WO1984002052A1

WO1984002052A1 - Apparatus for mounting electronic parts

Info

Publication number: WO1984002052A1
Application number: PCT/JP1983/000399
Authority: WO
Inventors: Makito Seno; Yoshikatsu Sakurai; Yoshihiko Misawa; Yoshinobu Maeda
Original assignee: Matsushita Electric Ind Co Ltd
Priority date: 1982-11-11
Filing date: 1983-11-10
Publication date: 1984-05-24
Also published as: DE3390320T1

Abstract

An apparatus for mounting electronic parts onto a printed circuit board includes a coating head (2) which applies a bonding agent or solder paste to a printed circuit board (5), and a mounting head (3) which removes electronic parts (a, b, c...) from a parts supply section (1), controls the positions of the removed electronic parts (a, b, c...), and then mounts them on the printed circuit board (5). Both heads (2), (3) are integrally provided on a head section (4) which moves relative to the printed circuit board (5). It is thereby possible to integrally conduct the application of the bonding agent and the mounting of the electronic parts (a, b, c...) by a single positioning motion of the head section (4).

Description

Specification

Title of invention

Electronic component mounting equipment

Technical field

The present invention relates to an electronic component mounting apparatus for mounting a chip type electronic component, a flat package type IG, etc. on a printed circuit board with an adhesive or the like. It is equipped with a coating head that applies a coating agent or solder paste, and a mounting head for electronic components.It is low-cost and compact, and the packaging of parts is for chip-type electronic components and IG. The IG can be supplied in the form of a tape, and the IG can be supplied as it is in the general package state.In addition, a small and low-cost parts supply device that can secure the stock amount can be provided. To provide.

Background technology ''

Conventional equipment used for mounting electronic components consists of two devices: a printing machine that prints adhesive or solder paste on a printed circuit board, and a mounting machine that mounts electronic components. It had been. In addition, when applying an adhesive and mounting electronic components on a ^single device, the size and shape of the electronic components are limited, and the cost of the device is high. For a small number of parts, there is a problem that the mounting cost is high.], Applying an adhesive or soldering paste with one unit, and changing the size and shape of the electronic parts There has been a demand for a small and inexpensive electronic component mounting device that has a mounting section that can handle it.

Disclosure of the invention

The present invention uses an adhesive or solder paste on a printed circuit board.

ΟΜΡΙ

, WIPO. With the application head that applies the electronic component: the electronic component from the supply section]) After taking out and regulating the position, the moving means having the mounting head to be attached to the printed circuit board and the electronic component are attached to the mounting head. It is composed of a component supply unit that supplies the electronic components to the electronic components, from the application of the adhesive to the mounting of the electronic components.

Brief description of drawings

FIG. 1 is a perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention, and FIG. 2 is a component supply unit and a head unit. FIG. 3 is a plan view showing the relationship between the tables, FIG. 3 is a side view showing the relationship between the component supply section and the head section: X Ϊ table, FIG. 4 is a cross-sectional view of the mounting head section, and FIG. And b are the front views of the main parts of the mounting head that sucks and regulates electronic components, FIG. 6 is a plan view of the head, FIG. 7 is a cross-sectional view of the coating head, and FIG. Fig. 8 '0 is the side view, Fig. 9 is a perspective view of the cassette of the electronic part supply part, Fig. 10 is the cassette of Fig. 9 FIG. 11 is a perspective view of an electronic component mounting device according to a second embodiment of the present invention, FIG. 12 is a new front view of the component supply device, and FIG. The figure is a side view of the main part.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. First, an outline of the present embodiment will be described.

FIG. 1 is a perspective view of the entire apparatus, in which several kinds of electronic components are stocked in a component supply unit 1. The head part 4 having two heads, the dispensing head 2 and the mounting head 3, moves in the X and Y directions, vacuum-adsorbs electronic components from the component supply unit 1, and simultaneously controls the position. At a predetermined position on the printed circuit board 5, the coating head 2 is first coated with an adhesive.

OMPI PO Then, the electronic component held by the mounting head 3 is mounted at the application position.

FIG. ² is a plan view of the apparatus]), and the parts a, b,...: F sent from the parts supply unit 1 are printed on the printed circuit board 5 positioned at a predetermined position. position a,, b to "..., sequentially one by ^one co is the also shows the state to continue to mount in the mounting move.

The adhesive application head 2 has a function of adhesive stock and application function, up / down operation, and XY horizontal rotation function. It is mounted on the tip of a table 6 that has the functions of lock and regulation, up and down movement, XΥ circuit, and that can move freely in the XΥ direction.

In the component mounting operation, a pair of dispensing head 2 and mounting head 3 start from a home position (not shown), and mounting head chucks component a by vacuum suction. Restrict the position. Next, the dispensing head 2 applies the adhesive to the position of the bristle substrate 5, and then the mounting head 3 moves to the position of the print substrate 5 and is dispensed. The component a is mounted on the adhesive.

The printed circuit board 5 is held by the printed circuit board holding means 7, is conveyed on the line, and can be stopped at a predetermined position close to the component supply unit 1.

The order in which the parts are mounted is controlled by NO control.)) Randomly, and X,? Two directions are indicated.

Next, a description will be given of the devices of the respective units that perform the above operations.

Fig. 3 is a side view of the device, and Fig. 2 and Fig. 3 explain the whole device. Coating head 2 and mounting head ³ are attached to shaft ⁸ . -Yes. The shaft 9 is provided with a support 1 O for supporting the printed circuit board S], and both are integrally connected by a connection frame 11. Shafts 8 and 9 are slidable relative to frame 11 in the Y- direction.

5 Y - Ryo direction operation, a full record over beam 1 ¹ summer sheet 1 ² fixed to the lower, - tip rotatably ¾ bearing and bracket ¹³ shown in FIG. 1 which is fixed to the shaft 9 is held, motor-which was attached taken to the lower end of the connecting the other end off-les-over-time "! ^{4.1 5} and the job Lee down by the door is the engagement of the ball screw 1 6] ?, motor-1 5 with a positive O made by reverse rotation o

The frame 11 is mounted on two shafts 1 S attached to the head 17 so that it can slide in the X—X ′ direction. X - X 'direction of operation, the nut 1 9 fixed to the central portion of the full record over beam 1 ^1, rotatable by Uniho 5 fe the bearing which is fixed a tip heads 1 7' is is the rotation of the forward and reverse 2 ¹ and by the job i cement has been ball screw 2 2 'intermeshing' ?, motor-21 - the other end a motor attached taken to heads 1 7. Therefore, by controlling the motors 15 and 21, the head 4 and the servo 1 O can freely move in the X—X and Υ— directions. This constitutes the driving means of the head 4.

FIG. 4 is a cross section of the mounting head ³ for mounting electronic components. ^{2 3} axes der] ?, piston tons 2 4 integrally with the air hole 2 5, 2 6 by the]) E § foremost housings 2 7 rotatably provided in Head unit 4 alternately It operates up and down by being supplied.

5 the lower end of the shaft ^{2 3,} Roh nozzle ² 8 Ru detachable, click Tsu tion ²⁹ It provided via a pin 3 0, by the groove ³¹ provided in the Roh nozzle ^{2 8)} is performed and regulation of rotation, to prevent falling off. It to is connected to a vacuum device via the hollow portion inside the shaft ^{2 3,} to suck the electronic component before end of Roh nozzle ^{2 8.}

3 2 is the axis guide] ?, fixed to the housing 2 <

³ 3 lower 3 ³ ¾ axis guide 3 2 slidably axially supported by the inner end face 3 3 a the axes 2 3 coaxial stepped portion at elevated ² 3 2L is blocked ³ 3 block ) in contact, are set both integral with Ttebane 3 4 the spring pressure prevailed hit Chi axis guide 3 2 lower ^{3 2} a to as to increase just before abutting. Thailand Mi ring for the pin ^{3 5} is implanted in the axial Guide ^{3 2,} than the maximum opening of the block ³ 3 of the inner end surface ^{3 3} a and the shaft guides the lower end 3 2 a]? A slight size Suridoiki slidably and Kakarihama the groove 3 ³ C with and engages the lower limit position of the pro click 3 ³ at the upper end of the groove 3 3 C. Further, in FIG. 5, the active claw body A 36 is engaged with the concave portion 38 a of the passive claw body A 38 via a fulcrum pin 3, and the mutual claw bodies A move in the same direction. Block 3 and block

3 ³ which is fixed to the bracket 3 ⁹ axially supported by a lever - Pin ⁴ 0,

4 by O a is swingably supported, respectively pawl tip 4 1 to the tip, 4 bolts 2 to the setting position 4 3, 4 fixed I by the 4 Contact ^, the compression spring ⁴ 5 The tip of the claw body is always pressed inward. The structure of the nail body B is the same as that of the nail body A described above. Next to] 0

In FIG. 4, reference numeral 46 denotes an actuator for XY rotation]), which can be moved to the head 4 by a pin 4 and a cylinder bracket 48. And can rotate around axis 23. ¾Connected to lever 5O. The lever SO is provided with a rotating guide shaft 51 vertically, slidably clamps the rotating guide shaft 51, and connects the shaft 23 with a block 52 fixed to the shaft 23. Rotate in XT direction. Lever one 5 0 is fixed to the housings ² Ryo, c c Managing 2 7 similarly to the shaft 2 3 also rotates, 3 2 and the shaft guide fixed to the housing 2 §, that provided at the distal end Rotate the check mechanism by the regulating claws 3β, 38, 4ΐ, 42 in the same way as the shaft 23. .

S3 and 54 in Fig. 6 are stoppers! ), When it comes into contact with lever 52, the position accuracy in the X X direction is secured.

Reference numeral 55 in FIG. 4 denotes a detector], and the nozzle 28 determines whether or not the electronic component has been correctly vacuum-adsorbed by the state of the degree of vacuum.

FIG. 3 is a cross-sectional view of the coating head 2 in FIG. 3], the operation in the vertical direction and the rotation direction, and the driving method are the same as those of the mounting head 3.

An adhesive tank 57 is provided at the lower end of the shaft 56 so as to be detachable, and further detachable. ¾Nozzle part S8! ? Is provided through the hollow portion of the shaft S6, and is discharged by an air pressure.

Reference numerals 59, 60, 61, and 62 denote electric switches for obtaining signals at each operating position.

In FIG. 4, the head portion 4 is fixed to a bracket 63 fixed to the shaft 8 in a vertically adjustable shape ¾.

Fig. 8 shows the packaging of electronic components. It has feed holes 64 provided at equal intervals on both sides, and the electronic component shape is evenly spaced at the center.]} Slightly smaller Ο On the tape ^{6 5} having a hole Me over § primary, lower O] adhesive tape -? 1 by the flop ^{6 6)} is fixed, is prepared wound into Li Lumpur 6 7 beforehand Figure 1

^> o

Fig. 9 shows a cassette 68], which is installed at the tip of the supply unit 1 in Fig. 1.

The tape ⁶ 5, by the Pina O provided e Lee Lumpur ^{6 9} cassette Tsu bets ^{6 8]} ?, is positioned, the host Lee Lumpur 6 9 Lachi - in Tsu DOO Organization 7 1! ) Sent by driving one pitch at a time. · To drive the ratchet mechanism 1, the lever 73 is moved up and down by the actuator 2 provided in the head section of FIG. ¹ , and the ratchet lever of FIG. 9 is moved. By rocking ⁴ ! Do).

FIG. 1O is a perspective view opposite to the cassette of FIG. 9], and a 5 is a lever, which is driven by the actuator ⁶ provided in the supply unit ¹ of FIG. , pull the adhesive tape 6 ⁶ of FIG. 8 below, by electronic components]? pull peel off.

Taken over Volume Le § 8 - adhesive tape 6 6, ^second view of 'by the frictional force between the shaft 7 §] rotate the take birds.

Next, a second embodiment of the present invention will be described.

FIG. 11 is a perspective view of the entire apparatus in the case of component supply by magazine]), and several types of electronic components are stocked in the component supply unit ⁹ .

Sectional side view der the first 2 FIG supply unit, the theory is bright along the flow of the component parts magazine ⁸¹ in the supply portion 8 O vignetting Mounting sequence on the circumference, shoe over that you want to component alignment part 8 and parts detection unit ^{8 3} in the ² Oh ¾ Ru parts rather than ¾ to that point Karachi - the Tsu door S 4 Akuchiyue

C? 7I '— ". 1 a— — Rotate with 85, and feed pitch between magazines with positioning 86. In Gerhard one entered component in isolation portion 8 ² parts article separating unit separating pin 8 7, 8 8 for component alignment one by one drop to the rotor 9 0 parts direction changing unit 8 9, rotor 9 O Ca 90 ° in rotated at, pusher one 9 2 are one preparative to scan rider ⁹ 1 straight line driving component transfer unit is positioned at the positioning portion 9 3 transports the parts. A mechanism for performing several operations with one drive source will be described with reference to FIG. Actuator 94 as drive means Lever 95 is moved automatically by slider 94. Slider 101 reciprocates, and pusher 92 attached to slider 91 moves forward. Then, the rack 96 pulled from the slider 91 before entering the rotor 90 is pulled forward by the panel 9 and moves forward, rotating the rotor 9 O and turning on the stopper 9 S. Positioned so that the groove for the rotor 9 O parts goes from vertical to horizontal. , So that the pusher 92 can be inserted. In this case the b over preparative other O with al will by the lever one ^{9 9} have connexion parts separating portion of the § - beam ¹ OO to摇動movement pins 1 O 1 as a fulcrum, 'rotor SO of the first 3 Figure and the separation § - No ¹ OO of the state is the minute cone pin 8 § moves forward in a state in which the rack 9 6 is advanced, holding the parts, the separation pin 8 8 is retracted parts by this thing Ru out by parts Russia Data 9 O falls on the outer circumference. At this time, the groove in which the components of the rotor 9O enter is horizontal. The vertical movement of the single separation pin 87 can adapt even if the length of the part changes, and the rotor SO also has the shunting pins 87 and S8, so the length changes. I can adapt. Then, the bushing 92 moves forward to transfer the components in the rotor 90 and perform positioning. Then the sliders 9 ¹ is retracted in the reverse operation when Akuchi Yueta ^{9 4} is retracted • I Pusshi turbocharger one 9 2 force the rotor 9 in the O]) pulled in a place that was missing out on the rack 9 6 gas La Lee da one 9 ¹ to retreat. At this time, the rotor attached to the rotor 90] swings in the opposite direction, so the arm of one piece is moved by the spring 97.] 8 ⁸ before

Into the groove through which the parts of the alignment part pass]])

Retreats, removes the previously held part, and the part falls to the separation pin 88. Sliders ⁹ 1 is further retreat positioning. At this time, the groove of the rotor 90 is in a vertical state, and the parts that have fallen on the outer periphery of the rotor 90 enter the groove of the rotor SO]}. Parts supply is performed by repeating the above operation.

Industrial applicability

As is clear from the above description, according to the present invention, the following excellent effects can be obtained.

(1) A head for applying an adhesive or a solder paste and a head for adsorbing and positioning an electronic component are provided in one moving means, and the application of an adhesive or a solder paste is performed. Since the components are mounted in a similar manner, it is suitable for mounting a relatively small number of electronic components. One [ ¹ ] Y table has ^two heads, so the cost is low. Inexpensive and compact.

0 (2) It is easy to adapt to changes in part shape and size.

Since it is easy to automate manual operations, it has the outstanding feature of greatly contributing to increased productivity.

Five

OMPI ヽ

Claims

The scope of the claims

1. A moving means for moving on a parallel plane with respect to the pre-sold substrate held at a predetermined position, and a driving means for driving the moving means, an adhesive for temporarily fixing an electronic component to the moving means, Or

5 Attach a coating head for applying a material similar to solder paste and a mounting head for transferring the electronic component, and move the electronic component to the mounting head in close proximity to the printed circuit board. An electronic component mounting device equipped with a component supply unit that supplies electronic components so that they can be taken out.

² * In claim 1, the part supply section includes a rotatable component supply section capable of storing a plurality of magazines storing electronic components l O on an outer periphery thereof, and a rotatable component supply section below the component supply section. ! ), The magazine]) a shunt section for transferring the electronic parts, a parts separation section having two evacuation bins for transferring the electronic parts one by one, and The electronic component is disposed below the separation unit, and the electronic component is moved from a vertical posture to a horizontal posture.

The component separating unit is composed of a rotatable component direction changing unit for changing the direction to 15 and a linear drive component transferring unit for horizontally transferring and positioning the electronic component in the direction changing unit to a fixed position. A mechanism for oscillating the separating pin, a rotating motion of the component direction conversion, a driving of the linear driving component transfer unit, and a driving of the two cone pins

An electronic component mounting device equipped with a component supplying device that has a single drive means that operates in conjunction with the device.

twenty five

O PI

Ϋ