Jr.
Original Assignee
Elf Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/703,724 external-priority patent/US5250758A/en
Application filed by Elf Technologies, Inc. filed Critical Elf Technologies, Inc.
Publication of WO1992020489A1 publication Critical patent/WO1992020489A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/065—Etching masks applied by electrographic, electrophotographic or magnetographic methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0709—Catalytic ink or adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Definitions

  • the present invention relates generally to systems and methods for designing and fabricating conductive wiring harnesses. More particularly, the invention relates to methods for fabricating wiring harnesses as uninterrupted (i.e., seamless) flexible printed circuitry of unlimited dimension on a continuous, web-fed substrate. The invention can also be used to produce conventional flexible printed circuits.
  • R Hs round wire harnesses
  • An RWH typically includes a bundle of individual wire conductors terminated in connectors for attachment to the various circuit components. Markers are often used to identify the wires and tie wraps are used to hold the bundles together.
  • RWH provides large scale interconnection of components, it suffers from significant drawbacks. For example, because RWH is used in large scale systems, the number of conductive paths is relatively large. The complex routing and connection of the various conductive paths therefore make it difficult to handle the RWH and render assembly of a system using RWH labor intensive. Use of an RWH also results in a highly disorganized wiring scheme in which misconnections of conductors frequently occur and in which location of faults (e.g., breaks in conductive paths) cannot be readily identified and corrected.
  • RWH includes a large number of individual, round conductors which consume a significant volume of space and which add substantial weight to a system. Because individual wires are routed, an RWH is also highly susceptible to cross-talk and to impedance mismatches with system components.
  • an RWH is a bundle of individual wire conductors
  • the strength of the overall system is limited to the strength of each individual conductor. Therefore, if a single wire is structurally stressed (i.e., typically the shortest conductor), that conductor can break. As mentioned previously, subsequent identification and correction of such breaks are difficult due to the routing complexity of an RWH. Further, this structural limitation often leads to a harness configuration being dictated by strength requirements rather than electrical requirements, such that the harness is often heavier than necessary.
  • Another significant drawback of an RWH is its inability to accommodate modifications in the conductive path layout. Rather, circuit component changes and/or routing modifications of the conductive paths are typically achieved by the addition of new conductive wiring paths, adding to the complexity of the overall system or by a complete redesign of the system, increasing the time required to produce a finished harness.
  • an FPW circuit layout is designed by first creating a circuit layout master. Using the circuit layout master, a layout of conductors is imaged on a photographic negative from which a camera positive is produced. A screen is then fabricated from the camera positive for applying resist to the copper surface of a base material (i.e., substrate) .
  • a base material i.e., substrate
  • etching is used to remove copper left unprotected by the resist.
  • the remaining copper constitutes a desired pattern of conductive paths on the substrate.
  • an insulating overlay is subsequently laminated or coated onto the surface, the overlay being of the same material as the base.
  • the camera negative is used to form the layout of conductive paths.
  • a photoresist is applied to the entire copper surface.
  • ultraviolet light is passed through the camera negative to "fix" the photoresist material to the base in those areas where conductive paths are to be formed.
  • Unfixed resist is chemically stripped. After unprotected areas of the copper layer have been chemically etched, lamination or coating with an insulating overlay is performed, as described above.
  • FPW circuits have realized in small scale applications (e.g., cameras, telephones, personal computers, disk drives, and automobile dashboards)
  • present technology does not provide for the creation of large-scale FPW systems which can replace RWH.
  • screen printing and photographic techniques similar to those described above are currently used to produce flexible printed circuits in a batch fashion.
  • Units, or panels, of limited size e.g., two feet square
  • image-producing step e.g., screen printing or photography
  • current image-production is fairly expensive or slow to alter, resulting in high overhead costs and delays for the small number of runs which would be associated with large-scale FPW.
  • U.S. Patent No. 4,587,719 discloses a method of batch fabricating flexible circuits in an effort to provide area efficient use of a size limited substrate. As disclosed therein, orthogonal lines of conductors are joined and folded about axes parallel to the conductors. Although the disclosed method permits flexible arrays to be fabricated, its use of traditional imaging techniques imposes size constraints on the overall circuit layout design which prohibit its use as an RWH.
  • U.S. Patent No. 3,819,989 relates to a printed wiring multiple circuit board assembly wherein printed circuit boards are arranged at right angles to a flexible main tape 10.
  • the flexible main tape is formed with a plurality of conductors and tape tabs 12 through 15 using conventional techniques.
  • the tape tabs connect the main tape 10 and a plurality of overlays 16 through 19.
  • the overlays are formed on each side of the main tape and are bonded to conventional rectangular circuit boards situated in mutually parallel planes perpendicular to the main tape.
  • the system of U.S. Patent No. 3,819,989 fails to disclose fabrication techniques which would permit the manufacture of RWH replacements.
  • U.S. Patent No. 3,712,735 discloses a photoresist pattern controlled continuous strip etching apparatus.
  • a continuous loop photographic film transparency of a master pattern is used for contact photo printing of the pattern onto a moving resist coated strip.
  • this apparatus merely addresses the problems associated with step and repeat processes by increasing the size of the master film transparency, many of the aforementioned drawbacks associated with small scale FPW applications are incurred.
  • circuits produced by the disclosed apparatus are limited to the size of the master film transparency and are not readily adapted to in-line modifications of the conductor patterns once the master film transparency has been produced.
  • a purpose of the present invention is to provide systems and methods for fabricating electrical harnesses capable of replacing RWH.
  • the harness should provide three-dimensional breakout routing capability and be free of size restrictions.
  • a purpose of the invention is to provide systems and methods for fabricating harnesses such that the circuit layout can be readily modified electronically with limited manipulation of the fabrication process. Such design modifications include, for example, adaptation of a given circuit layout to systems of varied shapes and dimensions.
  • a purpose of the invention is to provide high throughput of a harness from design to manufacture, and to eliminate high cost inventory requirements associated with the manufacture of traditional RWH.
  • an in-line system e.g., xerography or laser printing
  • image conductor patterns on a continuous, web-fed base material, or substrate. As the substrate is fed, the image is continuously refreshed.
  • an uninterrupted (i.e, seamless) FPW harness equivalent to a discrete RWH of unlimited size in three dimensions can be fabricated.
  • the substrate can be cut to form circuit layout branches which are subsequently folded to produce three-dimensional shapes of unlimited size.
  • the present invention thus overcomes the significant drawbacks associated with traditional RWH.
  • a harness fabricated in accordance with the present invention represents an organized layout of conductive paths having relatively small volume and weight requirements and enabling excellent control of cross-talk and impedance mismatches.
  • the present invention affords significant advantages not previously realized in fabricating harnesses of any size.
  • the in-line creation of a conductor pattern on a continuously fed substrate provides high throughput while affording optimum design flexibility.
  • An original FPW design and/or subsequent design modifications can be remotely communicated via, for example, telephone networks.
  • Virtual inventory or electronic inventory can also be exploited in preferred embodiments to avoid any need to maintain a supply of round wire conductors having different sizes and color codes. Only generic raw materials need be maintained in inventory. Because various conductive paths of the layout can be labelled during fabrication, any need to label round wires (traditionally done by direct printing on the wire jacket, color coding or the addition of label sleeves) can be eliminated. Further, because all wires are printed on a common substrate, tie wraps typically used to hold round wire bundles together can be eliminated.
  • Yet another advantage of the present invention is that the fabrication of a harness as a single FPW element relieves the strain placed on the individual conductors of an RWH. Further, the ability to contour FPW to irregularly shaped surfaces in accordance with the present invention permits increased heat sinking.
  • an extended length flexible printed electrical harness is created by continuously feeding a substrate to an imaging means.
  • an image of a continuously updated conductor pattern is created electronically on a computer or in hard copy such that the image can be transferred to the substrate.
  • the conductor patter is either directly or indirectly imaged on the substrate.
  • Conductive paths are established on the substrate in accordance with the pattern and are covered with a protective insulating film.
  • the flexible substrate is then cut to form circuit layout breakouts, or branches, and the branches are folded to produce three-dimensional shapes of unlimited size.
  • Figure 1 shows an exemplary system for fabricating an FPW harness in accordance with a preferred embodiment
  • Figure 2 shows an exemplary, uncut FPW harness formed in accordance with a preferred embodiment
  • Figure 3 shows a more detailed illustration of an exemplary FPW harness formed, cut and folded in accordance with a preferred embodiment
  • Figure 4 shows an exemplary FPW harness formed, cut, folded and placed for a given end use
  • Figure 5a shows a portion of an FPW harness which has been formed with electrical components
  • Figure 5b shows an equivalent circuit diagram for the Figure 5a FPW harness
  • Figure 6 shows a portion of an FPW harness which includes a touch switch
  • Figure 7a shows a portion of an FPW harness which includes an electrical component receptacle
  • Figure 7b shows an area of an FPW harness where an active electronic component is attached to leads of the FPW harness
  • Figure 8 shows a portion of an FPW harness molded into a plastic casing
  • Figure 9 shows a portion of an FPW harness laminated with decorative and adhesive layers.
  • an extended length FPW harness of conductive paths is fabricated by continuously moving, or web-feeding, an uninterrupted (i.e., seamless) flexible substrate through four general fabrication stations.
  • the first of these includes an imaging means wherein an image of a continuously updated conductor pattern is created electronically on a computer or in hard copy such that the image can be transferred to the substrate.
  • the conductor pattern is either directly or indirectly imaged on the substrate as it is fed.
  • conductive paths are established on the substrate in accordance with the pattern.
  • the conductive paths are subsequently covered with a protective insulating film in a third general stage.
  • the flexible substrate passes to a fourth general stage wherein it is cut to form circuit layout breakouts, or branches. The branches can then be folded to produce three-dimensional shapes.
  • four general techniques can be used for creating conductive paths on the web-fed substrate: an additive process of forming conductive paths; a subtractive process of forming conductive paths; a conductive ink process; and a tack and peel process.
  • the technique selected for creating the conductive paths will dictate the technique or techniques which can be used to image the conductor pattern, either directly or indirectly, on the substrate. Accordingly, a brief discussion of the four general techniques for creating conductive paths will be provided before discussing the various imaging techniques.
  • raster scanning can be used to image a conductor pattern corresponding to the paths of an RWH. Further, patterns can be raster scanned on the substrate for in ⁇ line testing and inspection of circuits. Alternately, the conductor pattern can be imaged either directly or indirectly or the substrate by rastering with a fixed optical array of energy sources (e.g., row of LEDs or lasers) .
  • a fixed optical array of energy sources e.g., row of LEDs or lasers
  • Raster scanning can be effected in a manner similar to that described in the book Imaging Processes and Materials, Sturge, J.M. et al., 8th ed., 1989, the disclosure of which is hereby incorporated by reference in its entirety.
  • Chapter 13 of the aforementioned book is entitled “Non-Impact Printing Technologies” by Werner E. Haas and describes raster scanning with a scanning e-beam tool on page 377.
  • Chapter 18 of the aforementioned book is entitled “Imaging For Microfabrication” , by J.M. Shaw and describes the use of deflectors for raster scanning on page 578. As described on page 578 of the Imaging
  • raster scanning generally refers to mechanical and electrical scanning with, for example, an electron beam.
  • the beam is switched on and off in accordance with pattern data to image the pattern on a desired surface.
  • Rastering by a fixed optical array refers to use of a row of LEDs or lasers situated over the moving substrate (direct imaging) or situated over a rotating photocopying drum (indirect imaging) . In either case, varied combinations of the energy sources are activated as the substrate or drum moves past the array to image a pattern on the substrate or array.
  • the substrate is selectively imaged, either directly or indirectly, to create a conductor pattern (e.g., transfer plateable toner) on those portions of the substrate where conductive paths are to be formed.
  • the image may be fixed to the substrate by applying an external source of fusing energy.
  • the patterns are built up (e.g., plated) additively with a conductive material to form the conductive paths.
  • the second general technique mentioned was a subtractive process, wherein the substrate is coated in its entirety with a conductive material. Afterwards, the substrate is either directly or indirectly imaged for identifying those portions of the substrate where the conductive material is to be removed (positive working resist) or, conversely, imaged for retention to identify those portions where the conductive material is to remain (negative working resist) .
  • an ink-jet printer deposits a catalytic ink (e.g., containing a binder and catalyst such as Sn/Pd) onto selected portions of the substrate surface.
  • the ink may be fixed to the surface by applying an external source of energy.
  • conductive paths can subsequently be formed on these portions of the substrate using a plating process.
  • the imaging of a conductor pattern and the establishment of conductive paths on the pattern can be combined into a single stage. More particularly, an ink-jet printer can be used to directly deposit ink containing metal spheres or * conductive polymers, thus establishing conductive paths which correspond to a desired conductor pattern.
  • a tacky surface pattern corresponding to a predetermined conductive path is created on the substrate by, for example, transferring electrophotographic or magnetographic toner from a drum, or by ink-jet or dot matrix printing of an adhesive onto the substrate.
  • a conductor pattern can be imaged onto a surface coating of the substrate, and the substrate rendered tacky in locally softened imaged areas by light exposure or by chemical or thermal means.
  • the surface is subsequently laminated with a metal film. The metal film is then removed (e.g., sucked or peeled) where no tack is available.
  • an electrolytic plating step may be necessary to build up the conductive paths.
  • the substrate can be imaged either directly or indirectly.
  • direct imaging encompasses image creation of a conductor pattern directly on the substrate.
  • indirect imaging encompasses image creation of a conductor pattern on a drum (e.g., photocopier drum) or photosensitive belt. The image is then transferred to the substrate from the drum or belt.
  • the image of the conductor pattern is continuously refreshed, or updated, as the substrate is fed.
  • a subsequent conductor pattern stored in memory can be prepared for imaging a down line portion of the substrate.
  • Direct imaging can be effected using impact or non-impact write-heads, such as: a laser in a laser printer, a nozzle in an ink-jet printer, LEDs, electrophotography (i.e., electrophotographic plateable toner technology) , magnetographic plateable toner technology, and ionography (i.e., ionographic plateable toner technology) .
  • Direct scanning of the substrate can be effected by deflecting light (e.g., laser light) off a mirror surface or by directing light, liquid or solid particles toward the surface through a pivoting head and a shutter.
  • An electrically charged scanning stylus can also be used to electrically erode the substrate to implement a subtractive process.
  • the stylus can be any known stylus suitable for piercing, drilling, routing or cutting a surface of the substrate.
  • Any of these direct transfer mechanisms can be situated in clusters or arrays to improve printing speed.
  • the rastering of the substrate can also be performed using the aforementioned fixed array of LEDs arranged in a row over the moving substrate. As the substrate moves beneath the row of LEDs, each LED is independently controlled on and off to continuously image the substrate.
  • the aforementioned nozzles can also be known nozzles for transferring a catalytic ink to form a catalytic pattern on the substrate.
  • the pattern of catalytic ink is subsequently plated additively to build up conductive paths on the substrate.
  • an ink acting as an etch resist can be transferred to the substrate for subsequent etching.
  • resist can be selectively fixed on the substrate over those areas where conductive paths of the circuit layout are to be formed.
  • Indirect imaging can be effected by transferring a conductor pattern to be formed on the substrate onto a drum as in conventional photocopying (e.g., electrophotography) using liquid toners or dry toners. Subsequently the pattern on the drum is transferred to the substrate. The pattern on the drum is then continuously refreshed, or updated, as the substrate is fed.
  • indirect imaging can be performed by raster scanning the drum or by rastering the drum with a fixed array of light sources (e.g., LEDs) arranged in a row over the rotating drum. As the drum rotates, each of the LEDs can be independently controlled in on/off fashion to continuously image the drum.
  • Figure 1 shows an exemplary in-line system for fabricating extended length FPW harnesses of unlimited dimension on a continuous, web-fed substrate using an additive process.
  • a continuous polymer (e.g., polyimide) substrate 2 formed as a flat sheet is web-fed into an imaging means.
  • the imaging means is a known laser printer 4, such as a Versatec 8836-11 monochrome laser plotter, Xerox Engineering Systems 8840D, Esselte Meto LIS 1120, Esselte Meto LIS 1520A or Canon LBP-DX.
  • thermoset films such as polyimide films coated with acrylic, epoxy or TFE adhesives, thermoplastic films such as polyester coated with polyester or epoxy adhesives, or polyetherimide (UltemTM) films whose surface acts as an adhesive can be used upon which conductive (e.g., metal) paths can be formed.
  • conductive e.g., metal
  • a catalytic plateable toner such as that described in U.S. Patent No. 4,504,529, is transferred and fixed on the substrate for subsequent electroless plating.
  • a conductor pattern can be imaged onto a continuously refreshed, conventional photocopying drum.
  • toner is transferred onto the imaged drum.
  • the toner is transferred from the drum to a continuously moving substrate, and fused to the substrate.
  • the transfer of catalytic toner in accordance with a continuously refreshed conductor pattern onto the moving substrate 2 permits creation of a flexible printed harness having unlimited dimensions.
  • the laser printer 4 includes a computer work station 22 which provides in-line computer aided design (CAD) of the conductor pattern on the substrate.
  • CAD computer aided design
  • Original circuit pattern designs and/or modifications can also be received on-line from remote sources (e.g., via telephone networks) and used to update the circuit pattern being imaged (e.g., add or delete patterns) .
  • CAD can be implemented in a manner similar to that described for conventional printed circuit boards (PCBs) in the article "New Technology Allows Through- Hole and SMT Multilayer Quick Turn Prototype PCBs," PCNetwork, by Bill Schillhamer, Dec. 1990, and U.S. Patent No. 4,767,489, the disclosures of which are hereby incorporated by reference in their entirety.
  • CAD systems such as the Mentor Graphics Cable StationTM can be used to design RWH in three dimensions and to print these harnesses by the techniques described herein on the substrate.
  • circuit design modifications can be readily implemented during fabrication.
  • irregular images of multiple different circuits can be printed on the same substrate. These irregular images can be nested in a CAD memory before actual printing. By organizing the irregular shapes on the substrate, space usage of the substrate can be optimized and material waste can be minimized upon forming the conductor patterns to a final shape.
  • vias through the substrate can be formed to permit interconnection of these patterns. More particularly, prior to imaging a conductor pattern on the substrate, the substrate is perforated to form the vias.
  • perforation of the substrate is performed by the imaging means.
  • Hole punching, cutting, drilling or routing can be effected by, for example:
  • Scanning laser ablation e.g., C0 2 or Eximer
  • Water-jet cutting; or Scanning abrasive-blaster can be used to directly punch through the substrate layer, or high temperature rods can be used to melt through the substrate.
  • the nozzles described previously for imaging the substrate can also be used to effect the aforementioned step of perforating the substrate.
  • the nozzles can dispense chemicals for etching the substrate to form the holes (i.e., perforate the substrate) and to carry out routing.
  • the nozzles can dispense eroding particles to perform the etching by boring and routing the substrate in a manner akin to sand-blasting.
  • the nozzles can direct water toward the substrate for water-jet cutting.
  • a totally catalytic substrate surface can be formed either by coating the surface with the catalyst or by incorporation of the catalyst into the substrate material.
  • a plating resist can be selectively scanned onto the surface with an imaging means such as a photocopier, a laser printer, an LED/ionographic device, or an ink-jet printer.
  • the resist coated portions of the substrate are thus prevented from subsequent plating with conductive materials.
  • "ink"-tape on a normal dot matrix printer can be either a catalyst (for electroless plating) or a resist, depending on whether a non-catalytic or a catalytic substrate is used.
  • the substrate is coated with a thin metal laminate, and a resist is transferred thereto (e.g., impact or non ⁇ impact printing) during the imaging stage.
  • the resist is then removed from selected portions of the substrate to image a conductor pattern on the substrate which is subsequently plated to form the conductive paths. Afterwards, removal of the resist and chemical removal of the remaining thin areas which were covered by the resist can be effected.
  • different toners e.g., electrophotographic and magnetographic toners
  • the catalytic ink in an ink- jet printer can be transferred to form a resist pattern on a metal drum.
  • the drum is then additively or electrolytically plated in areas where no resist is present.
  • the conductive paths are peeled off the drum by using a substrate which has been coated with a tacky surface.
  • subtractive techniques can also be used.
  • Subtractive techniques start out with a substrate clad produced by lamination of the polymer substrate with metal films.
  • the polymer film may have the metal (e.g., copper) laminated to one or two sides.
  • An exemplary subtractive method selectively deposits etch resist over areas that are to remain as circuitry. These areas correspond to the conductor patterns which become conductive paths by, for example, chemically etching away the metal left unprotected in the image-producing step.
  • An ink-jet printer or dot matrix printer can also be modified to selectively deposit the etch resist as an ink directly on the substrate.
  • toner can be used as a screen on top of a normal etch resist film to effect a subtractive technique for creating an FPW harness.
  • Subsequent development of an image representing a conductor pattern of the FPW harness can then be used to produce an etch pattern made from common resist films.
  • a high powered laser can be used to remove the etch resist film down to the conductive layer. This exposes those portions of the conductive layer which are to be removed. Plasma etching techniques can also be used to remove the resist film.
  • a master can be continuously formed on a transparent surface by, for example, laser printing or ink-jet printing. This master is then synchronously fed into an exposure unit to transfer the conductor pattern image from the transparent film to the photographic etch resist on the metal substrate.
  • electrophotographic or magnetographic toner can also be used as an etch resist.
  • solder can be substituted as an etch-resist. For example, using techniques similar to those described above for ink-jet printers, molten solder can be directly raster scanned as solder resist onto the substrate.
  • information such as bar codes legends, datums and fiducials can be created by any ink-jet printer, laser printer or impact/dot matrix printer that will print on a web.
  • This information facilitates implementation of statistical process control.
  • this information can be printed on the substrate by using the imaging means to label various conductive paths.
  • Such labelling greatly simplifies identification of conductive paths so that accurate connection of the Figure 3 FPW harness to an end system (e.g., see Figure 4) can be attained.
  • the pattern is "fixed" thereto (e.g., thermally, chemically, or other known fixing techniques) .
  • the substrate exiting the laser printer 4 is directed to a continuous roll plating stage 6.
  • the substrate is continuously transported through plating solutions such that conductive material (e.g., copper) plates the catalytic toner formed during the laser printing stage.
  • the plating takes place catalytically only on the surfaces where an initial catalyst was located (e.g., electroless plating). If necessary, the metal traces which form the conductive paths can be thickened by electroplating over the electroless deposit.
  • exemplary embodiments can be implemented using both additive and subtractive formation of conductive circuitry on a substrate.
  • an FPW harness can be formed using a surface that is rendered catalytic for additive plating processes, as discussed above.
  • conductive paths can be formed on the substrate using the aforementioned known techniques, including ionographic plateable toner technology (PTT) , electrophotographic plateable toner technology and magnetographic plateable toner technology.
  • PTT ionographic plateable toner technology
  • electrophotographic plateable toner technology electrophotographic plateable toner technology
  • magnetographic plateable toner technology magnetographic plateable toner technology.
  • the invention is not limited to the use of a catalyst which is subsequently plated.
  • adhesive toners are used to implement the imaging of a conductor pattern either directly or indirectly, subsequent "tacking off" of metal from a sacrificial sheet is used to transfer a metal pattern for forming the conductive paths.
  • metal or catalytic particles are "tacked down" to create the conductive path.
  • conductive paths can also be implemented using known conductive inks. These conductive inks can be put down directly from a modified ink-jet printer thus combining the imaging and formation of conductive paths into a single stage.
  • conductive paths can be formed by chemically etching a substrate formed with a conductive layer, as previously discussed. Once portions of the metal substrate have been exposed, an etching step is initiated to etch away the exposed metal film. Thus, only the metal film covered by the resist remains on the substrate to form the conductive paths of the FPW harness. Continuous etching can, for example, be implemented following the transfer of resist to a metal laminate using either impact or non- impact techniques, as described previously.
  • the substrate is fed from the plating bath 6 through a quality control station 8 (e.g., inspection station) to a lamination station 10 which includes, for example, a hot roll laminator available from General Binding Corp.
  • a lamination station 10 which includes, for example, a hot roll laminator available from General Binding Corp.
  • an insulating protective cover 12 is formed with vias corresponding to contact points of the conductive paths.
  • the laminate is then pressed onto the substrate as both the laminate and the substrate are unrolled.
  • a preferred embodiment for a single layer circuit is a protective layer on top of the conductive paths, which can be created by laminating a pre-routed insulative layer (i.e., corresponding to the conductor pattern) onto the substrate layer. Prior to the lamination, openings for component contacts or for path interconnections are provided in the insulative layer by routing/drilling processes similar to those described above for perforating the substrate. Holes (windows) for termination can be opened following lamination by using the aforementioned substrate perforation techniques (e.g., use of a raster scanning laser to ablate the unwanted areas) .
  • substrate perforation techniques e.g., use of a raster scanning laser to ablate the unwanted areas
  • a lamination film is cured in a pattern on the substrate by scanning a UV-laser on an uncured surface coating.
  • the areas which are not cured by the laser light are subsequently developed away using a known, suitable developer solution to form vias in the lamination.
  • Electrophotographic or magnetophotographic toner can also be used to create the insulating layer. More particularly, the toner is printed in the desired pattern on the finished conductor layer and then brought to coalesce and cross-link on top of the circuit pattern to create a continuous protective surface with the necessary openings.
  • conductive layers can be formed on the substrate.
  • a protective coating can be applied by: raster imaging of insulative toners, screen printing, roller coating with an adhesive or use of a conventional insulative layer after deposition of each conductive layer.
  • the relative position of the layers can be maintained by tacking them down using adhesive dispensed in a manner described previously with respect to creating a tacky surface.
  • Interconnection openings, or pads, between the layers can be formed through the multilayer structure using techniques as described above or by covering areas of the screen where interconnects are desired.
  • Solder can be reflowed on interconnection pads by applying it through a high temperature ink-jet printer.
  • the molten solder flows into the interconnect holes of the multilayer circuit to electrically connect one or more conductive layers.
  • Figure 2 shows an extended length flexible conductor harness formed in accordance with a preferred embodiment of the present invention.
  • the harness includes a plurality of conductive paths formed on a common flexible substrate. Folds for final assembly can be put into the FPW harness, as shown in Figures 3 and 4.
  • the FPW harness shown in Figure 2 can be cut or slit and then folded and/or rolled for shipment. Afterwards, the harness can be unrolled and (if not folded during manufacturing) folded in predetermined directions, as shown in Figure 3.
  • the harness can be of unlimited dimension in the direction with which it was formed (e.g., from the left to the right of the harness in Figure 2) , subsequent slitting and folding of the harness permits unlimited fabrication of the harness in three dimensions.
  • Figures 3 and 4 show that creating the FPW harness by slitting and folding permits creation of a printed circuit harness having unlimited dimensions.
  • the laminated substrate 14 is transferred to a cutting station 16.
  • cuts are made in the substrate, as described above, to form harness branches.
  • These branches such as branches 18 and 20 in the Figure 1 harness, can subsequently be folded to form a three-dimensional harness.
  • the cuts can be made during formation of the conductive paths, in which case the laminate is formed over only those portions of the substrate which constitute the final FPW harness assembly.
  • FPW harnesses are limitless.
  • an FPW harness produced in accordance with the present invention is relatively flat (e.g., profile thickness less than .25 mm, as opposed to typical RWH thickness of over 5 mm) , it can be readily integrated with structural and cosmetic laminations for use in any device or structure which requires conductive interconnects.
  • Such devices include vehicles, machines, and consumer products (e.g., tools, anti-theft devices, appliances, controllers and so forth) .
  • Structures include buildings and so forth.
  • FPW harnesses typically involve circuitry such as circuit elements, switches, indicators (e.g., lamps) and so forth.
  • FPW harnesses in accordance with the present invention can be configured to include such features.
  • Figure 5a illustrates a portion 24 of an FPW harness which can be formed and folded to provide the equivalent circuit shown in Figure 5b.
  • the Figure 5a harness 24 includes a capacitor 26 with first and second electrodes 28, 30, respectively, an inductor 32 and a resistor 34.
  • the Figure 5a circuit can be formed as a portion of an FPW harness in a manner as described above.
  • the exemplary configuration as shown in figure 5a is formed with a first flap 36 and a second flap 38.
  • the flap 36 When the Figure 5a portion of the FPW harness is to be folded for use in a given environment (e.g., vehicle) , the flap 36 can be folded downward, so as to cover the second electrode 30. The flap 36 will thus serve as a dielectric for the capacitor 26. Afterwards, the flap 38 can be folded to the right hand side of Figure 5a, so as to cover the flap 36. By aligning the first electrode 28 over the second electrode 30, the capacitor 26 is formed.
  • the capacitance of capacitor 26 can, for example, be varied by adjusting the conductivity of the dielectric 36.
  • the inductance of inductor 32 can be varied by altering the number of turns included therein.
  • the resistance of resistor 34 can be varied by altering the length, width and/or thickness of the conductive path used to form the resistor. The circuit can thus be used as a resistance heater element.
  • any circuit can be formed using any number of capacitors, resistors, inductors or other circuit components arranged in any desired order.
  • the printed harness can be fabricated to form controlled impedance FPW by forming inductors and capacitors along the length of the conductive paths.
  • the FPW harness can be fabricated to include additional circuit components.
  • Figure 6 shows a touch (e.g. membrane) switch 40 which can be conveniently located at any desired location within an FPW harness.
  • first and second conductive paths 42, 44 are formed.
  • a plastic covering 46 is formed about at least a portion of the harness with a hole 48 in a bendable plastic flap 50.
  • the flap 50 can be bent toward the top of Figure 6 such that hole 48 is located over an exposed, conductive termination node 52 of conductor 44.
  • a flap 54 which includes an exposed, conductive termination node 56 of the conductor 42 can be bent downward such that termination node 56 is located over the hole 50 and the termination node 52.
  • the flap 50 serves as a spacer between nodes 52 and 56.
  • Printed indicia on an exterior of the plastic covered FPW can be used to indicate the presence of an electrical switch above node 56 or below node 52 and. if desired, to indicate the function of the switch (e.g., "LIGHT").
  • the application of external pressure to the FPW at the point where node 56 overlaps node 52 will result in contact between these nodes and activate a circuit connected thereto.
  • an electrical component receptacle 58 (e.g., light receptacle) as shown in Figure 7.
  • an electrical component receptacle 58 e.g., light receptacle
  • first and second conductive paths 57, 59 are formed on a portion of an FPW harness.
  • the receptacle 58 can be formed as a hole wherein at least a portion of the conductive paths 57 and 59 are exposed to contact conductive leads of an electrical component inserted into the receptacle.
  • connection techniques such as riveting, soldering or wire bonding can be used to connect components to the FPW.
  • Figure 7b illustrates how an active integrated circuit (IC) package 61 can also be connected (e.g., soldered) to a portion of an FPW harness 63 by attaching (e.g., soldering) leads of the IC to conductive paths of the FPW harness.
  • IC active integrated circuit
  • FIG. 8 shows an FPW harness 60 used to connect to and provide control of a driver side door panel 62.
  • the FPW harness can be fabricated to include control circuitry and touch switches associated with all driver side door panel features (e.g., windows, mirrors, door locks, electric seats and so forth) of an automobile.
  • the FPW harness can be molded into a plastic door liner or panel for easy assembly in the automobile door.
  • Figure 8 shows a portion of an FPW harness molded into a plastic casing of the door panel 62. Molding of the FPW harness into a plastic door panel avoids any need to fasten (e.g., glue, rivet, screw) the FPW to the doors and thus decreases weight of the door. For example, by coating the FPW harness with a polymer (e.g., polyimide, epoxy, silicone or polyurethane) , the harness can better withstand the heat associated with plastic molding.
  • a similar technique can be used to mold FPW into the exterior casing (i.e., "skin") of any tool, machine, appliance, and so forth, or, for example, into such structural materials as automobile sheet metal.
  • an FPW fabricated in accordance with the present invention can be laminated with additional materials.
  • the FPW can be laminated with a protective layer or layers; an adhesive layer or layers; a decorative layer, or a layer bearing printed indicia (e.g., label, bar code and so forth) .
  • an FPW 64 can be laminated for use as an automobile headliner, to include an exterior fabric 66 on one side (e.g., velvet for interior ceiling of vehicle passenger compartment) and an adhesive layer 68 on the other side (for attachment to the metal vehicle roof) .
  • the FPW can be used as an underfloor, or it can be used under a floor covering (e.g., beneath carpet and so forth) .
  • an FPW harness designed in accordance with the present invention includes, but are not limited to FPH (flat printed harnesses) , conventional flex circuits, shielded cables, controlled impedance cables such as mircrostrip and stripline, twisted pairs, shielded twisted pairs, heaters, structural assemblies such as control consoles (e.g., dash board assemblies) , antennas, transmitter and receivers, data transmission systems such as 'data buses', solar panel bus bars, active harnesses such as harnesses with active and passive electronic devices (e.g., microprocessors, capacitors, resistors and so forth) directly mounted thereon to serve as local control and monitoring circuits.
  • FPH flat printed harnesses
  • conventional flex circuits shielded cables, controlled impedance cables such as mircrostrip and stripline, twisted pairs, shielded twisted pairs, heaters
  • structural assemblies such as control consoles (e.g., dash board assemblies) , antennas, transmitter and receivers, data transmission systems such as 'data buses'

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention se rapporte à des dispositifs et à des procédés servant à la fabrication de faisceaux de fils électriques imprimés et souples (FPW), à longueur illimitée sur trois dimensions. Dans les modes de réalisation préférés, on imprime les configurations de conducteurs continuellement mises à jour sur un matériau de base rotatif et ininterrompu (c'est-à-dire, sans soudure), ou substrat (14). Avec la production en direct, on peut fabriquer un faisceau FPW équivalent à un faisceau de fils ronds (RWH) discret et à dimensions illimitées. Par exemple, on peut découper le substrat (14), afin de constituer des branches de tracé de circuit (18 et 20), qu'on plie ensuite dans le but d'obtenir des formes tridimensionnelles à dimensions illimitées.
PCT/US1992/003881 1991-05-21 1992-05-15 Procedes et dispositifs de preparation de faisceaux de fils electriques souples et extremement longs WO1992020489A1 (fr)

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US703,724 1991-05-21
US07/703,724 US5250758A (en) 1991-05-21 1991-05-21 Methods and systems of preparing extended length flexible harnesses
US87579692A 1992-04-28 1992-04-28
US875,796 1992-04-28

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WO1999060829A2 (fr) * 1998-05-20 1999-11-25 Intermec Ip Corp. Procede et appareil de realisation de traces, de circuits et de dispositifs electriques
WO2007046694A1 (fr) * 2005-10-18 2007-04-26 Vipem Hackert Gmbh Procede pour preparer une fonction conductrice sur un substrat
WO2007147602A3 (fr) * 2006-06-21 2008-04-17 Axel Ahnert Procédé de production d'une portion de circuit sur un substrat
WO2010080750A1 (fr) * 2009-01-06 2010-07-15 Johnson Controls Technology Company Garniture de toit à faisceau électrique intégré
US8016072B2 (en) 2007-07-27 2011-09-13 Johnson Controls Technology Composite headliner with improved acoustic performance
EP3863385A1 (fr) * 2020-02-04 2021-08-11 Yazaki Corporation Carte de circuit imprimé et procédé de fabrication de carte de circuit imprimé
CN113692125A (zh) * 2021-08-06 2021-11-23 广东航能电路科技有限公司 S型无限长单面柔性电路板生产工艺
US20230011924A1 (en) * 2019-12-26 2023-01-12 Autonetworks Technologies, Ltd. Wire harness, power storage module, and method of producing wire harness
WO2023005692A1 (fr) * 2021-07-30 2023-02-02 长春捷翼汽车零部件有限公司 Procédé de production de faisceau de câbles et faisceau de câbles

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WO1999060829A2 (fr) * 1998-05-20 1999-11-25 Intermec Ip Corp. Procede et appareil de realisation de traces, de circuits et de dispositifs electriques
WO1999060829A3 (fr) * 1998-05-20 2003-04-17 Intermec Ip Corp Procede et appareil de realisation de traces, de circuits et de dispositifs electriques
WO2007046694A1 (fr) * 2005-10-18 2007-04-26 Vipem Hackert Gmbh Procede pour preparer une fonction conductrice sur un substrat
WO2007147602A3 (fr) * 2006-06-21 2008-04-17 Axel Ahnert Procédé de production d'une portion de circuit sur un substrat
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US20230011924A1 (en) * 2019-12-26 2023-01-12 Autonetworks Technologies, Ltd. Wire harness, power storage module, and method of producing wire harness
EP3863385A1 (fr) * 2020-02-04 2021-08-11 Yazaki Corporation Carte de circuit imprimé et procédé de fabrication de carte de circuit imprimé
WO2023005692A1 (fr) * 2021-07-30 2023-02-02 长春捷翼汽车零部件有限公司 Procédé de production de faisceau de câbles et faisceau de câbles
CN113692125A (zh) * 2021-08-06 2021-11-23 广东航能电路科技有限公司 S型无限长单面柔性电路板生产工艺

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