WO1991011493A3 - Adhesif autocollant electroconducteur - Google Patents

Adhesif autocollant electroconducteur Download PDF

Info

Publication number
WO1991011493A3
WO1991011493A3 PCT/US1991/000671 US9100671W WO9111493A3 WO 1991011493 A3 WO1991011493 A3 WO 1991011493A3 US 9100671 W US9100671 W US 9100671W WO 9111493 A3 WO9111493 A3 WO 9111493A3
Authority
WO
WIPO (PCT)
Prior art keywords
pressure sensitive
sensitive adhesive
adhesive
electrically conductive
carbon
Prior art date
Application number
PCT/US1991/000671
Other languages
English (en)
Other versions
WO1991011493A2 (fr
Inventor
Richard T Glackin
Original Assignee
Adhesives Res Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adhesives Res Inc filed Critical Adhesives Res Inc
Priority to KR1019910701228A priority Critical patent/KR920701374A/ko
Priority to DE69103484T priority patent/DE69103484D1/de
Priority to EP91905012A priority patent/EP0464199B1/fr
Publication of WO1991011493A2 publication Critical patent/WO1991011493A2/fr
Publication of WO1991011493A3 publication Critical patent/WO1991011493A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

On prépare un adhésif autocollant électroconducteur par incorporation d'une matière de charge noire conductrice dans un adhésif autocollant, de manière à conférer une conductivité électrique à une concentration de carbone suffisamment faible pour éviter d'affecter désavantageusement les propriétés physiques (telles que l'adhésivité) de l'adhésif. Selon un mode de réalisation de l'invention, les particules de carbone se trouvant dans l'adhésif se présentent sous la forme d'une structure de carbone optimisant l'emploi efficace de carbone par l'aménagement de voies conductrices dans l'adhésif.
PCT/US1991/000671 1990-01-31 1991-01-31 Adhesif autocollant electroconducteur WO1991011493A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019910701228A KR920701374A (ko) 1990-01-31 1991-01-31 전기적으로 전도압에 감응하는 접착제
DE69103484T DE69103484D1 (de) 1990-01-31 1991-01-31 Elektrisch leitfähiger druckempfindlicher klebstoff.
EP91905012A EP0464199B1 (fr) 1990-01-31 1991-01-31 Adhesif autocollant electroconducteur

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/472,950 US5082595A (en) 1990-01-31 1990-01-31 Method of making an electrically conductive pressure sensitive adhesive
US472,950 1990-01-31

Publications (2)

Publication Number Publication Date
WO1991011493A2 WO1991011493A2 (fr) 1991-08-08
WO1991011493A3 true WO1991011493A3 (fr) 1991-09-05

Family

ID=23877557

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1991/000671 WO1991011493A2 (fr) 1990-01-31 1991-01-31 Adhesif autocollant electroconducteur

Country Status (9)

Country Link
US (1) US5082595A (fr)
EP (1) EP0464199B1 (fr)
JP (1) JPH04503831A (fr)
KR (1) KR920701374A (fr)
AT (1) ATE110100T1 (fr)
AU (1) AU626186B2 (fr)
CA (1) CA2047665A1 (fr)
DE (1) DE69103484D1 (fr)
WO (1) WO1991011493A2 (fr)

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US5265579A (en) * 1992-09-21 1993-11-30 Ferrari R Keith X-ray transparent monitoring electrode and method for making
US5643670A (en) * 1993-07-29 1997-07-01 The Research Foundation Of State University Of New York At Buffalo Particulate carbon complex
US5501899A (en) * 1994-05-20 1996-03-26 Larkin; William J. Static eliminator and method
US5733324A (en) 1995-12-08 1998-03-31 Ferrari; R. Keith X-ray transmissive transcutaneous stimulating electrode
US5822856A (en) * 1996-06-28 1998-10-20 International Business Machines Corporation Manufacturing circuit board assemblies having filled vias
WO1998007565A1 (fr) * 1996-08-23 1998-02-26 Tosoh Smd, Inc. Assemblage a l'aide une feuille de materiau conducteur adhesive
DE19722713C1 (de) * 1997-05-30 1998-10-29 Ruediger Vortriede Flüssiges Leitgummi
US20020119255A1 (en) * 2000-05-09 2002-08-29 Ranjith Divigalpitiya Method and apparatus for making particle-embedded webs
JP4459470B2 (ja) * 2001-04-06 2010-04-28 信越化学工業株式会社 電子部品の放熱構造体及びそれに用いる放熱シート
WO2005012435A1 (fr) * 2003-07-31 2005-02-10 World Properties, Inc. Charges ignifuges conductrices, leur procede de fabrication et leur utilisation
US20050062024A1 (en) * 2003-08-06 2005-03-24 Bessette Michael D. Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof
US20050226780A1 (en) * 2003-09-19 2005-10-13 Donald Sandell Manual seal applicator
US20050112634A1 (en) * 2003-09-19 2005-05-26 Woudenberg Timothy M. High density sequence detection methods and apparatus
US20060013984A1 (en) * 2003-09-19 2006-01-19 Donald Sandell Film preparation for seal applicator
US20060029948A1 (en) * 2003-09-19 2006-02-09 Gary Lim Sealing cover and dye compatibility selection
US20050232818A1 (en) * 2003-09-19 2005-10-20 Donald Sandell Single sheet seal applicator and cartridge
US20060011305A1 (en) * 2003-09-19 2006-01-19 Donald Sandell Automated seal applicator
KR100535175B1 (ko) * 2004-03-29 2005-12-09 주식회사 센테크 카본유연성 발열구조체 제조용 전도성 조성물과 이를 이용한 카본유연성 발열구조체 및 이의 제조방법
JP2007531217A (ja) * 2004-03-29 2007-11-01 センテック カンパニ リミテッド カーボン柔軟性発熱構造体製造用伝導性組成物とこれを用いたカーボン柔軟性発熱構造体及びこれの製造方法
EP2040983A4 (fr) * 2006-06-26 2011-08-03 Life Technologies Corp Scellement transparent compressible pour microplaques ouvertes
US8030376B2 (en) 2006-07-12 2011-10-04 Minusnine Technologies, Inc. Processes for dispersing substances and preparing composite materials
US20110214735A1 (en) * 2008-11-07 2011-09-08 3M Innovative Properities Company Conductive laminated assembly
JP5396073B2 (ja) * 2008-12-12 2014-01-22 リンテック株式会社 導電性粘着シートおよびその製造方法
WO2011008533A2 (fr) * 2009-06-29 2011-01-20 Gerald Leto Appareil multifonctionnel d'écriture avec stylet pour écran tactile capacitif
US20110297219A1 (en) * 2010-06-04 2011-12-08 United Solar Ovonic Llc Method and materials for the fabrication of current collecting structures for photovoltaic devices
US9061478B2 (en) 2011-05-18 2015-06-23 3M Innovative Properties Company Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom
DE102011080729A1 (de) 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige Haftklebemasse und Haftklebeband
DE102011080724A1 (de) 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige hitzeaktivierbare Klebemasse
US8673184B2 (en) * 2011-10-13 2014-03-18 Flexcon Company, Inc. Systems and methods for providing overcharge protection in capacitive coupled biomedical electrodes
US9818499B2 (en) 2011-10-13 2017-11-14 Flexcon Company, Inc. Electrically conductive materials formed by electrophoresis
WO2013062836A1 (fr) 2011-10-25 2013-05-02 3M Innovative Properties Company Bandes adhésives non tissées et articles fabriqués avec celles-ci
JP2014124940A (ja) * 2012-12-27 2014-07-07 3M Innovative Properties Co 装飾積層シート、装飾積層シートを含む構造体およびその製造方法
US9775235B2 (en) 2013-03-15 2017-09-26 Flexcon Company, Inc. Systems and methods for providing surface connectivity of oriented conductive channels
DE102013011074A1 (de) * 2013-07-03 2015-01-08 Oerlikon Trading Ag An eine indirekte Kühlvorrichtung angepasstes Target mit Kühlplatte
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
US12011911B2 (en) 2020-03-25 2024-06-18 Flexcon Company, Inc. Isotropic non-aqueous electrode sensing material

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3380958A (en) * 1966-12-23 1968-04-30 Manton Gaulin Mfg Company Inc Method of incorporating carbon black and other materials into elastomers
US3778306A (en) * 1971-01-04 1973-12-11 Minnesota Mining & Mfg Tape
EP0085413B1 (fr) * 1982-01-30 1987-04-29 Daikin Kogyo Co., Ltd. Composition de revêtement électroconductive
EP0277426A1 (fr) * 1987-01-02 1988-08-10 Minnesota Mining And Manufacturing Company Ruban adhésif sensible à la pression, à base acrylique, de couleur foncée

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2670306A (en) * 1951-01-25 1954-02-23 Eastman Kodak Co Pressure sensitive adhesives containing graphite
US2808352A (en) * 1951-03-22 1957-10-01 Burgess Battery Co Electrically conductive adhesive tape
US3475213A (en) * 1965-09-13 1969-10-28 Minnesota Mining & Mfg Electrically conductive adhesive tape
JPS59197476A (ja) * 1983-04-26 1984-11-09 Hayakawa Rubber Co Ltd 導電性粘着剤
US4588762A (en) * 1983-11-25 1986-05-13 Graphic Controls Corporation Pressure sensitive adhesive compositions for medical electrodes
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
JPH0629367B2 (ja) * 1985-12-02 1994-04-20 ポリプラスチックス株式会社 導電性樹脂組成物
US4874549A (en) * 1985-12-13 1989-10-17 Advanced Micro-Matrix, Inc. Pressure sensitive electro-conductive materials
JP2539368B2 (ja) * 1985-12-20 1996-10-02 株式会社日立製作所 半導体レ−ザ装置
FR2606784B1 (fr) * 1986-11-14 1989-03-03 Rhone Poulenc Multi Tech Composition potentiellement adhesive electriquement conductrice
DE3701757A1 (de) * 1987-01-22 1988-08-04 Henkel Kgaa Haftkleber
US4755659A (en) * 1987-02-03 1988-07-05 Chomerics, Inc. Combined busbar and electrical lead assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3380958A (en) * 1966-12-23 1968-04-30 Manton Gaulin Mfg Company Inc Method of incorporating carbon black and other materials into elastomers
US3778306A (en) * 1971-01-04 1973-12-11 Minnesota Mining & Mfg Tape
EP0085413B1 (fr) * 1982-01-30 1987-04-29 Daikin Kogyo Co., Ltd. Composition de revêtement électroconductive
EP0277426A1 (fr) * 1987-01-02 1988-08-10 Minnesota Mining And Manufacturing Company Ruban adhésif sensible à la pression, à base acrylique, de couleur foncée

Also Published As

Publication number Publication date
CA2047665A1 (fr) 1991-08-01
EP0464199A1 (fr) 1992-01-08
ATE110100T1 (de) 1994-09-15
US5082595A (en) 1992-01-21
KR920701374A (ko) 1992-08-11
DE69103484D1 (de) 1994-09-22
WO1991011493A2 (fr) 1991-08-08
AU7338491A (en) 1991-08-21
AU626186B2 (en) 1992-07-23
EP0464199B1 (fr) 1994-08-17
JPH04503831A (ja) 1992-07-09

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