WO1992005913A3 - Procede et appareil servant a produire une ebauche dans un amalgame - Google Patents

Procede et appareil servant a produire une ebauche dans un amalgame Download PDF

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Publication number
WO1992005913A3
WO1992005913A3 PCT/US1991/007197 US9107197W WO9205913A3 WO 1992005913 A3 WO1992005913 A3 WO 1992005913A3 US 9107197 W US9107197 W US 9107197W WO 9205913 A3 WO9205913 A3 WO 9205913A3
Authority
WO
WIPO (PCT)
Prior art keywords
amalgam
temperature
layer
liquid metal
melting temperature
Prior art date
Application number
PCT/US1991/007197
Other languages
English (en)
Other versions
WO1992005913A2 (fr
Inventor
Edward Joseph Ozimek
Edward Carnall Jr
David Norman Bull
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of WO1992005913A2 publication Critical patent/WO1992005913A2/fr
Publication of WO1992005913A3 publication Critical patent/WO1992005913A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

Procédé et appareil servant à produire un corps d'ébauche solide dans un amalgame à partir d'une couche mince (16) de l'amalgame, l'appareil comprenant une plaque de base (12; 26; 38) sur laquelle l'amalgame liquide est étalé en une couche mince. L'amalgame est composé d'un mélange d'un métal liquide et d'un métal en poudre. On applique une première température à la couche d'amalgame à travers la plaque de base (12; 26; 38). La première température peut être inférieure à la température de fusion du métal liquide de l'amalgame pour que l'on obtienne une couche solidifiée de l'amalgame, ou elle peut être supérieure à la température de fusion du métal liquide afin de maintenir la couche d'amalgame sous une forme liquide. Une seconde température est appliquée à une partie de la couche d'amalgame (16) pour former le corps d'ébauche. Si la température initiale est inférieure à la température de fusion du métal liquide, la seconde température est supérieure à cette température de fusion pour créer une zone de fusion dans la couche d'amalgame (16) le long du bord du corps d'ébauche de façon à permettre au corps d'être séparé de la partie restante de la couche d'amalgame. Si la température initiale est supérieure à la température de fusion du métal liquide, la seconde température est inférieure à cette température de fusion pour créer une partie solidifiée dans la couche d'amalgame qui peut être enlevée de celle-ci.
PCT/US1991/007197 1990-10-09 1991-10-08 Procede et appareil servant a produire une ebauche dans un amalgame WO1992005913A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US594,806 1990-10-09
US07/594,806 US5149935A (en) 1990-10-09 1990-10-09 Method and apparatus for forming amalgam preform

Publications (2)

Publication Number Publication Date
WO1992005913A2 WO1992005913A2 (fr) 1992-04-16
WO1992005913A3 true WO1992005913A3 (fr) 1992-05-14

Family

ID=24380485

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1991/007197 WO1992005913A2 (fr) 1990-10-09 1991-10-08 Procede et appareil servant a produire une ebauche dans un amalgame

Country Status (4)

Country Link
US (1) US5149935A (fr)
EP (1) EP0506924A1 (fr)
JP (1) JPH05502625A (fr)
WO (1) WO1992005913A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2777810B1 (fr) * 1998-04-28 2000-05-19 Air Liquide Procede et dispositif de traitement de la surface interne d'une bouteille de gaz
US6329636B1 (en) * 2000-03-31 2001-12-11 Illinois Tool Works Inc. Method and apparatus for receiving a universal input voltage in a welding plasma or heating power source
DE102017118471A1 (de) * 2017-08-14 2019-02-14 Universität Greifswald Verfahren zur Herstellung ultradünner bis dünner Schichten auf Substraten

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3141238A (en) * 1960-11-22 1964-07-21 Jr George G Harman Method of low temperature bonding for subsequent high temperature use
US3156539A (en) * 1962-03-27 1964-11-10 Gen Electric Superconductive materials
US3839780A (en) * 1971-04-14 1974-10-08 Raytheon Co Method of intermetallic bonding

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410979A (en) * 1964-05-28 1968-11-12 Burroughs Corp Method and apparatus for drilling holes by means of a focused laser beam
US3587377A (en) * 1968-08-05 1971-06-28 Minnesota Mining & Mfg Electrically heated die-cutting apparatus
US4007349A (en) * 1973-02-14 1977-02-08 John Charles Burley Inductive method for cutting cloth
JPS56134404A (en) * 1980-03-24 1981-10-21 Sony Corp Conductive material and method of prdoducing same
GB8301710D0 (en) * 1983-01-21 1983-02-23 Protocol Eng Ltd Production of lines of separation in sheet & c member
JPS6168178A (ja) * 1984-09-10 1986-04-08 Hitachi Cable Ltd 金属管材の内面処理方法
US4684781A (en) * 1985-01-29 1987-08-04 Physical Sciences, Inc. Method for bonding using laser induced heat and pressure
EP0321938A1 (fr) * 1987-12-22 1989-06-28 Blendax GmbH Procédé pour arrondir les extrémités de brosses
JPH01228698A (ja) * 1988-03-10 1989-09-12 Mitsubishi Metal Corp プリフォームろう材の成形方法
US5043139A (en) * 1990-10-09 1991-08-27 Eastman Kodak Company Amalgam preform, method of forming the preform and method of bonding therewith

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3141238A (en) * 1960-11-22 1964-07-21 Jr George G Harman Method of low temperature bonding for subsequent high temperature use
US3156539A (en) * 1962-03-27 1964-11-10 Gen Electric Superconductive materials
US3839780A (en) * 1971-04-14 1974-10-08 Raytheon Co Method of intermetallic bonding

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 13, no. 555 (M-904)(3903) 11 December 1989 & JP,A,1 228 698 ( MITSUBISHI METAL ) 12 September 1989 *

Also Published As

Publication number Publication date
JPH05502625A (ja) 1993-05-13
EP0506924A1 (fr) 1992-10-07
WO1992005913A2 (fr) 1992-04-16
US5149935A (en) 1992-09-22

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