USRE30348E - Solder preform - Google Patents

Solder preform Download PDF

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Publication number
USRE30348E
USRE30348E US06/002,325 US232579A USRE30348E US RE30348 E USRE30348 E US RE30348E US 232579 A US232579 A US 232579A US RE30348 E USRE30348 E US RE30348E
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US
United States
Prior art keywords
tin
silver
solder preform
alloy
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/002,325
Inventor
Norman Hascoe
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SEMI-ALLOYS Co
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Semi-Alloys Inc
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Publication date
Application filed by Semi-Alloys Inc filed Critical Semi-Alloys Inc
Priority to US06/002,325 priority Critical patent/USRE30348E/en
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Publication of USRE30348E publication Critical patent/USRE30348E/en
Assigned to ALLIED CORPORATION A CORP OF N.Y. reassignment ALLIED CORPORATION A CORP OF N.Y. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: SEMI-ALLOYS,INC.
Assigned to SEMI-ALLOYS INC. reassignment SEMI-ALLOYS INC. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: ALLIED CORPORATION, A CORP. OF NY
Assigned to WELLS FARGO BANK NATIONAL ASSOCIATION reassignment WELLS FARGO BANK NATIONAL ASSOCIATION SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GENERAL CHEMICAL CORPORATION, HENLEY MANUFACTURING HOLDING COMPANY, INC., PRESTOLITE WIRE CORPORATION, PRINTING DEVELOPMENTS, INC., SEMI-ALLOYS, INC., TOLEDO STAMPING & MANUFACTURING COMPANY
Assigned to FLEET NATIONAL BANK A NATIONAL BANKING ASSOCIATION, FLEET PRECIOUS METALS INC. A RI CORPORATION reassignment FLEET NATIONAL BANK A NATIONAL BANKING ASSOCIATION SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SEMI-ALLOYS COMPANY, A LIMITED LIABILITY COMPANY
Anticipated expiration legal-status Critical
Assigned to SEMI-ALLOYS INC. reassignment SEMI-ALLOYS INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS.) Assignors: HENLEY MANUFACTURING HOLDING COMPANY, INC.
Assigned to HENLEY MANUFACTURING HOLDING COMPANY, INC. reassignment HENLEY MANUFACTURING HOLDING COMPANY, INC. MERGER (SEE DOCUMENT FOR DETAILS) Assignors: SEMI-ALLOYS INC.
Assigned to SEMI-ALLOYS COMPANY reassignment SEMI-ALLOYS COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SEMI-ALLOYS INC.
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12687—Pb- and Sn-base components: alternative to or next to each other

Definitions

  • solder preform of the present invention is useful, inter alia, in the fabrication of a hermetically sealed container for a semiconductor device as described and claimed in Applicant's Pat. No. 3,823,468, issued July 16, 1974, and entitled "Method of Fabricating an Hermetically Sealed Container".
  • solder preform of the present invention is of particular utility in hermetically sealing a container for a semiconductor device such as an integrated circuit which must be protected from exposure to ambient atmosphere.
  • solder preform formed of an eutectic alloy comprising substantially 80% gold and 20% tin, which has the advantages that it has a desirably high melting point of about 280° C. and it has a high tensile strength, ensuring against breaking of the seal due to shocks or rough handling of the semiconductor package. While such solder preforms are eminently satisfactory in use, the recent extreme increase in the price of gold has made them very costly.
  • solder alloys made from tin, silver, antimony, and other elements have been used to a limited extent but it has been found that they have severe functional limitations in that the melting point of the solder is undesirably low and the tensile strength of the solder joint is low compared to one made of a gold-tin eutectic alloy.
  • a solder preform .[.for hermetically sealing a cover to a container for a semiconductor package.]. comprises a relatively thick flat ring of an alloy .[.consisting of 90-97% lead, 1-4% tin, and 1-4% silver.]. .Iadd.comprising preponderantly lead and tin .Iaddend.and having the characteristic that it solidifies from the fluid state as a homogeneous mixture and a relatively thin coating clad on each surface thereof of an oxidation-resistant alloy consisting of 92-98% tin and 2-8% silver.
  • FIG. 1 is a perspective view of a portion of a strip of metallic ribbon from which a solder preform of the invention may be punched;
  • FIG. 2 is a perspective view of a solder preform embodying the invention.
  • a composite metallic strip 10 comprising a central, relatively thick core 11 of an alloy having the characteristic that it solidifies from the fluid state as a homogeneous mixture, for example an alloy consisting of 90-97% lead, 1-4% tin, and 1-4% silver, preferably consisting of substantially 95% lead, 2.5% tin, and 2.5% silver.
  • the core 11 has relatively thin coatings 12, 13 on its upper and lower surfaces respectively, these coatings being of an oxidation-resistant alloy, for example, an alloy consisting of 92-98% tin and 2-8% silver, preferably consisting of substantially 96.5% tin and 3.5% silver.
  • the coatings 12, 13 may be formed on the core 11 by cladding, electroplating, or equivalent process.
  • solder preform rings such as the ring 14 shown in dashed outline in FIG. 1.
  • the resultant punched solder preform ring 14 is shown in FIG. 2 comprising a central, relatively thick flat ring 15 and upper and lower coatings 16,17 respectively.
  • the function of the tin-silver coatings 16,17 on each surface of the lead core or ring 15 is to resist oxidation. Without such a coating, the lead alloy core would oxidize readily and the exposed oxidized surface would inhibit wetting of the solder to the metal cover and to the sealing ring of the semiconductor container. Fluxes to dissolve the oxide cannot be used because such a flux would contaminate the inside of the cavity of the semiconductor container and adversely affect the operation of the semiconductor device in the container.
  • the central ring 15 is relatively thick, for example 0.0016 inch, while each of the coatings 16,17 is relatively thin, for example 0.0002 inch.
  • the solder preform ring 14 melts, it wets the cover and the surface of the sealing ring of a semiconductor container and alloying of the outer portions of the tin-alloy coatings 16,17 with the central core 15 of lead alloy takes place.
  • the resultant solder, after sealing, is very high in lead content and results in a relatively high sealing temperature, typically 275° C.
  • the high-lead-content solder ring 15 has excellent tensile strength characteristics and compares favorably with the currently accepted gold-tin eutectic solder.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating With Molten Metal (AREA)

Abstract

A solder preform for hermetically sealing a cover to a container for a semiconductor package comprises a relatively thick flat ring of an alloy consisting of substantially 95% lead, 2.5% tin, and 2.5% silver, which alloy has the characteristic that it solidifies from the fluid state as a homogeneous mixture without substantial separation of the minority element crystals. The solder preform further comprises a relatively thin coating clad on each surface of the flat ring of an oxidation-resistant alloy, preferably an alloy consisting of substantially 96.5% tin and 3.5% silver.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS
The solder preform of the present invention is useful, inter alia, in the fabrication of a hermetically sealed container for a semiconductor device as described and claimed in Applicant's Pat. No. 3,823,468, issued July 16, 1974, and entitled "Method of Fabricating an Hermetically Sealed Container".
BACKGROUND OF THE INVENTION
1. Field of the Invention
The solder preform of the present invention is of particular utility in hermetically sealing a container for a semiconductor device such as an integrated circuit which must be protected from exposure to ambient atmosphere.
2. Description of the Prior Art
In the manufacture of semiconductor devices, there has been a requirement for hermetically sealing the container in which the active semiconductor device is housed, usually a cavity in a metallic or ceramic body. For this purpose, a metallic cover and a solder preform ring have been used. Initially, the cover, the solder preform, and the container were individually assembled and heated to fuse the solder to the cover and to the container as illustrated and described in U.S. Pat. No. 3,340,602 to Hontz. More recently, the solder preform ring has been preattached to the sealing cover and the resulting unit disposed over the container of the semiconductor device and heated to fuse the solder preform to the cover and to the container as illustrated and described in Applicant's U.S. Pat. Nos. 3,823,468 and 3,874,549. This latter method has the advantage that it permits the use of automatic machines for assembling the combination cover-solder preform units and the semiconductor container for fusing the solder unit as described.
In each of the foregoing methods of fabricating hermetically sealed semiconductor packages, it has been customary to use a solder preform formed of an eutectic alloy comprising substantially 80% gold and 20% tin, which has the advantages that it has a desirably high melting point of about 280° C. and it has a high tensile strength, ensuring against breaking of the seal due to shocks or rough handling of the semiconductor package. While such solder preforms are eminently satisfactory in use, the recent extreme increase in the price of gold has made them very costly. In an effort to reduce the cost of such gold-tin solder preforms, solder alloys made from tin, silver, antimony, and other elements have been used to a limited extent but it has been found that they have severe functional limitations in that the melting point of the solder is undesirably low and the tensile strength of the solder joint is low compared to one made of a gold-tin eutectic alloy.
It is an object of the invention, therefore, to provide a new and improved solder preform .[.for use in hermetically sealing a container for a semiconductor device.]. which has the desirable characteristics of the gold-tin eutectic solder preform described above but which is must lower in cost.
SUMMARY OF THE INVENTION
In accordance with the invention, a solder preform .[.for hermetically sealing a cover to a container for a semiconductor package.]. comprises a relatively thick flat ring of an alloy .[.consisting of 90-97% lead, 1-4% tin, and 1-4% silver.]. .Iadd.comprising preponderantly lead and tin .Iaddend.and having the characteristic that it solidifies from the fluid state as a homogeneous mixture and a relatively thin coating clad on each surface thereof of an oxidation-resistant alloy consisting of 92-98% tin and 2-8% silver.
For a better understanding of the present invention, together with other and further objects thereof, reference is had to the following description, taken in connection with the accompanying drawing, while its scope will be pointed out in the appended claims.
BRIEF DESCRIPTION OF THE DRAWING
FIG. 1 is a perspective view of a portion of a strip of metallic ribbon from which a solder preform of the invention may be punched; while
FIG. 2 is a perspective view of a solder preform embodying the invention.
DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to FIG. 1, there is illustrated a composite metallic strip 10 comprising a central, relatively thick core 11 of an alloy having the characteristic that it solidifies from the fluid state as a homogeneous mixture, for example an alloy consisting of 90-97% lead, 1-4% tin, and 1-4% silver, preferably consisting of substantially 95% lead, 2.5% tin, and 2.5% silver. The core 11 has relatively thin coatings 12, 13 on its upper and lower surfaces respectively, these coatings being of an oxidation-resistant alloy, for example, an alloy consisting of 92-98% tin and 2-8% silver, preferably consisting of substantially 96.5% tin and 3.5% silver. The coatings 12, 13 may be formed on the core 11 by cladding, electroplating, or equivalent process.
From the strip 10 may be punched a series of solder preform rings such as the ring 14 shown in dashed outline in FIG. 1. The resultant punched solder preform ring 14 is shown in FIG. 2 comprising a central, relatively thick flat ring 15 and upper and lower coatings 16,17 respectively.
As stated, the function of the tin- silver coatings 16,17 on each surface of the lead core or ring 15 is to resist oxidation. Without such a coating, the lead alloy core would oxidize readily and the exposed oxidized surface would inhibit wetting of the solder to the metal cover and to the sealing ring of the semiconductor container. Fluxes to dissolve the oxide cannot be used because such a flux would contaminate the inside of the cavity of the semiconductor container and adversely affect the operation of the semiconductor device in the container.
As stated, the central ring 15 is relatively thick, for example 0.0016 inch, while each of the coatings 16,17 is relatively thin, for example 0.0002 inch.
In the hermetic sealing of a cover to a semiconductor container, as the solder preform ring 14 melts, it wets the cover and the surface of the sealing ring of a semiconductor container and alloying of the outer portions of the tin- alloy coatings 16,17 with the central core 15 of lead alloy takes place. In addition, the tin- alloy coatings 16,17 alloy with the metal plating, usually gold or silver, on the cover and the sealing ring of the container. The resultant solder, after sealing, is very high in lead content and results in a relatively high sealing temperature, typically 275° C. In addition, the high-lead-content solder ring 15 has excellent tensile strength characteristics and compares favorably with the currently accepted gold-tin eutectic solder.
While there has been described what is, at present, considered to be the preferred embodiment of the invention, it will be obvious to those skilled in the art that various changes and modifications may be made therein, without departing from the invention, and it is, therefore, aimed in the appended claims to cover all such changes and modifications as fall within the true spirit and scope of the invention.

Claims (3)

What is claimed is:
1. A solder preform .[.for hermetically sealing a cover to a container for a semiconductor package.]. comprising a relatively thick flat ring of an alloy consisting of 90-97% lead, 1-4% tin, and 1-4% silver and having the characteristic that it solidifies from the fluid state as a homogeneous mixture and a relatively thin coating clad on each surface thereof of an oxidation-resistant alloy consisting of 92-98% tin and 2-8% silver.
2. A solder preform in accordance with claim 1 in which said ring is an alloy consisting of substantially 95% lead, 2.5% tin, and 2.5% silver.
3. A solder preform in accordance with claim 1 in which said coating is an alloy consisting of substantially 96.5% tin and 3.5% silver. .Iadd. 4. A solder preform comprising a relatively thick flat ring of an alloy comprising preponderantly lead and tin and having the characteristic that it solidifies from the fluid state as a homogeneous mixture and a relatively thin coating clad on each surface thereof of an oxidation-resistant alloy consisting of 92-98% tin and 2-8% silver..Iaddend.
US06/002,325 1979-01-10 1979-01-10 Solder preform Expired - Lifetime USRE30348E (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US06/002,325 USRE30348E (en) 1979-01-10 1979-01-10 Solder preform

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Application Number Priority Date Filing Date Title
US06/002,325 USRE30348E (en) 1979-01-10 1979-01-10 Solder preform

Related Parent Applications (1)

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US05/615,545 Reissue US4020987A (en) 1975-09-22 1975-09-22 Solder preform for use in hermetically sealing a container

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331258A (en) 1981-03-05 1982-05-25 Raychem Corporation Sealing cover for an hermetically sealed container
US5086966A (en) * 1990-11-05 1992-02-11 Motorola Inc. Palladium-coated solder ball
US5476726A (en) * 1992-01-22 1995-12-19 Hitachi, Ltd. Circuit board with metal layer for solder bonding and electronic circuit device employing the same
US5957364A (en) 1996-06-10 1999-09-28 Indium Corporation Of America Integrated solder preform array having a tin outer coating
US6186390B1 (en) * 1997-12-26 2001-02-13 Kabushiki Kaisha Toshiba Solder material and method of manufacturing solder material
US6253986B1 (en) * 1997-07-09 2001-07-03 International Business Machines Corporation Solder disc connection
US20050265669A1 (en) * 2003-09-05 2005-12-01 Trebor Heminway Solder preform for low heat stress laser solder attachment
US20060204177A1 (en) * 2005-03-14 2006-09-14 Matsushita Electric Industrial Co., Ltd. Low cost, high precision multi-point optical component attachment
US7140783B2 (en) 2004-02-06 2006-11-28 Matsushita Electric Industrial Co., Ltd. Diamond 2D scan for aligning an optical fiber to an optical output port
US20110220704A1 (en) * 2010-03-09 2011-09-15 Weiping Liu Composite solder alloy preform
US20120074210A1 (en) * 2009-04-09 2012-03-29 Abb Technology Ag Soldering preform
US9802274B2 (en) * 2016-03-21 2017-10-31 Indium Corporation Hybrid lead-free solder wire

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US150623A (en) * 1874-05-05 Improvement in compound metals and alloys for solder
US2151302A (en) * 1936-06-26 1939-03-21 Reynolds Metals Co Tin alloy
US3305389A (en) * 1963-11-12 1967-02-21 M & T Chemicals Inc Process of coating lead with tin
US3465943A (en) * 1965-03-16 1969-09-09 Bell Telephone Labor Inc Apparatus for making encapsulations
US3639218A (en) * 1969-10-08 1972-02-01 Ibm Shelf life improvement of electroplated solder

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US150623A (en) * 1874-05-05 Improvement in compound metals and alloys for solder
US2151302A (en) * 1936-06-26 1939-03-21 Reynolds Metals Co Tin alloy
US3305389A (en) * 1963-11-12 1967-02-21 M & T Chemicals Inc Process of coating lead with tin
US3465943A (en) * 1965-03-16 1969-09-09 Bell Telephone Labor Inc Apparatus for making encapsulations
US3639218A (en) * 1969-10-08 1972-02-01 Ibm Shelf life improvement of electroplated solder

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Brazing and Soldering Alloys-Part I" Mar. 27, 1962 Semi-Alloys Inc., Mt. Vernon, N.Y. *

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331258A (en) 1981-03-05 1982-05-25 Raychem Corporation Sealing cover for an hermetically sealed container
US5086966A (en) * 1990-11-05 1992-02-11 Motorola Inc. Palladium-coated solder ball
US5476726A (en) * 1992-01-22 1995-12-19 Hitachi, Ltd. Circuit board with metal layer for solder bonding and electronic circuit device employing the same
US5957364A (en) 1996-06-10 1999-09-28 Indium Corporation Of America Integrated solder preform array having a tin outer coating
US6253986B1 (en) * 1997-07-09 2001-07-03 International Business Machines Corporation Solder disc connection
US6186390B1 (en) * 1997-12-26 2001-02-13 Kabushiki Kaisha Toshiba Solder material and method of manufacturing solder material
US20050265669A1 (en) * 2003-09-05 2005-12-01 Trebor Heminway Solder preform for low heat stress laser solder attachment
US7410088B2 (en) 2003-09-05 2008-08-12 Matsushita Electric Industrial, Co., Ltd. Solder preform for low heat stress laser solder attachment
US7140783B2 (en) 2004-02-06 2006-11-28 Matsushita Electric Industrial Co., Ltd. Diamond 2D scan for aligning an optical fiber to an optical output port
US7201519B2 (en) 2004-02-06 2007-04-10 Matsushita Electric Industrial Co., Ltd. Diamond 2D scan for aligning an optical fiber to an optical output port
US7263260B2 (en) 2005-03-14 2007-08-28 Matsushita Electric Industrial Co., Ltd. Low cost, high precision multi-point optical component attachment
US20060204177A1 (en) * 2005-03-14 2006-09-14 Matsushita Electric Industrial Co., Ltd. Low cost, high precision multi-point optical component attachment
US20120074210A1 (en) * 2009-04-09 2012-03-29 Abb Technology Ag Soldering preform
US20110220704A1 (en) * 2010-03-09 2011-09-15 Weiping Liu Composite solder alloy preform
US8348139B2 (en) * 2010-03-09 2013-01-08 Indium Corporation Composite solder alloy preform
US9802274B2 (en) * 2016-03-21 2017-10-31 Indium Corporation Hybrid lead-free solder wire
US10328533B2 (en) 2016-03-21 2019-06-25 Indium Corporation Hybrid lead-free solder wire

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