WO1989003274A1 - Procede et application de percage au laser - Google Patents

Procede et application de percage au laser Download PDF

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Publication number
WO1989003274A1
WO1989003274A1 PCT/DK1987/000124 DK8700124W WO8903274A1 WO 1989003274 A1 WO1989003274 A1 WO 1989003274A1 DK 8700124 W DK8700124 W DK 8700124W WO 8903274 A1 WO8903274 A1 WO 8903274A1
Authority
WO
WIPO (PCT)
Prior art keywords
holes
drilling
laser drilling
narrow holes
application
Prior art date
Application number
PCT/DK1987/000124
Other languages
English (en)
Inventor
Steen Erik Nielsen
Original Assignee
Akademiet For De Tekniske Videnskaber, Svejsecentr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akademiet For De Tekniske Videnskaber, Svejsecentr filed Critical Akademiet For De Tekniske Videnskaber, Svejsecentr
Priority to PCT/DK1987/000124 priority Critical patent/WO1989003274A1/fr
Publication of WO1989003274A1 publication Critical patent/WO1989003274A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Definitions

  • This invention relates to the Method of producing narrow holes through an object by the application of laser drilling.
  • the invention relates in particular to the perforation of solid objects of e.g. metallic, ceramic or thermoplastic materials, more particularly to the perforation of the wall of tubular objects, and most particularly to the perforation of the wall of injection need- les for medical use.
  • the invention further relates to objects perforated by one or more narrow holes by application of the invented method of laser drilling, in particular to perforated injection needles for medical use.
  • Injection needles of this kind may typically have a stainless steel wall of a thickness of 0.1 mm perforated by a number of holes of 0.05 nm diameter or less.
  • Laser drilling is normally performed by focusing an intense laser beam on the surface of the object where the perforation has to take place.
  • a gas nozzle may blow an auxiliary drilling gas against said surface of the object to remove the molten and/or evaporated material.
  • oxygen is used, but in cases where an oxidation of the object must be avoided, an inert gas, such as argon, may be used.
  • an inert gas such as argon
  • the geometry and diameter of the hole can be adjusted by adjustments in energy or focusing.
  • molten and/or evaporated material is ejected from the hole, first upwards and later downwards through the hole at the burn-through of the laser beam.
  • the geometry of the hole may vary from cylindrical to conically convergent or divergent.
  • a small flash or burr of molten material is normally formed along the edge of the hole.
  • the molten and/or evaporated spatter material and the flash or burr formation are major disadvantages of the art. This is more particularly the case in the perforation of one wall of injection needles, where the removal of spatter from the external and internal surfaces necessitates complicated cleaning operations.
  • the outside burr formation must further be reduced in order to reduce the pain at the injection of the needle, and in order to reduce damage to a surface coating, if any, e.g. a silicone coating of the needle.
  • a further serious disadvantage is the difficulty of avoiding a perforation or contamination of the opposite wall of small-diameter thin-walled objects.
  • a sluicing or flushing of the back of the object during the drilling operation with a backing fluid under pressure, preferably pure water or a pure inert gas.
  • the pressure of said backing fluid will blow the molten and/ or evaporated spatter material upwards and out through the hole at the moment of beam penetration.
  • water or a similar fluid is used, the instant heating and the sudden formation of the added pressure in a local vapour bubble at the inner surface of the object will greatly increase the cleaning effect.
  • the formation of a flash or burr along the edges of the hole will be significantly reduced due to the cooling effect of the fluid.
  • the method according to the present invention is particularly advantageous in the laser perforation of one wall of tubular objects, where the backing fluid passed through the tube will effectively prevent perforation or contamination of the opposite wall of the tubular object.
  • the cooling fluid will stabilize the drilling process as a whole, and make the laser parameters less sensitive to small variations and irregularities, a fact of great importance in a production situation.
  • the method according to the present invention is more particularly advantageous in the perforation of thin-walled injection needles for medical use, where the internal fluid will carry away any residual spatter or other impurities formed inside the needle.
  • Figure 1 is a schematic presentation of the main principles of prior art in a first method of laser drilling of narrow holes through an object
  • Figure 2 is a schematic presentation of the main principles of prior art in a second method of laser drilling of narrow holes through an object
  • Figure 3 is a schematic presentation of the main principles of prior art in laser drilling of narrow holes through the wall of tubular objects;
  • Figure 4 is a schematic presentation of the main principles of the invented method of laser drilling of narrow holes through an object.
  • Figure 5 is a schematic presentation of the main principles of the invented method of laser drilling of narrow holes through one wall of a tubular object.
  • Figure 1 shows schematically the main principles of prior art in a first method of laser drilling of narrow holes 1 through a solid object 2.
  • the object 2 may be of any solid material, e.g. metallic, ceramic or thermoplastic.
  • An intense laser beam 3 is focused by an optical lens 4 on or slightly below the surface of the object 2 where the perforation has to take place.
  • an excentric gas nozzle 5 blows an auxiliary drilling gas 6 against the surface of the object to remove the molten and/or evaporated material.
  • an inert cover gas such as argon
  • Figure 2 shows schematically the main principles of a second method of laser drilling, where a concentric nozzle 7 blows an auxiliary drilling gas 8 against the surface of the object 2.
  • Figure 3 shows schematically the main principles of prior art in laser drilling of narrow holes through the irradiated wall 9 of a tubular object 20.
  • a pulsed laser beam 3 for the focusing of a well-defined amount of energy which is just sufficient to melt and/or evaporate the material struck by the laser beam 3.
  • the geometry and diameter of the hole 1 can be adjusted by adjustments in energy or focusing.
  • molten and/or evaporated spatter material is ejected from the hole 1, first upwards 10 and later downwards 11 through the hole at the burn-through of the laser beam.
  • the geometry of the hole may vary from cylindrical to conically convergent or divergent.
  • a small flash or burr 12 is normally formed along the edges of the hole.
  • a major disadvantage of prior art is the formation of spatter material 11 inside the tubular object 20, and the difficulty of avoiding a contamination 11 or perforation 13 of the opposite wall of small-diameter tubular objects 20 such as thin-walled injection needles.
  • Figure 4 shows schematically the main principles of the invented method of laser drilling of narrow holes 14 through a solid object 2.
  • a sluicing or flushing of the back of the object during the drilling operation with a backing fluid under pressure 15, preferably pure water or a pure inert gas from a nozzle 16.
  • the pressure of said backing fluid 15 will blow the molten and/or evaporated material upwards and out through the hole 14 at the moment of beampenetration.
  • Figure 5 shows schematically the main principles of the invented method of laser drilling of narrow holes through the irradiated wall 9 of a tubular object 20.
  • a sluicing or flushing of the inside of the tube wall 9 during the drilling operation with a backing fluid under pressure 17, preferably pure water or a pure inert gas which is passed through the tubular object 20.
  • the backing fluid 17 will blow the molten and/or evaporated material 18 out through the hole at the moment of beam penetration.
  • water or a similar fluid is used, the instant heating and the sudden formation of added pressure in a local vapour bubble 19 at the inner surface of the object will greatly increase the cleaning effect.
  • the backing fluid will effectively prevent the contamination 11 or perforation 13 of the opposite wall of small-diameter objects 20 such as thin-walled injection needles.
  • the formation of a flash or burr 12 along the edges of the hole will be significantly reduced due to the cooling effect of the backing fluid 17, the internal cooling fluid 17 will stabilize the drilling process as a whole, and the internal fluid 17 will carry away any residual material spatter or other impurities formed inside the needle.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

Un procédé amélioré, et son application, de perçage au laser de petits trous (14) dans des objets céramiques, thermoplastiques ou solides, par exemple en métal (2, 20), consistent à rincer l'arrière de l'objet pendant l'opération de perçage avec un fluide de refoulement sous pression (15, 7), tel que de préférence de l'eau pure ou un gaz inerte pur. Lors du perçage au laser de petits trous (14) dans la paroi d'objets tubulaires (20), on fait passer le fluide de refoulement à travers l'objet tubulaire pendant l'opération de perçage. Une application particulièrement avantageuse de la présente invention et la production de petits trous (14) dans des aiguilles d'injection de petit diamètre et à fine paroi (20) destinées à une usage médical, telles que des aiguilles ayant généralement une épaisseur de paroi de 0,1 mm, perforée avec des trous de 0,05 mm de diamètre ou moins.
PCT/DK1987/000124 1987-10-14 1987-10-14 Procede et application de percage au laser WO1989003274A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/DK1987/000124 WO1989003274A1 (fr) 1987-10-14 1987-10-14 Procede et application de percage au laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DK1987/000124 WO1989003274A1 (fr) 1987-10-14 1987-10-14 Procede et application de percage au laser

Publications (1)

Publication Number Publication Date
WO1989003274A1 true WO1989003274A1 (fr) 1989-04-20

Family

ID=8153424

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DK1987/000124 WO1989003274A1 (fr) 1987-10-14 1987-10-14 Procede et application de percage au laser

Country Status (1)

Country Link
WO (1) WO1989003274A1 (fr)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2252933A (en) * 1991-02-21 1992-08-26 Synthes Method and apparatus for laser cutting a hollow metal workpiece.
FR2699844A1 (fr) * 1992-12-30 1994-07-01 Snecma Procédé et dispositif d'usinage par faisceau laser.
US5345057A (en) * 1993-03-25 1994-09-06 Lasag Ag Method of cutting an aperture in a device by means of a laser beam
GB2291371A (en) * 1994-07-21 1996-01-24 Fuji Heavy Ind Ltd Hole forming
US5749287A (en) * 1994-10-19 1998-05-12 Tebel-Mkt B.V. Perforated drainage pipe for draining whey/curd mass
US5994667A (en) * 1997-10-15 1999-11-30 Scimed Life Systems, Inc. Method and apparatus for laser cutting hollow workpieces
WO2003008138A2 (fr) * 2001-07-19 2003-01-30 Nsk Ltd. Procede de fabrication d'un ecrou pour vis a billes
US6563080B2 (en) 2001-02-15 2003-05-13 Scimed Life Systems, Inc. Laser cutting of stents and other medical devices
WO2004002672A1 (fr) * 2002-06-28 2004-01-08 3M Innovative Properties Company Fabrication de tiges de soupapes
WO2004004966A1 (fr) * 2002-07-03 2004-01-15 Boston Scientific Limited Procede et systeme de decoupage au laser/jet de fluide
US6777647B1 (en) 2003-04-16 2004-08-17 Scimed Life Systems, Inc. Combination laser cutter and cleaner
WO2005023480A1 (fr) * 2003-09-05 2005-03-17 Herbert Walter Procede et dispositif pour percer des trous par impulsions laser co2
EP1598141A1 (fr) * 2004-05-21 2005-11-23 Hewlett-Packard Development Company, L.P. Méthodes de traitement au laser
US7067759B2 (en) 2002-04-24 2006-06-27 The Boc Group Plc Metal working
US7476034B2 (en) 2003-08-28 2009-01-13 Boston Scientific Scimed, Inc. Dynamic bushing for medical device tubing
WO2013086360A1 (fr) * 2011-12-07 2013-06-13 Forsman Andrew C Procédés et systèmes pour utilisation en usinage laser
US20140076857A1 (en) * 2012-09-14 2014-03-20 General Electric Company System and method for manufacturing an airfoil
WO2015036441A3 (fr) * 2013-09-11 2015-07-16 Robert Bosch Gmbh Procédé de perçage au laser d'un composant
CN106166644A (zh) * 2015-05-21 2016-11-30 罗伯特·博世有限公司 用于工件的激光钻孔或激光切割的方法以及用于激光钻孔或激光切割的系统
CN110280915A (zh) * 2019-05-24 2019-09-27 江苏大学 一种基于水下打孔改善制孔质量的激光打孔装置及方法
EP3851241A1 (fr) * 2020-01-17 2021-07-21 Raytheon Technologies Corporation Procédé et système pour empêcher les contrecoups lors du perçage de pièces creuses au laser

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3601576A (en) * 1967-09-25 1971-08-24 Laser Tech Sa Method for boring workpieces by laser pulses
FR2222170A1 (fr) * 1973-03-22 1974-10-18 American Cyanamid Co
DE2338514A1 (de) * 1973-07-30 1975-02-20 Lks Laser Kombinationssysteme Verfahren und vorrichtung zur laserstrahl-bearbeitung von werkstuecken
US4048464A (en) * 1975-08-22 1977-09-13 Fuji Photo Film Co., Ltd. Method of and means for cutting hose for high pressure hydraulic systems

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3601576A (en) * 1967-09-25 1971-08-24 Laser Tech Sa Method for boring workpieces by laser pulses
FR2222170A1 (fr) * 1973-03-22 1974-10-18 American Cyanamid Co
DE2338514A1 (de) * 1973-07-30 1975-02-20 Lks Laser Kombinationssysteme Verfahren und vorrichtung zur laserstrahl-bearbeitung von werkstuecken
US4048464A (en) * 1975-08-22 1977-09-13 Fuji Photo Film Co., Ltd. Method of and means for cutting hose for high pressure hydraulic systems

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2252933A (en) * 1991-02-21 1992-08-26 Synthes Method and apparatus for laser cutting a hollow metal workpiece.
FR2673132A1 (fr) * 1991-02-21 1992-08-28 Synthes Procede et dispositif pour decouper au laser une piece metallique creuse.
GB2252933B (en) * 1991-02-21 1995-01-11 Synthes Method and apparatus for laser cutting a hollow metal workpiece
FR2699844A1 (fr) * 1992-12-30 1994-07-01 Snecma Procédé et dispositif d'usinage par faisceau laser.
EP0618036A1 (fr) * 1992-12-30 1994-10-05 Societe Nationale D'etude Et De Construction De Moteurs D'aviation "Snecma" Procédé et dispositif d'usinage par faisceau laser
US5345057A (en) * 1993-03-25 1994-09-06 Lasag Ag Method of cutting an aperture in a device by means of a laser beam
GB2291371A (en) * 1994-07-21 1996-01-24 Fuji Heavy Ind Ltd Hole forming
GB2291371B (en) * 1994-07-21 1998-04-01 Fuji Heavy Ind Ltd Hole forming method and apparatus
US5749287A (en) * 1994-10-19 1998-05-12 Tebel-Mkt B.V. Perforated drainage pipe for draining whey/curd mass
US5994667A (en) * 1997-10-15 1999-11-30 Scimed Life Systems, Inc. Method and apparatus for laser cutting hollow workpieces
US6563080B2 (en) 2001-02-15 2003-05-13 Scimed Life Systems, Inc. Laser cutting of stents and other medical devices
US6867389B2 (en) 2001-02-15 2005-03-15 Scimed Life Systems, Inc. Laser cutting of stents and other medical devices
WO2003008138A2 (fr) * 2001-07-19 2003-01-30 Nsk Ltd. Procede de fabrication d'un ecrou pour vis a billes
WO2003008138A3 (fr) * 2001-07-19 2003-07-03 Nsk Ltd Procede de fabrication d'un ecrou pour vis a billes
US7067759B2 (en) 2002-04-24 2006-06-27 The Boc Group Plc Metal working
WO2004002672A1 (fr) * 2002-06-28 2004-01-08 3M Innovative Properties Company Fabrication de tiges de soupapes
US6888098B1 (en) 2002-07-03 2005-05-03 Scimed Life Systems, Inc. Tubular cutting process and system
US9180032B2 (en) 2002-07-03 2015-11-10 Boston Scientific Scimed, Inc. Tubular cutting process and system
WO2004004966A1 (fr) * 2002-07-03 2004-01-15 Boston Scientific Limited Procede et systeme de decoupage au laser/jet de fluide
US6777647B1 (en) 2003-04-16 2004-08-17 Scimed Life Systems, Inc. Combination laser cutter and cleaner
US7476034B2 (en) 2003-08-28 2009-01-13 Boston Scientific Scimed, Inc. Dynamic bushing for medical device tubing
WO2005023480A1 (fr) * 2003-09-05 2005-03-17 Herbert Walter Procede et dispositif pour percer des trous par impulsions laser co2
EP1598141A1 (fr) * 2004-05-21 2005-11-23 Hewlett-Packard Development Company, L.P. Méthodes de traitement au laser
US7163640B2 (en) 2004-05-21 2007-01-16 Hewlett-Packard Development Company, L.P. Methods and systems for laser processing
US7938512B2 (en) 2004-05-21 2011-05-10 Hewlett-Packard Development Company, L.P. Methods and systems for laser processing
WO2013086360A1 (fr) * 2011-12-07 2013-06-13 Forsman Andrew C Procédés et systèmes pour utilisation en usinage laser
US9815141B2 (en) 2011-12-07 2017-11-14 General Atomics Methods and systems for use in laser machining
CN104254428A (zh) * 2011-12-07 2014-12-31 通用原子公司 用于激光制造加工的方法和系统
CN106001945A (zh) * 2011-12-07 2016-10-12 通用原子公司 用于激光制造加工的方法和系统
US8969760B2 (en) * 2012-09-14 2015-03-03 General Electric Company System and method for manufacturing an airfoil
US20140076857A1 (en) * 2012-09-14 2014-03-20 General Electric Company System and method for manufacturing an airfoil
CN105899324A (zh) * 2013-09-11 2016-08-24 罗伯特·博世有限公司 对构件进行激光钻孔的方法
WO2015036441A3 (fr) * 2013-09-11 2015-07-16 Robert Bosch Gmbh Procédé de perçage au laser d'un composant
CN106166644A (zh) * 2015-05-21 2016-11-30 罗伯特·博世有限公司 用于工件的激光钻孔或激光切割的方法以及用于激光钻孔或激光切割的系统
CN106166644B (zh) * 2015-05-21 2021-04-27 罗伯特·博世有限公司 用于工件的激光钻孔或激光切割的方法以及用于激光钻孔或激光切割的系统
CN110280915A (zh) * 2019-05-24 2019-09-27 江苏大学 一种基于水下打孔改善制孔质量的激光打孔装置及方法
EP3851241A1 (fr) * 2020-01-17 2021-07-21 Raytheon Technologies Corporation Procédé et système pour empêcher les contrecoups lors du perçage de pièces creuses au laser

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