WO1985004980A1 - Composition adhesive anisotropiquement conductrice - Google Patents

Composition adhesive anisotropiquement conductrice Download PDF

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Publication number
WO1985004980A1
WO1985004980A1 PCT/US1985/000477 US8500477W WO8504980A1 WO 1985004980 A1 WO1985004980 A1 WO 1985004980A1 US 8500477 W US8500477 W US 8500477W WO 8504980 A1 WO8504980 A1 WO 8504980A1
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WO
WIPO (PCT)
Prior art keywords
conductive
substrate
area
areas
units
Prior art date
Application number
PCT/US1985/000477
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English (en)
Inventor
Ronald Allen Dery
Warren Charlie Jones
William Joseph Lynn
John Robert Rowlette
Original Assignee
Amp Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Incorporated filed Critical Amp Incorporated
Publication of WO1985004980A1 publication Critical patent/WO1985004980A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/029—Composite material comprising conducting material dispersed in an elastic support or binding material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0233—Deformable particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • This invention relates to conductive adhesive compositions and more particularly to an adhesive composition which is aniso ⁇ tropically conductive. There is an increasing need for reliable, efficient and economical means for interconnecting conductive areas on two substrates.
  • the anisotropically conductive adhesive disclosed herein provides one such means.
  • An anisotropically conductive adhesive is an adhesive composition which will permit electrical conductivity normal to the plane of the substrate to which the adhesive has been applied , while precluding conductivity between adjacent conductive areas in the plane of the substrate.
  • U. S. Patent 4, 170,677 discloses one such anisotropically conductive adhesive composition .
  • This disclosure reveals the use of whisker-like particles which are either paramagnetic or ferromagnetic.
  • U .S. Patent 4,252 ,391 discloses a method for preparing anisotropically pressure-sensitive electroconductive composite sheets. These sheets are comprised of electrically conductive fibers that have been distributed in a matrix of an electrically insulating substance. The fibers are aligned in a direction substantially perpendicular to the plane of the sheet.
  • the anisotropically conductive adhesive as disclosed in the present invention eliminates the necessity for using an externally applied force for orienting or aligning any particles . Further- more, the adhesive can be applied across the whole surface of the substrate. There is no need to apply the adhesive only to the conductive areas , nor to provide separate insulating means to preclude conductivity between adjacent areas in the same substrate.
  • An anisotropically conductive adhesive composition for use in electrically connecting at least one conductive area on one substrate with at least one conductive area on a second substrate, is disclosed herein.
  • the adhesive composition is comprised of a nonhomogenous mixture of conductive particles in a nonconductive adhesive binder.
  • the conductive particles are dispersed randomly throughout the mixture in noncontiguous conductive units , each unit being comprised of individual particles.
  • the units are sufficiently spaced apart to preclude electrical conductivity between adjacent conductive areas on the same substrate. Whereby, upon apply ⁇ ing a layer of the adhesive composition over the conductive and insulating areas on the first substrate and positioning in a conducting relationship and adhering said at least one conductive area on the second substrate with said at least one area on the first substrate, the units establish electrical connection between the adhered conductive areas on the two substrates.
  • a method for electrically connecting at least one conductive area on one substrate with at least one conductive area on a second substrate is also disclosed .
  • the method is comprised of the steps of: applying a layer of the herein disclosed aniso ⁇ tropically conductive composition over the conductive and insulating areas on a first substrate; positioning in a conducting relationship said at least one conductive area on the first substrate with said at least one conductive area on the second • substrate; adhering said at least one conductive area on the first substrate with said at least one conductive area on the second substrate, whereby the noncontiguous conductive units establish electrical connection between the adhered conductive areas on the two substrates.
  • a product comprised of at least two substrates , each substrate having at least one conductive area and at least one insulating area on at least one surface thereof, said at least one conductive area on a first substrate being electrically connected to a corresponding conductive area on a second substrate is also disclosed.
  • the electrical connection is accomplished by the method as taught herein .
  • FIGURE 1 is an enlarged fragmentary perspective view of the anisotropically conductive adhesive composition applied over conductive and insulating areas on a substrate.
  • FIGURE 2 is an enlarged fragmentary cross-sectional view showing a layer of the adhesive composition over the conductive and insulating layers on one substrate, with the conductive areas on the coated substrate positioned in a conducting relationship with conductive areas on a second substrate.
  • FIGURE 2A is an enlarged fragmentary cross-sectional view illustrating conductive units between two conductive areas, the units being comprised of flake shaped particles.
  • FIGURE 2B is a view similar to Figure 2A, the conductive units being comprised of spheroidal shaped particles .
  • FIGURE 3 is a view similar to view 2 after the two surfaces have been adhered to each other.
  • FIGURE 3A is a view similar to view 2A, after the two conductive areas have been adhered to each other.
  • FIGURE 3B is a view similar to view 2B , after the two conductive areas have been adhered to each other.
  • FIGURE 4 is a micrograph of the adhesive composition having five percent by volume of palladium-coated nickel flakes. The surface is magnified 100X using an optical microscope.
  • FIGURE 5 is a view similar to view 4, the adhesive composi- . tion having ten percent by volume of palladium-coated nickel flakes .
  • FIGURE 6 is a view similar to view 4, the composition having five percent by volume of silver-coated nickel spheroids.
  • FIGURE 7 is a diagram of a graph plotting the total resistance through a length of lead-in conductive trace, a lap joint between two conductive traces joined by means of the anisotropically conductive adhesive composition disclosed herein , and a length of lead-out conductive trace versus the combined trace length between the two measuring points but not contained in the lap joint.
  • FIGURE 8 is a diagrammatic view of the lap joint described in Figure 7 illustrating how the measurements were taken.
  • Figures 1 , 2 and 3 illustrate the intended use of the anisotropically conductive adhesive composition 10 which is comprised of a nonconductive adhesive binder 26 and a plurality of conductive particles , the particles being dispersed as non ⁇ contiguous conductive particle units 2 .-.
  • first substrate 12 has conductive areas 14, 14' and insulating areas 16 , 16' on one surface.
  • a layer 30 of the adhesive composition 10 is applied over the conductive 14, 14' and insulating areas 16, 16' on the first substrate 12.
  • the conductive units 24 are dispersed randomly throughout the layer.
  • the units 24 may be single particles or may be clusters 28 of particles .
  • conductivity between adjacent conductive areas 14, 14' is pre ⁇ cluded.
  • the conductive units 24 are not contiguous and , there- fore, cannot conduct electricity from one adjacent conductive area to another. There are, however , a sufficient number of conductive units 24 so that a plurality of the units 24 is deposited on the conductive areas 14 and 14' .
  • Figures 2 and 3 show a cross-sectional view of the substrates 12 and 18 having conductive areas 14, 14' and 20 , 20' deposited respectively thereon.
  • Figure 2 shows the conductive areas 20 and 20' positioned in a conducting relationship with the conductive areas 14 and 14' and insulating area 22 , 22' positioned in a conducting relationship with insulating areas 16 , 16' .
  • a layer of adhesive composition 30 has been deposited over the conductive 14, 14' and insulating areas 16 , 16' of substrate 12. The adhesive is typically applied in a layer about 0.013 to 0.051 millimeters thick.
  • Figure 3 shows the substrates 12 , 18 and their corresponding conductive 14, 14' and 20, 20' and insulating areas 16 , 16' and 22 , 22' adhered together.
  • Figure 3 also shows the conductive units 24 which electrically connect the conducting area 14 on substrate 12 with the corresponding conducting area 20 on substrate 18 and conductive area 1 ' to conductive area 20' .
  • Figures 2A , 2B , 3A and 3B are enlarged views of representative conductive units 24 in adhesive layer 30.
  • Figures 2A and 3A illustrate units 24 formed of flake shaped particles 50.
  • Figures 2B and 3B illustrate units 24 formed of spheroidal particles 52.
  • Figures 2A and 2B show a layer 30 of adhesive composition 10 applied to conductive area 14 with corresponding conductive area 20 positioned in a conducting relationship to area 14.
  • Figures 3A and 3B show conductive areas 14 and 20 after they have been adhered and electrically connected to each other.
  • FIGS 4, 5 and 6 are micrographs of three different formulations of the disclosed invention. All the micrographs are taken at 100X magnitication. The micrograph represents an actual area of 1 .143 millimeters by 0.889 millimeters. These micrographs illustrate that the conductive units 24 are sufficiently spaced apart in the binder 26 that there is no conductive path from one side of the area to another.
  • Figure 4 shows the dispersion of a five percent by volume of palladium-coated nickel flakes in a pressure-sensitive adhesive binder.
  • Figure 5 shows the dispersion of a ten percent by volume of palladium-coated nickel flakes in a pressure-sensitive adhesive binder.
  • Figure 6 shows the dispersion of particles in a five percent by volume of silver-coated nickel spheroids having an average diameter of eight microns in a pressure-sensitive adhesive binder .
  • the micrographs show that the number of particle clusters 28 increases as the percent by volume of conductive particles increases.
  • compositions of the anisotropically conductive adhe ⁇ sive were tested by applying a 2.54 centimeter wide layer of the adhesive to one end of a substrate having 1 .27 millimeter wide silver ink traces on 2.54 millimeter centerlines deposited thereon. A second substrate having a similar deposit of traces was adhered to the first substrate to form a 2.54 centimeter wide lap joint. Measurements of joint resistance were made to compare the effectiveness of various compositions of the anisotropically conductive adhesives and their ability to withstand environmental exposure. Referring now to Figure 8 , the resistance of a length of trace 34 starting on one substrate 36 , including the lap joint, 38 and ending on the second substrate 40 was measured.
  • Joint efficiency was found to be a useful parameter for comparing joint performance before and after environmental exposure since the resistance of the silver ink traces also changes during the test. Joint efficiency is defined as the measured joint conductance (reciprocal of resistance) divided by the theoretical joint conductance (reciprocal of theoretical joint resistance) .
  • the theoretical lap joint resistance depends only on the resistance per unit length of the silver ink traces and the joint length. It is independent of the number of perfectly conducting bridging elements found in a lap joint.
  • Insulation resistance was also measured between adjacent traces on the same substrate by applying a DC voltage of 100 g volts. These measurements were found to exceed 10 ohms .
  • the anisotropically conductive adhesives of this invention are made by mixing electrically conductive particles with a nonconductive adhesive binder. The percent by volume of the particles is regulated so that the particles are dispersed throughout the mixture as noncontiguous conductive units , each unit comprised of one or a plurality of individual particles.
  • the units are sufficiently spaced apart to preclude electrical conductivity between two or more adjacent conductive areas on the same substrate. There are, however , a sufficient number of particle units so that a plurality of units are applied to the conductive areas. Thus when conductive areas on two substrates are joined to each other, the conductive units provide an electrical contact between the conductive areas on the two substrates. The compliant nature of the units also ensures that a plurality of electrical interconnections will be achieved between corresponding conductive areas.
  • Anisotropically conductive adhesive compositions were made by varying the percentage loading from one to twenty percent by volume of the conductive particles in the nonconductive adhesive binder. The various compositions were applied to screened silver ink traces as previously described. Electrical conductivity through the lap joint occurred in ail cases. The resistance between traces on the same substrate began to de ⁇ crease at loadings greater than fifteen percent. The preferred loading range is from three to fifteen percent by volume. Particle loading within this range ensures that a plurality of conductive particle units are deposited on each conductive area. Loading within this range also ensures that resistance between traces on the same substrate is essentially equivalent to the resistance of the insulating substrate. A variety of conductive particles may be used .
  • These particles may be made from a single metal , a base metal coated with a noble metal such as silver, gold , palladium , platinum or rhenium , a non-metallic particle coated with a noble metal , or a conductive non-metallic substance.
  • a noble metal such as silver, gold , palladium , platinum or rhenium
  • a non-metallic particle coated with a noble metal or a conductive non-metallic substance.
  • the size of the particles is important. The particles should not be so large that one of them will bridge the gap between adjacent conductive areas on the same substrate.
  • the particles cannot be so fine that they will not disperse into noncontiguous conductive units.
  • Fine particles such as those used for conductive ink formulations tended to form a thin continuous sheet layer and were not found suitable for anisotropically conductive adhesive compositions. Con ⁇ ductivity through the adhesive layer will not be achieved uniess the conductive units approach the size of the depth of the adhesive layer.
  • the conductive unit may be a single particle or a plurality of clustered particles.
  • Adhesive compositions in accordance with the invention , have been prepared using nickel flakes having average di- mensions of 16.4 by 1 1 .7 by 6 microns coated with a noble metal . Silver , gold and palladium-coated flakes have been used. Adhesive compositions have also been made using spheroidal nickel particles coated with silver. Nickel flakes and nickel spheroidal particles with or without a noble metal coating are available from Nova-Met Corporation , Wycoff, New Jersey.
  • Glass spheres covered with a noble metal can also be used. These spheres are available from Potters Industries, Inc. , Hasbrouck Heights, New Jersey.
  • conductive particles de- scribed above are merely examples of the various types of parti ⁇ cles that may be used to make effective anisotropically conductive adhesives.
  • palladium-coated particles will provide improved electro-migration protection when aniso- tropically conductive adhesive compositions are used under conditions where moisture is a problem .
  • a variety of adhesive binders may be used such as pressure-sensitive adhesives , hot melt adhesives , and polymerizable adhesives. There are numerous adhesive binders available on the market.
  • the anisotropically conductive adhesive composition is formulated by adding a volume percentage of conductive particles to the binder. For any given volume percentage, the size of the particles will determine the number of particles in that volume. The number of particles varies inversely with the size of the particles used . Typically the particles used are smaller than the thickness of the adhesive layer.
  • the particles have a tendency to form clusters during the mixing of the composition . These clusters are of sufficient size to permit conductivity through the layer of adhesive composition. Larger particles, such as 25 micron spheres , are of a sufficient size to provide single particle conduction through 0.025 milli ⁇ meter thick layer of adhesive composition.
  • the adhesive composition may be applied to a substrate in a variety of ways depending upon the nature of the binder and the size of the particles used.
  • the adhesive composition may be directly applied to a substrate by silk-screening a solvated version of the composition and subsequently evaporating the solvent.
  • the adhesive composition can also be applied to a release paper by knife-spreading , si lk-screening , or extrusion tech ⁇ niques , and then covered with a second sheet of release paper. This is used as a transfer type of adhesive film.
  • the release paper is peeled from one side of the adhesive film , the film is applied to the desired area , and the second release paper is removed prior to attaching the second substrate.
  • the adhesive compositions may be extruded directly onto the desired substrate.
  • the anisotropically conductive adhesive composition as disclosed herein can be used to interconnect conductive areas such as silk-screened ink or electrodeposited traces on flexible substrates or circuit boards and can be used to mount component parts directly to circuit traces on such substrates.
  • the roller compression bonder was rolled back and forth over the joint area using two back and forth cycles parallel to the conductive traces and two back and forth cycles perpen ⁇ dicular to the conductive traces.
  • the back release paper was then peeled off.
  • a second polyester film strip with conductive ink traces similar to the first strip was positioned over the joint area to form a 2.54 centimeter lap joint with mating conductive traces aligned. Using light finger pressure, the second strip was tacked into place. Final bonding pressure was applied with a 7.26 kilogram, 8.25 centi ⁇ meter diameter steel disk roller compression bonder.
  • the roller compression bonder was rolled back and forth over the joint area using two back and forth cycles parallel to the conductive traces and two back and forth cycles perpendicular to the conductive traces. Electrical continuity could be demonstrated immediately after joint formation , but steady state bond properties typically took 72 hours to become fully established . 180 degree peel test and lap shear strength test results are shown in Table 1 . Joint resistance properties are shown in Table 2.
  • Example 2 An anisotropically conductive pressure-sensitive adhesive film with five percent by volume filler was produced by starting with 4.40 grams of palladium-coated nickel flakes and 25 grams of modified Morton binder. Lap joint specimens were made with this adhesive film in a manner similar to that described in Example 1 . The results of 180 degree peel tests and lap shear tests are shown in Table 1 . Joint resistance properties are shown in Table 2.
  • Example 3 An anisotropically conductive pressure-sensitive adhesive film with five percent by volume filler was produced by starting with 4.40 grams of palladium-coated nickel flakes and 25 grams of modified Morton binder. Lap joint specimens were made with this adhesive film in a manner similar to that described in Example 1 . The results of 180 degree peel tests and lap shear tests are shown in Table 1 . Joint resistance properties are shown in Table 2. Example 3
  • Example 2 An aniso ⁇ tropically conductive pressure-sensitive adhesive film with five percent by volume filler was produced by starting with 4.79 grams of coated nickel flakes similar to those described in Example 1 , but coated with gold (169.9 milligrams gold per gram of nickel) instead of palladium and 25 grams of modified Morton binder also described in Example 1 . Lap joint specimens were made with this adhesive film in a manner similar to that de- scribed in Example 1 . Joint resistance properties are shown in Table 2.
  • Example 4 Example 4
  • Example 5 an aniso ⁇ tropically conductive pressure-sensitive adhesive film with five percent by volume filler was produced by starting with 4.50 grams of silver-coated nickel spheroids (8 micron diameter , 15 percent by weight silver) and 25 grams of the modified Morton binder described in Example 1 . Lap joint specimens were made with this adhesive film in a manner similar to that described in Example 1 . Joint resistance properties are shown in Table 2.
  • Example 5 Example 5
  • Lap joints were made by utilizing 2.54 centimeter wide strips of polyester film with the five conductive traces centered on the film.
  • One strip without the anisotropically conductive adhesive film was placed trace-side-to-trace-side on top of a strip with the anisotropically conductive adhesive film.
  • the conductive traces on one strip were aligned with the conductive traces on the other strip and the joint area was subjected to a pressure of 2.46 kilograms per square centimeter gauge and a temperature of 120° Celsius for fifteen seconds.
  • Lap joints 2.54 centimeters long were made for the joint resistance and lap shear strength specimens .
  • Lap joints 5.08 centimeters long were made for the peel test specimens.
  • the lap joint strength properties are shown in Table 1 .
  • the lap joint resistance properties are shown in Table 2.
  • Example 4. h. Example 5. i. 95 percent Confidence limits for the average of five samples each consisting of the average of five individual trace measurements. k. 95 percent Confidence limits for the average of three samples each consisting of the average of five individual trace measurements. m. Cycled Temperature Humidity -- Test similar to (Mil. Std. 810C , Method 507.1 , Procedure 1 ) — ten cycles at 85 percent RH : 25C to 85C in two hours, 85C for six hours, 85C to 25C in sixteen hours.
  • anisotropically conductive adhesive composition of the present invention and many of its attendant advantages will be understood from the foregoing description and examples . It will be apparent that various changes may be made in the percentage composition of the components and the type of conductive particles used , without departing from the spirit or scope of the invention or sacrificing all its material advantages.
  • the anisotropically conductive adhesive composition may be used to interconnect conductive areas on a variety of substrates. The form herein described is merely a preferred or exemplary embodiment thereof.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

Composition adhésive anisotropiquement conductrice (10) à utiliser pour connecter électriquement au moins une zone conductrice (14) placée sur un substrat (12) à au moins une zone conductrice (20) placée sur un second substrat (18). La composition (10) consiste en un mélange de particules conductrices et d'un liant adhésif non conducteur (26). Les particules conductrices sont dispersées à travers le liant dans plusieurs éléments conducteurs non contigus (24), de manière que, en appliquant une couche (30) de la composition (10) sur la zone conductrice et la zone isolante (14, 16) sur un substrat (12) et en plaçant dans une relation de conductivité et en faisant adhérer au moins ladite zone conductrice (20) sur le second substrat (18) à au moins ladite zone conductrice (14) sur le premier substrat (12), les éléments (24) établissent une connexion électrique entre les zones conductrices adhérées (14, 20) sur les deux substrats (12, 18). Les éléments (24), toutefois, sont suffisamment espacés entre eux pour empêcher une conductivité électrique entre les zones adjacentes sur le même substrat. Sont également décrits un procédé de connexion électrique des zones conductrices sur deux substrats au moyen de cette composition adhésive anisotropiquement conductrice (0) ainsi que des produits fabriqués en utilisant ce procédé.
PCT/US1985/000477 1984-04-19 1985-04-16 Composition adhesive anisotropiquement conductrice WO1985004980A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US60183684A 1984-04-19 1984-04-19
US601,836 1984-04-19
US71036185A 1985-03-14 1985-03-14
US710,361 1985-03-14

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WO1985004980A1 true WO1985004980A1 (fr) 1985-11-07

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EP (1) EP0179805A1 (fr)
WO (1) WO1985004980A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0164674A2 (fr) * 1984-06-04 1985-12-18 Advanced Technology Laboratories, Inc. Couche mince de liaison à base d'époxy, conductrice de l'électricité
EP0242025A1 (fr) * 1986-02-14 1987-10-21 Hitachi Chemical Co., Ltd. Composition adhésive, conductrice de l'électricité et anisotrope, procédé de connexion de circuits et les circuits obtenus
EP0279979A1 (fr) * 1987-01-28 1988-08-31 Sheldahl, Inc. Adhésif conducteur
EP0414030A2 (fr) * 1989-08-07 1991-02-27 UNITED TECHNOLOGIES AUTOMOTIVE, Inc. Joint adhésif soudable
US5087494A (en) * 1991-04-12 1992-02-11 Minnesota Mining And Manufacturing Company Electrically conductive adhesive tape
WO1997027646A2 (fr) * 1996-01-26 1997-07-31 Hewlett-Packard Company Procede de formation d'interconnexions electriques a l'aide de conducteurs adhesifs isotropes et connexions ainsi formees
US8969707B2 (en) 2006-04-26 2015-03-03 Hitachi Chemical Company, Ltd. Adhesive tape and solar cell module using the same

Citations (4)

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Publication number Priority date Publication date Assignee Title
US3359145A (en) * 1964-12-28 1967-12-19 Monsanto Res Corp Electrically conducting adhesive
FR1538385A (fr) * 1967-06-22 1968-09-06 Nii R I Latexnykh Izdely Procédé de réalisation d'un contact électrique
FR2182098A1 (fr) * 1972-04-26 1973-12-07 Battelle Memorial Institute
EP0068793A2 (fr) * 1981-06-25 1983-01-05 Itt Industries, Inc. Connexion électrique fixe entre un ensemble de voies conductrices sur un substrat et un ensemble correspondant sur un circuit imprimé

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3359145A (en) * 1964-12-28 1967-12-19 Monsanto Res Corp Electrically conducting adhesive
FR1538385A (fr) * 1967-06-22 1968-09-06 Nii R I Latexnykh Izdely Procédé de réalisation d'un contact électrique
FR2182098A1 (fr) * 1972-04-26 1973-12-07 Battelle Memorial Institute
EP0068793A2 (fr) * 1981-06-25 1983-01-05 Itt Industries, Inc. Connexion électrique fixe entre un ensemble de voies conductrices sur un substrat et un ensemble correspondant sur un circuit imprimé

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0164674A2 (fr) * 1984-06-04 1985-12-18 Advanced Technology Laboratories, Inc. Couche mince de liaison à base d'époxy, conductrice de l'électricité
EP0164674A3 (fr) * 1984-06-04 1987-01-07 Advanced Technology Laboratories, Inc. Couche mince de liaison à base d'époxy, conductrice de l'électricité
EP0242025A1 (fr) * 1986-02-14 1987-10-21 Hitachi Chemical Co., Ltd. Composition adhésive, conductrice de l'électricité et anisotrope, procédé de connexion de circuits et les circuits obtenus
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
EP0279979A1 (fr) * 1987-01-28 1988-08-31 Sheldahl, Inc. Adhésif conducteur
EP0414030A2 (fr) * 1989-08-07 1991-02-27 UNITED TECHNOLOGIES AUTOMOTIVE, Inc. Joint adhésif soudable
EP0414030A3 (en) * 1989-08-07 1991-03-27 United Technologies Automotive, Inc. Weld-through adhesive sealant
US5087494A (en) * 1991-04-12 1992-02-11 Minnesota Mining And Manufacturing Company Electrically conductive adhesive tape
WO1997027646A2 (fr) * 1996-01-26 1997-07-31 Hewlett-Packard Company Procede de formation d'interconnexions electriques a l'aide de conducteurs adhesifs isotropes et connexions ainsi formees
WO1997027646A3 (fr) * 1996-01-26 1997-10-23 Hewlett Packard Co Procede de formation d'interconnexions electriques a l'aide de conducteurs adhesifs isotropes et connexions ainsi formees
US8969707B2 (en) 2006-04-26 2015-03-03 Hitachi Chemical Company, Ltd. Adhesive tape and solar cell module using the same
US8969706B2 (en) 2006-04-26 2015-03-03 Hitachi Chemical Company, Ltd. Adhesive tape and solar cell module using the same

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