WO1986005435A1 - Cleaving machine - Google Patents

Cleaving machine Download PDF

Info

Publication number
WO1986005435A1
WO1986005435A1 PCT/LK1986/000001 LK8600001W WO8605435A1 WO 1986005435 A1 WO1986005435 A1 WO 1986005435A1 LK 8600001 W LK8600001 W LK 8600001W WO 8605435 A1 WO8605435 A1 WO 8605435A1
Authority
WO
WIPO (PCT)
Prior art keywords
stone
diamond
cleaved
holder
piece
Prior art date
Application number
PCT/LK1986/000001
Other languages
French (fr)
Inventor
Daya Ranjith Senanayake
Original Assignee
Daya Ranjith Senanayake
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daya Ranjith Senanayake filed Critical Daya Ranjith Senanayake
Publication of WO1986005435A1 publication Critical patent/WO1986005435A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material

Definitions

  • a mechanical device and process for grooving and cleaving all hard and brittle materials with cleaving grains such as sapphires, diamonds quartz etcetera.
  • the invention relates to the diamond and precious stones processing and cleaving fields and the cleaving of all other similar hard and brittle materials.
  • the background art for cleaving diamonds and precious stones is for the stones for example a rough diamond, which is to be cleaved to be a) Marked with ink at the point to be cleaved along the cleaving grain. b) Pasted with cement exposing the point to be cleaved and fixed onto a copper or metal holder.
  • a second stone or a piece of diamond with a sharp point is then pasted with cement and mounted onto a hand held stick or a stick mounted on a movable point.
  • the Diamond or stone to be cleaved is then held in a position and the second diamond or stone mounted on the stick is positioned over the cleaving point marked on the first stone. This is then rubbed vigorously by hand against the first stone until a groove is cut in the diamond or stone to be cleaved at the market point.
  • a thin blade is inserted into the groove and hammered sharply causing the diamond or stone to crack along the cleaving grain.
  • the invention is a mechanical device depicted in the drawing which consists of (1) a copper or metal holder which can be adjusted vertically and horizontally and is pushed forward by (2) a spring loaded device and (3) a second claw holder with adjustable claws which moves rapidly up and down at variable speed driven by an electric or any other motor or by a foot pedal and (h) belt drive, through a rotating shaft fixed to a camshaft.
  • the diamond or stone to be cleaved is a) Marked with ink at the point to be cleaved along the cleaving grain b) Pasted with cement or mechanically fixed to the copper or metal holder, exposing the point to be cleaved.
  • a second stone or diamond with a pyramid shape and a sharp edge is fixed in the adjustable claws of the. second clawholder.
  • the first holder is then adjusted vertically or horizontally until the point to be cleaved marked on the first stone or diamond touches the sharp edge of the second diamond which is fixed to the claw holder.
  • the second claw holder is then driven in a rapid up and down motion with a very short stroke.
  • the groove can be made in the exact position marked for cleaving because the two diamonds can be adjusted till they touch at the correct position.
  • a sharp edge on this mechanical device can be used to make grooves on many diamonds or stones as against which a number of sharp points can be used to make a groove on just a few diamoncfeor stones in the normal hand held method.

Abstract

The invention relates primarily to the field of grooving and cleaving precious stones and diamonds and all other types of hard and or brittle materials. The technical problem is that in making a groove on the stone or diamond or other piece of material to be cleaved in the present hand processes or other processes used it is extremely difficult and it takes a long time to make the groove in the correct place. It is also difficult and time consuming to make a narrow thin groove. The problem is solved in this invention by mounting the first stone or diamond or piece of material to be grooved and cleaved on a claw holder or other type of holder which is set on an adjustable device. The second stone or diamond or piece of material is mounted on a second holder with a thin edge standing out. This thin edge is then moved and adjusted to touch the first stone exactly at the point to be grooved and cleaved. By this means the groove is made only at the required position and because a thin edge (commonly found in sawn diamonds or stones is used) a narrow groove results and this leads to a high quality cleaving. The main uses of the invention are in increasing the production output of stone or diamond cleaving operations.

Description

CLEAVING MACHINE
DESCRIPTION
A mechanical device and process for grooving and cleaving all hard and brittle materials with cleaving grains such as sapphires, diamonds quartz etcetera.
The invention relates to the diamond and precious stones processing and cleaving fields and the cleaving of all other similar hard and brittle materials.
The background art for cleaving diamonds and precious stones is for the stones for example a rough diamond, which is to be cleaved to be a) Marked with ink at the point to be cleaved along the cleaving grain. b) Pasted with cement exposing the point to be cleaved and fixed onto a copper or metal holder.
A second stone or a piece of diamond with a sharp point is then pasted with cement and mounted onto a hand held stick or a stick mounted on a movable point.
The Diamond or stone to be cleaved is then held in a position and the second diamond or stone mounted on the stick is positioned over the cleaving point marked on the first stone. This is then rubbed vigorously by hand against the first stone until a groove is cut in the diamond or stone to be cleaved at the market point.
After the groove is made a thin blade is inserted into the groove and hammered sharply causing the diamond or stone to crack along the cleaving grain.
This hand grooving method is slow, laborious. Training operators takes about six months to 18 months or more as it depends entirely on practice to enable the operator to make the groove in the right place. The invention is a mechanical device depicted in the drawing which consists of (1) a copper or metal holder which can be adjusted vertically and horizontally and is pushed forward by (2) a spring loaded device and (3) a second claw holder with adjustable claws which moves rapidly up and down at variable speed driven by an electric or any other motor or by a foot pedal and (h) belt drive, through a rotating shaft fixed to a camshaft.
The diamond or stone to be cleaved is a) Marked with ink at the point to be cleaved along the cleaving grain b) Pasted with cement or mechanically fixed to the copper or metal holder, exposing the point to be cleaved. A second stone or diamond with a pyramid shape and a sharp edge (commonly found in sawn Diamonds) is fixed in the adjustable claws of the. second clawholder.
The first holder is then adjusted vertically or horizontally until the point to be cleaved marked on the first stone or diamond touches the sharp edge of the second diamond which is fixed to the claw holder.
This enables the operator to make the geove exactly on the nύarked point. The second claw holder is then driven in a rapid up and down motion with a very short stroke.
This rapidly causes a narrow groove to be cut in the first diamond or stone at the point marked for cleaving. The groove can be made in the exact position marked for cleaving because the two diamonds can be adjusted till they touch at the correct position.
(c) The grooving process is very rapid as the machine can be driven at variable speeds.
(d) Operators can be trained very rapidly in one to three months because the setting and adjustment of the stones has been simplified by the use of one holder which can be adjusted both horizontally and vertically and the use of a claw holder and a pyramid shaped diamond (sawn diamond) or stone which enables, very rapid fixing onto the claws.
Production in the normal hand held method is also hampered and slows down because the sharp point of the second diamond or stone used to make the groove gets blunted quickly. This stone has to be removed and replaced frequently. With this mechanical device a sharp edge of some length is used. As a result this does not get blunted and can be used for a longer period.
A sharp edge on this mechanical device can be used to make grooves on many diamonds or stones as against which a number of sharp points can be used to make a groove on just a few diamoncfeor stones in the normal hand held method. —

Claims

1 ) A machine and process for grooving and cleaving Diamonds precious stones and all other similar materials that may be handled in this way. This comprises a Mechanical device which consists of a copper or metal holder (1 ) or any other type of holder which can be adjus¬ ted vertically and horizontally and which is pushed forwards and backwards by a spring loaded device (2) a second claw holder (3) with adjustable claws which moves up and down or on a horizontal plane at variable speeds driven by an electric or any other motor or by a foot pedal and belt drive or hand drive through a rotating drive fixed to a camshaft. The Diamond or stone or other material to be cleaved is a) marked at the point to be grooved and cleaved. b) It is pasted with cement or adhesive or mechanically fixed or fixed by vacuum suction or by any other means to the holder exposing the point to be grooved and cleaved. c) A second Diamond or stone or piece of other suitable material with a pyramid shape or with a sharp edge (commonly found in Sawn Diamonds) is fixed in the adjustable claws of the second claw holder. The first holder is then adjusted until the point to be grooved and cleaved on the first stone or diamond or piece of material touches the sharp edge of the second stone, Diamond ' or piece of material which is fixed in the second claw holder. The second claw holder is then driven in a rapid or variable speed motion causing a narrow groove to be cut in the first stone, Diamond or piece of material. A thin blade is inserted in this groove and hammered against it causing the stone, Diamond or piece of material to be cleaved.
2) A machine and process according to claim one in which the stones, diamonds and materials to be cleaved and the materials used for grooving and cleaving are shaped or processed or treated in any way prior to insertion in the machine or after insertion in the machine. - k - ' 3) A machine and process according to claims one and two above by which the second stone, diamond or piece of material which is used to make the groove on the first one, is replaced by ultrasonic beams or particle beams or jets or water, air, gasses or other materials used in a similar way
PCT/LK1986/000001 1985-03-11 1986-03-11 Cleaving machine WO1986005435A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
LK9497 1985-03-11
LK949785 1985-03-11

Publications (1)

Publication Number Publication Date
WO1986005435A1 true WO1986005435A1 (en) 1986-09-25

Family

ID=19720950

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/LK1986/000001 WO1986005435A1 (en) 1985-03-11 1986-03-11 Cleaving machine

Country Status (2)

Country Link
EP (1) EP0213166A1 (en)
WO (1) WO1986005435A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2231835A (en) * 1989-05-25 1990-11-28 Marcel Biron Cleaving gemstones

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2716403A (en) * 1952-10-11 1955-08-30 Moser Ernest Machine for machining jewels
US3266476A (en) * 1964-02-17 1966-08-16 Swaab Jack Machine for cutting precious stones
GB2074910A (en) * 1980-04-23 1981-11-11 Gersan Etab Working gemstones

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2716403A (en) * 1952-10-11 1955-08-30 Moser Ernest Machine for machining jewels
US3266476A (en) * 1964-02-17 1966-08-16 Swaab Jack Machine for cutting precious stones
GB2074910A (en) * 1980-04-23 1981-11-11 Gersan Etab Working gemstones

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2231835A (en) * 1989-05-25 1990-11-28 Marcel Biron Cleaving gemstones

Also Published As

Publication number Publication date
EP0213166A1 (en) 1987-03-11

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