WO1988010322A1 - Heating system for reaction chamber of chemical vapor deposition equipment - Google Patents
Heating system for reaction chamber of chemical vapor deposition equipment Download PDFInfo
- Publication number
- WO1988010322A1 WO1988010322A1 PCT/US1988/002117 US8802117W WO8810322A1 WO 1988010322 A1 WO1988010322 A1 WO 1988010322A1 US 8802117 W US8802117 W US 8802117W WO 8810322 A1 WO8810322 A1 WO 8810322A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heating system
- vapor deposition
- reaction chamber
- chemical vapor
- processing cycle
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title abstract 5
- 238000005229 chemical vapour deposition Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000376 reactant Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation by radiant heating of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
A heating system for use in chemical vapor deposition equipment of the type wherein a reactant gas is directed in a horizontal flow for depositing materials on a substrate which is supported in a reaction chamber (10) on a susceptor (20) which is rotatably driven for rotating the substrate about an axis which extends normally from its center. The heating system works in conjunction with a special heat sensing arrangement and includes an upper heating element assembly (32), a lower heating element assembly (34) and a heat concentrator mechanism (36) which interact to provide rapid temperature build-up at the beginning of a processing cycle, rapid temperature attenuation at the end of a processing cycle and a controlled flat temperature profile during the processing cycle.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63506405A JPH07100863B2 (en) | 1987-06-18 | 1988-06-17 | Heating device for reaction chamber of chemical vapor deposition equipment |
EP88906646A EP0363437B1 (en) | 1987-06-18 | 1988-06-17 | Heating system for reaction chamber of chemical vapor deposition equipment |
DE3852642T DE3852642T2 (en) | 1987-06-18 | 1988-06-17 | HEATING SYSTEM FOR REACTION CHAMBER OF A CHEMICAL VAPOR DEPOSIT DEVICE. |
HK76095A HK76095A (en) | 1987-06-18 | 1995-05-18 | Heating system for reaction chamber of chemical vapor deposition equipment |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/063,409 US4836138A (en) | 1987-06-18 | 1987-06-18 | Heating system for reaction chamber of chemical vapor deposition equipment |
US063,409 | 1987-06-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1988010322A1 true WO1988010322A1 (en) | 1988-12-29 |
Family
ID=22049003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1988/002117 WO1988010322A1 (en) | 1987-06-18 | 1988-06-17 | Heating system for reaction chamber of chemical vapor deposition equipment |
Country Status (8)
Country | Link |
---|---|
US (1) | US4836138A (en) |
EP (1) | EP0363437B1 (en) |
JP (1) | JPH07100863B2 (en) |
AT (1) | ATE116381T1 (en) |
DE (1) | DE3852642T2 (en) |
HK (1) | HK76095A (en) |
SG (1) | SG38910G (en) |
WO (1) | WO1988010322A1 (en) |
Cited By (5)
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---|---|---|---|---|
EP0445596A2 (en) * | 1990-03-09 | 1991-09-11 | Applied Materials, Inc. | Double-dome reactor for semiconductor processing |
EP0471365A1 (en) * | 1990-08-16 | 1992-02-19 | Applied Materials, Inc. | Semiconductor wafer processing apparatus |
EP0476307A1 (en) * | 1990-08-16 | 1992-03-25 | Applied Materials, Inc. | Apparatus and method for substrate heating in semiconductor processes |
BE1006988A3 (en) * | 1993-04-13 | 1995-02-07 | Imec Inter Uni Micro Electr | Device for use in the field of rapid thermal annealing techniques |
WO1998054381A1 (en) * | 1997-05-27 | 1998-12-03 | Memc Electronic Materials, Inc. | Secondary edge reflector for horizontal reactor |
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DE4130337C2 (en) * | 1991-09-12 | 2002-05-02 | Ego Elektro Blanc & Fischer | Method for operating an electric heating unit and electric heating unit |
US5332442A (en) * | 1991-11-15 | 1994-07-26 | Tokyo Electron Kabushiki Kaisha | Surface processing apparatus |
US5268989A (en) * | 1992-04-16 | 1993-12-07 | Texas Instruments Incorporated | Multi zone illuminator with embeded process control sensors and light interference elimination circuit |
US5534072A (en) * | 1992-06-24 | 1996-07-09 | Anelva Corporation | Integrated module multi-chamber CVD processing system and its method for processing subtrates |
US5445675A (en) * | 1992-07-09 | 1995-08-29 | Tel-Varian Limited | Semiconductor processing apparatus |
JPH06244269A (en) * | 1992-09-07 | 1994-09-02 | Mitsubishi Electric Corp | Semiconductor manufacturing apparatus, wafer vacuum chuck device thereof, and gas cleaning and nitride film formation therefor |
US5580388A (en) * | 1993-01-21 | 1996-12-03 | Moore Epitaxial, Inc. | Multi-layer susceptor for rapid thermal process reactors |
US5444217A (en) * | 1993-01-21 | 1995-08-22 | Moore Epitaxial Inc. | Rapid thermal processing apparatus for processing semiconductor wafers |
US5820686A (en) * | 1993-01-21 | 1998-10-13 | Moore Epitaxial, Inc. | Multi-layer susceptor for rapid thermal process reactors |
US5650082A (en) * | 1993-10-29 | 1997-07-22 | Applied Materials, Inc. | Profiled substrate heating |
US5504831A (en) * | 1993-11-10 | 1996-04-02 | Micron Semiconductor, Inc. | System for compensating against wafer edge heat loss in rapid thermal processing |
US5444815A (en) * | 1993-12-16 | 1995-08-22 | Texas Instruments Incorporated | Multi-zone lamp interference correction system |
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US5830277A (en) * | 1995-05-26 | 1998-11-03 | Mattson Technology, Inc. | Thermal processing system with supplemental resistive heater and shielded optical pyrometry |
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US6093252A (en) | 1995-08-03 | 2000-07-25 | Asm America, Inc. | Process chamber with inner support |
US5551985A (en) * | 1995-08-18 | 1996-09-03 | Torrex Equipment Corporation | Method and apparatus for cold wall chemical vapor deposition |
US5997588A (en) * | 1995-10-13 | 1999-12-07 | Advanced Semiconductor Materials America, Inc. | Semiconductor processing system with gas curtain |
US5805769A (en) * | 1996-03-21 | 1998-09-08 | Amana Company, L.P. | Adjustable ellipsoidal reflector for food heating apparatus |
US6072160A (en) * | 1996-06-03 | 2000-06-06 | Applied Materials, Inc. | Method and apparatus for enhancing the efficiency of radiant energy sources used in rapid thermal processing of substrates by energy reflection |
US5879459A (en) * | 1997-08-29 | 1999-03-09 | Genus, Inc. | Vertically-stacked process reactor and cluster tool system for atomic layer deposition |
US6217662B1 (en) | 1997-03-24 | 2001-04-17 | Cree, Inc. | Susceptor designs for silicon carbide thin films |
US5960158A (en) * | 1997-07-11 | 1999-09-28 | Ag Associates | Apparatus and method for filtering light in a thermal processing chamber |
US5990454A (en) | 1997-09-23 | 1999-11-23 | Quadlux, Inc. | Lightwave oven and method of cooking therewith having multiple cook modes and sequential lamp operation |
US6013900A (en) | 1997-09-23 | 2000-01-11 | Quadlux, Inc. | High efficiency lightwave oven |
US5958271A (en) | 1997-09-23 | 1999-09-28 | Quadlux, Inc. | Lightwave oven and method of cooking therewith with cookware reflectivity compensation |
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US5930456A (en) * | 1998-05-14 | 1999-07-27 | Ag Associates | Heating device for semiconductor wafers |
US5970214A (en) * | 1998-05-14 | 1999-10-19 | Ag Associates | Heating device for semiconductor wafers |
US6210484B1 (en) | 1998-09-09 | 2001-04-03 | Steag Rtp Systems, Inc. | Heating device containing a multi-lamp cone for heating semiconductor wafers |
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US6771895B2 (en) | 1999-01-06 | 2004-08-03 | Mattson Technology, Inc. | Heating device for heating semiconductor wafers in thermal processing chambers |
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US20050217585A1 (en) * | 2004-04-01 | 2005-10-06 | Blomiley Eric R | Substrate susceptor for receiving a substrate to be deposited upon |
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US7597574B2 (en) * | 2006-08-11 | 2009-10-06 | Asm America, Inc. | Lamp fasteners for semiconductor processing reactors |
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EP3652358A1 (en) | 2017-07-14 | 2020-05-20 | King Abdullah University Of Science And Technology | Metal organic chemical vapor deposition system and method |
KR102462263B1 (en) * | 2017-10-30 | 2022-11-02 | 어플라이드 머티어리얼스, 인코포레이티드 | Multi zone spot heating in epi |
US11032945B2 (en) * | 2019-07-12 | 2021-06-08 | Applied Materials, Inc. | Heat shield assembly for an epitaxy chamber |
US20220322492A1 (en) * | 2021-04-06 | 2022-10-06 | Applied Materials, Inc. | Epitaxial deposition chamber |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3836751A (en) * | 1973-07-26 | 1974-09-17 | Applied Materials Inc | Temperature controlled profiling heater |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4654509A (en) * | 1985-10-07 | 1987-03-31 | Epsilon Limited Partnership | Method and apparatus for substrate heating in an axially symmetric epitaxial deposition apparatus |
-
1987
- 1987-06-18 US US07/063,409 patent/US4836138A/en not_active Expired - Lifetime
-
1988
- 1988-06-17 AT AT88906646T patent/ATE116381T1/en not_active IP Right Cessation
- 1988-06-17 EP EP88906646A patent/EP0363437B1/en not_active Expired - Lifetime
- 1988-06-17 JP JP63506405A patent/JPH07100863B2/en not_active Expired - Lifetime
- 1988-06-17 DE DE3852642T patent/DE3852642T2/en not_active Expired - Lifetime
- 1988-06-17 SG SG1995906970A patent/SG38910G/en unknown
- 1988-06-17 WO PCT/US1988/002117 patent/WO1988010322A1/en active IP Right Grant
-
1995
- 1995-05-18 HK HK76095A patent/HK76095A/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3836751A (en) * | 1973-07-26 | 1974-09-17 | Applied Materials Inc | Temperature controlled profiling heater |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0445596A2 (en) * | 1990-03-09 | 1991-09-11 | Applied Materials, Inc. | Double-dome reactor for semiconductor processing |
EP0445596A3 (en) * | 1990-03-09 | 1991-12-18 | Applied Materials Inc. | Double-dome reactor for semiconductor processing |
EP0471365A1 (en) * | 1990-08-16 | 1992-02-19 | Applied Materials, Inc. | Semiconductor wafer processing apparatus |
EP0476307A1 (en) * | 1990-08-16 | 1992-03-25 | Applied Materials, Inc. | Apparatus and method for substrate heating in semiconductor processes |
EP0872574A2 (en) * | 1990-08-16 | 1998-10-21 | Applied Materials, Inc. | Radiantly heated reactor |
EP0872574A3 (en) * | 1990-08-16 | 1998-11-25 | Applied Materials, Inc. | Radiantly heated reactor |
BE1006988A3 (en) * | 1993-04-13 | 1995-02-07 | Imec Inter Uni Micro Electr | Device for use in the field of rapid thermal annealing techniques |
WO1998054381A1 (en) * | 1997-05-27 | 1998-12-03 | Memc Electronic Materials, Inc. | Secondary edge reflector for horizontal reactor |
Also Published As
Publication number | Publication date |
---|---|
JPH07100863B2 (en) | 1995-11-01 |
DE3852642T2 (en) | 1995-07-27 |
JPH03500549A (en) | 1991-02-07 |
EP0363437B1 (en) | 1994-12-28 |
ATE116381T1 (en) | 1995-01-15 |
EP0363437A1 (en) | 1990-04-18 |
US4836138A (en) | 1989-06-06 |
SG38910G (en) | 1995-09-01 |
HK76095A (en) | 1995-05-26 |
EP0363437A4 (en) | 1990-11-28 |
DE3852642D1 (en) | 1995-02-09 |
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