WO1989003274A1 - Procede et application de percage au laser - Google Patents
Procede et application de percage au laser Download PDFInfo
- Publication number
- WO1989003274A1 WO1989003274A1 PCT/DK1987/000124 DK8700124W WO8903274A1 WO 1989003274 A1 WO1989003274 A1 WO 1989003274A1 DK 8700124 W DK8700124 W DK 8700124W WO 8903274 A1 WO8903274 A1 WO 8903274A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- holes
- drilling
- laser drilling
- narrow holes
- application
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Definitions
- This invention relates to the Method of producing narrow holes through an object by the application of laser drilling.
- the invention relates in particular to the perforation of solid objects of e.g. metallic, ceramic or thermoplastic materials, more particularly to the perforation of the wall of tubular objects, and most particularly to the perforation of the wall of injection need- les for medical use.
- the invention further relates to objects perforated by one or more narrow holes by application of the invented method of laser drilling, in particular to perforated injection needles for medical use.
- Injection needles of this kind may typically have a stainless steel wall of a thickness of 0.1 mm perforated by a number of holes of 0.05 nm diameter or less.
- Laser drilling is normally performed by focusing an intense laser beam on the surface of the object where the perforation has to take place.
- a gas nozzle may blow an auxiliary drilling gas against said surface of the object to remove the molten and/or evaporated material.
- oxygen is used, but in cases where an oxidation of the object must be avoided, an inert gas, such as argon, may be used.
- an inert gas such as argon
- the geometry and diameter of the hole can be adjusted by adjustments in energy or focusing.
- molten and/or evaporated material is ejected from the hole, first upwards and later downwards through the hole at the burn-through of the laser beam.
- the geometry of the hole may vary from cylindrical to conically convergent or divergent.
- a small flash or burr of molten material is normally formed along the edge of the hole.
- the molten and/or evaporated spatter material and the flash or burr formation are major disadvantages of the art. This is more particularly the case in the perforation of one wall of injection needles, where the removal of spatter from the external and internal surfaces necessitates complicated cleaning operations.
- the outside burr formation must further be reduced in order to reduce the pain at the injection of the needle, and in order to reduce damage to a surface coating, if any, e.g. a silicone coating of the needle.
- a further serious disadvantage is the difficulty of avoiding a perforation or contamination of the opposite wall of small-diameter thin-walled objects.
- a sluicing or flushing of the back of the object during the drilling operation with a backing fluid under pressure, preferably pure water or a pure inert gas.
- the pressure of said backing fluid will blow the molten and/ or evaporated spatter material upwards and out through the hole at the moment of beam penetration.
- water or a similar fluid is used, the instant heating and the sudden formation of the added pressure in a local vapour bubble at the inner surface of the object will greatly increase the cleaning effect.
- the formation of a flash or burr along the edges of the hole will be significantly reduced due to the cooling effect of the fluid.
- the method according to the present invention is particularly advantageous in the laser perforation of one wall of tubular objects, where the backing fluid passed through the tube will effectively prevent perforation or contamination of the opposite wall of the tubular object.
- the cooling fluid will stabilize the drilling process as a whole, and make the laser parameters less sensitive to small variations and irregularities, a fact of great importance in a production situation.
- the method according to the present invention is more particularly advantageous in the perforation of thin-walled injection needles for medical use, where the internal fluid will carry away any residual spatter or other impurities formed inside the needle.
- Figure 1 is a schematic presentation of the main principles of prior art in a first method of laser drilling of narrow holes through an object
- Figure 2 is a schematic presentation of the main principles of prior art in a second method of laser drilling of narrow holes through an object
- Figure 3 is a schematic presentation of the main principles of prior art in laser drilling of narrow holes through the wall of tubular objects;
- Figure 4 is a schematic presentation of the main principles of the invented method of laser drilling of narrow holes through an object.
- Figure 5 is a schematic presentation of the main principles of the invented method of laser drilling of narrow holes through one wall of a tubular object.
- Figure 1 shows schematically the main principles of prior art in a first method of laser drilling of narrow holes 1 through a solid object 2.
- the object 2 may be of any solid material, e.g. metallic, ceramic or thermoplastic.
- An intense laser beam 3 is focused by an optical lens 4 on or slightly below the surface of the object 2 where the perforation has to take place.
- an excentric gas nozzle 5 blows an auxiliary drilling gas 6 against the surface of the object to remove the molten and/or evaporated material.
- an inert cover gas such as argon
- Figure 2 shows schematically the main principles of a second method of laser drilling, where a concentric nozzle 7 blows an auxiliary drilling gas 8 against the surface of the object 2.
- Figure 3 shows schematically the main principles of prior art in laser drilling of narrow holes through the irradiated wall 9 of a tubular object 20.
- a pulsed laser beam 3 for the focusing of a well-defined amount of energy which is just sufficient to melt and/or evaporate the material struck by the laser beam 3.
- the geometry and diameter of the hole 1 can be adjusted by adjustments in energy or focusing.
- molten and/or evaporated spatter material is ejected from the hole 1, first upwards 10 and later downwards 11 through the hole at the burn-through of the laser beam.
- the geometry of the hole may vary from cylindrical to conically convergent or divergent.
- a small flash or burr 12 is normally formed along the edges of the hole.
- a major disadvantage of prior art is the formation of spatter material 11 inside the tubular object 20, and the difficulty of avoiding a contamination 11 or perforation 13 of the opposite wall of small-diameter tubular objects 20 such as thin-walled injection needles.
- Figure 4 shows schematically the main principles of the invented method of laser drilling of narrow holes 14 through a solid object 2.
- a sluicing or flushing of the back of the object during the drilling operation with a backing fluid under pressure 15, preferably pure water or a pure inert gas from a nozzle 16.
- the pressure of said backing fluid 15 will blow the molten and/or evaporated material upwards and out through the hole 14 at the moment of beampenetration.
- Figure 5 shows schematically the main principles of the invented method of laser drilling of narrow holes through the irradiated wall 9 of a tubular object 20.
- a sluicing or flushing of the inside of the tube wall 9 during the drilling operation with a backing fluid under pressure 17, preferably pure water or a pure inert gas which is passed through the tubular object 20.
- the backing fluid 17 will blow the molten and/or evaporated material 18 out through the hole at the moment of beam penetration.
- water or a similar fluid is used, the instant heating and the sudden formation of added pressure in a local vapour bubble 19 at the inner surface of the object will greatly increase the cleaning effect.
- the backing fluid will effectively prevent the contamination 11 or perforation 13 of the opposite wall of small-diameter objects 20 such as thin-walled injection needles.
- the formation of a flash or burr 12 along the edges of the hole will be significantly reduced due to the cooling effect of the backing fluid 17, the internal cooling fluid 17 will stabilize the drilling process as a whole, and the internal fluid 17 will carry away any residual material spatter or other impurities formed inside the needle.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Un procédé amélioré, et son application, de perçage au laser de petits trous (14) dans des objets céramiques, thermoplastiques ou solides, par exemple en métal (2, 20), consistent à rincer l'arrière de l'objet pendant l'opération de perçage avec un fluide de refoulement sous pression (15, 7), tel que de préférence de l'eau pure ou un gaz inerte pur. Lors du perçage au laser de petits trous (14) dans la paroi d'objets tubulaires (20), on fait passer le fluide de refoulement à travers l'objet tubulaire pendant l'opération de perçage. Une application particulièrement avantageuse de la présente invention et la production de petits trous (14) dans des aiguilles d'injection de petit diamètre et à fine paroi (20) destinées à une usage médical, telles que des aiguilles ayant généralement une épaisseur de paroi de 0,1 mm, perforée avec des trous de 0,05 mm de diamètre ou moins.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/DK1987/000124 WO1989003274A1 (fr) | 1987-10-14 | 1987-10-14 | Procede et application de percage au laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/DK1987/000124 WO1989003274A1 (fr) | 1987-10-14 | 1987-10-14 | Procede et application de percage au laser |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1989003274A1 true WO1989003274A1 (fr) | 1989-04-20 |
Family
ID=8153424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DK1987/000124 WO1989003274A1 (fr) | 1987-10-14 | 1987-10-14 | Procede et application de percage au laser |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO1989003274A1 (fr) |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2252933A (en) * | 1991-02-21 | 1992-08-26 | Synthes | Method and apparatus for laser cutting a hollow metal workpiece. |
FR2699844A1 (fr) * | 1992-12-30 | 1994-07-01 | Snecma | Procédé et dispositif d'usinage par faisceau laser. |
US5345057A (en) * | 1993-03-25 | 1994-09-06 | Lasag Ag | Method of cutting an aperture in a device by means of a laser beam |
GB2291371A (en) * | 1994-07-21 | 1996-01-24 | Fuji Heavy Ind Ltd | Hole forming |
US5749287A (en) * | 1994-10-19 | 1998-05-12 | Tebel-Mkt B.V. | Perforated drainage pipe for draining whey/curd mass |
US5994667A (en) * | 1997-10-15 | 1999-11-30 | Scimed Life Systems, Inc. | Method and apparatus for laser cutting hollow workpieces |
WO2003008138A2 (fr) * | 2001-07-19 | 2003-01-30 | Nsk Ltd. | Procede de fabrication d'un ecrou pour vis a billes |
US6563080B2 (en) | 2001-02-15 | 2003-05-13 | Scimed Life Systems, Inc. | Laser cutting of stents and other medical devices |
WO2004002672A1 (fr) * | 2002-06-28 | 2004-01-08 | 3M Innovative Properties Company | Fabrication de tiges de soupapes |
WO2004004966A1 (fr) * | 2002-07-03 | 2004-01-15 | Boston Scientific Limited | Procede et systeme de decoupage au laser/jet de fluide |
US6777647B1 (en) | 2003-04-16 | 2004-08-17 | Scimed Life Systems, Inc. | Combination laser cutter and cleaner |
WO2005023480A1 (fr) * | 2003-09-05 | 2005-03-17 | Herbert Walter | Procede et dispositif pour percer des trous par impulsions laser co2 |
EP1598141A1 (fr) * | 2004-05-21 | 2005-11-23 | Hewlett-Packard Development Company, L.P. | Méthodes de traitement au laser |
US7067759B2 (en) | 2002-04-24 | 2006-06-27 | The Boc Group Plc | Metal working |
US7476034B2 (en) | 2003-08-28 | 2009-01-13 | Boston Scientific Scimed, Inc. | Dynamic bushing for medical device tubing |
WO2013086360A1 (fr) * | 2011-12-07 | 2013-06-13 | Forsman Andrew C | Procédés et systèmes pour utilisation en usinage laser |
US20140076857A1 (en) * | 2012-09-14 | 2014-03-20 | General Electric Company | System and method for manufacturing an airfoil |
WO2015036441A3 (fr) * | 2013-09-11 | 2015-07-16 | Robert Bosch Gmbh | Procédé de perçage au laser d'un composant |
CN106166644A (zh) * | 2015-05-21 | 2016-11-30 | 罗伯特·博世有限公司 | 用于工件的激光钻孔或激光切割的方法以及用于激光钻孔或激光切割的系统 |
CN110280915A (zh) * | 2019-05-24 | 2019-09-27 | 江苏大学 | 一种基于水下打孔改善制孔质量的激光打孔装置及方法 |
EP3851241A1 (fr) * | 2020-01-17 | 2021-07-21 | Raytheon Technologies Corporation | Procédé et système pour empêcher les contrecoups lors du perçage de pièces creuses au laser |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3601576A (en) * | 1967-09-25 | 1971-08-24 | Laser Tech Sa | Method for boring workpieces by laser pulses |
FR2222170A1 (fr) * | 1973-03-22 | 1974-10-18 | American Cyanamid Co | |
DE2338514A1 (de) * | 1973-07-30 | 1975-02-20 | Lks Laser Kombinationssysteme | Verfahren und vorrichtung zur laserstrahl-bearbeitung von werkstuecken |
US4048464A (en) * | 1975-08-22 | 1977-09-13 | Fuji Photo Film Co., Ltd. | Method of and means for cutting hose for high pressure hydraulic systems |
-
1987
- 1987-10-14 WO PCT/DK1987/000124 patent/WO1989003274A1/fr unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3601576A (en) * | 1967-09-25 | 1971-08-24 | Laser Tech Sa | Method for boring workpieces by laser pulses |
FR2222170A1 (fr) * | 1973-03-22 | 1974-10-18 | American Cyanamid Co | |
DE2338514A1 (de) * | 1973-07-30 | 1975-02-20 | Lks Laser Kombinationssysteme | Verfahren und vorrichtung zur laserstrahl-bearbeitung von werkstuecken |
US4048464A (en) * | 1975-08-22 | 1977-09-13 | Fuji Photo Film Co., Ltd. | Method of and means for cutting hose for high pressure hydraulic systems |
Cited By (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2252933A (en) * | 1991-02-21 | 1992-08-26 | Synthes | Method and apparatus for laser cutting a hollow metal workpiece. |
FR2673132A1 (fr) * | 1991-02-21 | 1992-08-28 | Synthes | Procede et dispositif pour decouper au laser une piece metallique creuse. |
GB2252933B (en) * | 1991-02-21 | 1995-01-11 | Synthes | Method and apparatus for laser cutting a hollow metal workpiece |
FR2699844A1 (fr) * | 1992-12-30 | 1994-07-01 | Snecma | Procédé et dispositif d'usinage par faisceau laser. |
EP0618036A1 (fr) * | 1992-12-30 | 1994-10-05 | Societe Nationale D'etude Et De Construction De Moteurs D'aviation "Snecma" | Procédé et dispositif d'usinage par faisceau laser |
US5345057A (en) * | 1993-03-25 | 1994-09-06 | Lasag Ag | Method of cutting an aperture in a device by means of a laser beam |
GB2291371A (en) * | 1994-07-21 | 1996-01-24 | Fuji Heavy Ind Ltd | Hole forming |
GB2291371B (en) * | 1994-07-21 | 1998-04-01 | Fuji Heavy Ind Ltd | Hole forming method and apparatus |
US5749287A (en) * | 1994-10-19 | 1998-05-12 | Tebel-Mkt B.V. | Perforated drainage pipe for draining whey/curd mass |
US5994667A (en) * | 1997-10-15 | 1999-11-30 | Scimed Life Systems, Inc. | Method and apparatus for laser cutting hollow workpieces |
US6563080B2 (en) | 2001-02-15 | 2003-05-13 | Scimed Life Systems, Inc. | Laser cutting of stents and other medical devices |
US6867389B2 (en) | 2001-02-15 | 2005-03-15 | Scimed Life Systems, Inc. | Laser cutting of stents and other medical devices |
WO2003008138A2 (fr) * | 2001-07-19 | 2003-01-30 | Nsk Ltd. | Procede de fabrication d'un ecrou pour vis a billes |
WO2003008138A3 (fr) * | 2001-07-19 | 2003-07-03 | Nsk Ltd | Procede de fabrication d'un ecrou pour vis a billes |
US7067759B2 (en) | 2002-04-24 | 2006-06-27 | The Boc Group Plc | Metal working |
WO2004002672A1 (fr) * | 2002-06-28 | 2004-01-08 | 3M Innovative Properties Company | Fabrication de tiges de soupapes |
US6888098B1 (en) | 2002-07-03 | 2005-05-03 | Scimed Life Systems, Inc. | Tubular cutting process and system |
US9180032B2 (en) | 2002-07-03 | 2015-11-10 | Boston Scientific Scimed, Inc. | Tubular cutting process and system |
WO2004004966A1 (fr) * | 2002-07-03 | 2004-01-15 | Boston Scientific Limited | Procede et systeme de decoupage au laser/jet de fluide |
US6777647B1 (en) | 2003-04-16 | 2004-08-17 | Scimed Life Systems, Inc. | Combination laser cutter and cleaner |
US7476034B2 (en) | 2003-08-28 | 2009-01-13 | Boston Scientific Scimed, Inc. | Dynamic bushing for medical device tubing |
WO2005023480A1 (fr) * | 2003-09-05 | 2005-03-17 | Herbert Walter | Procede et dispositif pour percer des trous par impulsions laser co2 |
EP1598141A1 (fr) * | 2004-05-21 | 2005-11-23 | Hewlett-Packard Development Company, L.P. | Méthodes de traitement au laser |
US7163640B2 (en) | 2004-05-21 | 2007-01-16 | Hewlett-Packard Development Company, L.P. | Methods and systems for laser processing |
US7938512B2 (en) | 2004-05-21 | 2011-05-10 | Hewlett-Packard Development Company, L.P. | Methods and systems for laser processing |
WO2013086360A1 (fr) * | 2011-12-07 | 2013-06-13 | Forsman Andrew C | Procédés et systèmes pour utilisation en usinage laser |
US9815141B2 (en) | 2011-12-07 | 2017-11-14 | General Atomics | Methods and systems for use in laser machining |
CN104254428A (zh) * | 2011-12-07 | 2014-12-31 | 通用原子公司 | 用于激光制造加工的方法和系统 |
CN106001945A (zh) * | 2011-12-07 | 2016-10-12 | 通用原子公司 | 用于激光制造加工的方法和系统 |
US8969760B2 (en) * | 2012-09-14 | 2015-03-03 | General Electric Company | System and method for manufacturing an airfoil |
US20140076857A1 (en) * | 2012-09-14 | 2014-03-20 | General Electric Company | System and method for manufacturing an airfoil |
CN105899324A (zh) * | 2013-09-11 | 2016-08-24 | 罗伯特·博世有限公司 | 对构件进行激光钻孔的方法 |
WO2015036441A3 (fr) * | 2013-09-11 | 2015-07-16 | Robert Bosch Gmbh | Procédé de perçage au laser d'un composant |
CN106166644A (zh) * | 2015-05-21 | 2016-11-30 | 罗伯特·博世有限公司 | 用于工件的激光钻孔或激光切割的方法以及用于激光钻孔或激光切割的系统 |
CN106166644B (zh) * | 2015-05-21 | 2021-04-27 | 罗伯特·博世有限公司 | 用于工件的激光钻孔或激光切割的方法以及用于激光钻孔或激光切割的系统 |
CN110280915A (zh) * | 2019-05-24 | 2019-09-27 | 江苏大学 | 一种基于水下打孔改善制孔质量的激光打孔装置及方法 |
EP3851241A1 (fr) * | 2020-01-17 | 2021-07-21 | Raytheon Technologies Corporation | Procédé et système pour empêcher les contrecoups lors du perçage de pièces creuses au laser |
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