USRE28821E - Pick-up tube envelope sealant extending into groove of annular target support - Google Patents

Pick-up tube envelope sealant extending into groove of annular target support Download PDF

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Publication number
USRE28821E
USRE28821E US05/544,751 US54475175A USRE28821E US RE28821 E USRE28821 E US RE28821E US 54475175 A US54475175 A US 54475175A US RE28821 E USRE28821 E US RE28821E
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United States
Prior art keywords
support member
peripheral wall
binding member
target assembly
annular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US05/544,751
Inventor
Ryuzo Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
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Matsushita Electronics Corp
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Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to US05/544,751 priority Critical patent/USRE28821E/en
Application granted granted Critical
Publication of USRE28821E publication Critical patent/USRE28821E/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • H01J29/026Mounting or supporting arrangements for charge storage screens not deposited on the frontplate

Definitions

  • This invention relates to an image pick-up tube and more particularly to a target assembly of an image pick-up tube.
  • the specific purpose of this invention is to provide a target assembly which has a robust construction and is readily fabricated without damage to its target substrate composed of a semiconductor material.
  • the target assembly of this invention is constructed at the end portion of a tubular envelope of an image pick-up tube, which includes a face plate hermetically fastened to the open end of the tubular envelope through pressure welding of an annular binding member composed of indium which is previously interposed therebetween.
  • An annular support member is mounted on the face plate and secured thereto by means of the binding member combined with the outer surface of the support member. It is important that the support member has on its outer surface a groove extending circumferentially thereof. The binding member melts into the groove so that the support member is robustly secured to the face plate.
  • FIG. 1 is a sectional view of the target assembly of this invention showing construction thereof before application of pressure welding technique.
  • FIG. 2 is an enlarged sectional view of the target assembly of this invention after application of pressure welding technique.
  • FIG. 3 is a perspective view of the target assembly capped with a signal ring.
  • FIG. 1 shows an arrangement to be manufactured into a target assembly according to this invention, which comprises a transparent face plate 12.
  • a transparent face plate 12 On one surface of the face plate 12 is disposed an annular binding member 14 composed of indium on which a tubular envelope 16 is placed at its one open end 18.
  • An annular metallic support member 20 is placed and preferably fixed with e.g., water-glass on the surface of the face plate 12, which member carries therein a target substrate 22.
  • the substrate 22 is seated on a offset inner wall of the support member 20 and fixed thereto by means of an electrically conductive paint or cement, or solder 24.
  • the support member 20 has its peripheral wall had a groove 26 extending circumferentially thereof. The groove 26 preferably faces the inner wall of the annular binding member 14.
  • a suitable pressure is applied between the face plate 12 and the tubular envelope 16 so to manufacture the arrangement into a target assembly of this invention as shown in FIG. 2.
  • the binding member 14 is deformed and thus welded hermetically with the face plate 12 and the end 18.
  • the deformed binding member enters and welds to the groove 26 of the support member 20. Therefore, the metallic support member 20 is fastened on the face plate 12.
  • an amount of heat may be applied to the arrangement as well as the pressure for pressure-welding so as to make the binding member 14 readily enters the groove 26.
  • the wall of the groove 26 may be plated with indium, tin, or the alloy thereof so as to increase the robustness of the welded connection of the groove 26 and the binding member 14.
  • FIG. 3 shows the assembly 10 of FIG. 2, which is capped with an annular signal ring in order to provide a robust construction and fine configuration of the target assembly.
  • the signal ring 28 is fixed to the peripheral wall of the binding member 18 and the envelope 16, and serves as an output terminal of the image pick-up tube by means of conductive paint 30.
  • tubular envelope 16 is hermetically sealed at the other end (not shown) so as to make a chamber to be evacuated for permitting an electron beam freely pass therethrough.
  • the electron beam is deflected by a suitable means so as to scan the target substrate 22 thereby producing an electric image signal in the substrate in accordance with an optical image irradiated thereto through the face plate 12.
  • the particular target assembly can be fabricated through only one pressing step and the susceptible target substrate is protected by the support member, so that, the target substrate does not damaged by external mechanical force or heat for the fabrication of the assembly.
  • the target assembly according to this invention therefore has a high productivity.

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  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)

Abstract

A target assembly of an image pick-up tube including a face plate hermetically fastened on one open end of a tubular envelope of the image pick-up tube through pressure welded binding member composed of indium which is interposed therebetween. A support member supporting therein a target substrate is mounted on the inner surface of the face plate and secured thereto through its peripheral wall combined with the binding member. On the peripheral wall is formed a groove extending circumferentially thereof. The binding member combines with the groove so that the support member favorably fastened to the face plate.

Description

This invention relates to an image pick-up tube and more particularly to a target assembly of an image pick-up tube. The specific purpose of this invention is to provide a target assembly which has a robust construction and is readily fabricated without damage to its target substrate composed of a semiconductor material.
The target assembly of this invention is constructed at the end portion of a tubular envelope of an image pick-up tube, which includes a face plate hermetically fastened to the open end of the tubular envelope through pressure welding of an annular binding member composed of indium which is previously interposed therebetween.
An annular support member is mounted on the face plate and secured thereto by means of the binding member combined with the outer surface of the support member. It is important that the support member has on its outer surface a groove extending circumferentially thereof. The binding member melts into the groove so that the support member is robustly secured to the face plate.
The specific structure of this invention is read in conjunction with the drawing wherein:
FIG. 1 is a sectional view of the target assembly of this invention showing construction thereof before application of pressure welding technique.
FIG. 2 is an enlarged sectional view of the target assembly of this invention after application of pressure welding technique.
FIG. 3 is a perspective view of the target assembly capped with a signal ring.
FIG. 1 shows an arrangement to be manufactured into a target assembly according to this invention, which comprises a transparent face plate 12. On one surface of the face plate 12 is disposed an annular binding member 14 composed of indium on which a tubular envelope 16 is placed at its one open end 18. An annular metallic support member 20 is placed and preferably fixed with e.g., water-glass on the surface of the face plate 12, which member carries therein a target substrate 22. The substrate 22 is seated on a offset inner wall of the support member 20 and fixed thereto by means of an electrically conductive paint or cement, or solder 24. The support member 20 has its peripheral wall had a groove 26 extending circumferentially thereof. The groove 26 preferably faces the inner wall of the annular binding member 14.
A suitable pressure is applied between the face plate 12 and the tubular envelope 16 so to manufacture the arrangement into a target assembly of this invention as shown in FIG. 2. Through the application of such pressure, the binding member 14 is deformed and thus welded hermetically with the face plate 12 and the end 18. In this instance, the deformed binding member enters and welds to the groove 26 of the support member 20. Therefore, the metallic support member 20 is fastened on the face plate 12.
If desired, an amount of heat may be applied to the arrangement as well as the pressure for pressure-welding so as to make the binding member 14 readily enters the groove 26. The wall of the groove 26 may be plated with indium, tin, or the alloy thereof so as to increase the robustness of the welded connection of the groove 26 and the binding member 14.
FIG. 3 shows the assembly 10 of FIG. 2, which is capped with an annular signal ring in order to provide a robust construction and fine configuration of the target assembly. The signal ring 28 is fixed to the peripheral wall of the binding member 18 and the envelope 16, and serves as an output terminal of the image pick-up tube by means of conductive paint 30.
In this instance, it is to be noted that the tubular envelope 16 is hermetically sealed at the other end (not shown) so as to make a chamber to be evacuated for permitting an electron beam freely pass therethrough. The electron beam is deflected by a suitable means so as to scan the target substrate 22 thereby producing an electric image signal in the substrate in accordance with an optical image irradiated thereto through the face plate 12.
It is apparent from the above-description that the particular target assembly can be fabricated through only one pressing step and the susceptible target substrate is protected by the support member, so that, the target substrate does not damaged by external mechanical force or heat for the fabrication of the assembly. The target assembly according to this invention therefore has a high productivity.

Claims (4)

What is claimed is:
1. A target assembly of an image pick-up tube including a tubular envelope, which comprises:
a transparent face plate;
an annular binding member welded both to the inner surface of said face plate and one open end of said tubular envelope;
an annular support member supporting therein a target substrate of said image pick-up tube mounted on the back surface of said face plate, said support member having on its peripheral wall a groove extending circumferentially of the peripheral wall which groove is combined with said binding member; and
an annular signal ring capping said envelope and secured thereto through an electrically conductive paint, said signal ring being contacted at its inner surface to the peripheral wall of said binding member.
2. A target assembly according to claim 1, wherein the peripheral wall of said support member is plated with indium.
3. A target assembly according to claim 1, wherein the peripheral wall of said support member is plated with tin.
4. A target assembly according to claim 1, wherein the peripheral wall of said support member is plated with an alloy of indium and tin. .Iadd. 5. A target assembly of an image pick-up tube including a tubular envelope, which comprises:
a transparent faceplate;
an annular binding member pressure-welded both to the inner surface of said faceplate and one open end of said tubular envelope;
an annular support member supporting therein a target substrate of said image pick-up tube mounted on the back surface of said faceplate, said support member having on its peripheral wall a groove extending circumferentially of said support member and being combined with said binding member; and
an annular signal ring coupled with said envelope and contacted at its inner surface to the peripheral wall of said binding member..Iaddend..Iadd. 6. A target assembly according to claim 5, wherein the peripheral wall of said support member is plated with indium. .Iaddend..Iadd. 7. A target assembly according to claim 5, wherein the peripheral wall of said support member is plated with tin. .Iaddend..Iadd. 8. A target assembly of an image pick-up tube including a tubular envelope, which comprises:
a transparent faceplate;
an annular binding member pressure-welded both to the inner surface of said faceplate and one open end of said tubular envelope;
an annular support member supporting therein a target substrate of said image pick-up tube mounted on the back surface of said faceplate, said support member having on its peripheral wall a groove extending circumferentially of said support member and being combined with said binding member; and
an annular signal ring capping said envelope and contacted at its inner surface to the peripheral wall of said binding member. .Iaddend..Iadd. 9. A target assembly according to claim 1, wherein said binding member is made of indium. .Iaddend..Iadd. 10. A target assembly according to claim 5, wherein said binding member is made of indium. .Iaddend..Iadd. 11. A target assembly according to claim 8, wherein said binding member is made of indium..Iaddend.
US05/544,751 1970-09-19 1975-01-28 Pick-up tube envelope sealant extending into groove of annular target support Expired - Lifetime USRE28821E (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US05/544,751 USRE28821E (en) 1970-09-19 1975-01-28 Pick-up tube envelope sealant extending into groove of annular target support

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JA45-82324 1970-09-19
JP8232470 1970-09-19
US18131171A 1971-09-17 1971-09-17
US05/544,751 USRE28821E (en) 1970-09-19 1975-01-28 Pick-up tube envelope sealant extending into groove of annular target support

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US18131171A Reissue 1970-09-19 1971-09-17

Publications (1)

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USRE28821E true USRE28821E (en) 1976-05-18

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3073981A (en) * 1960-08-30 1963-01-15 Rca Corp Photoconductive pickup tube having an electrically isolated mesh assembly
US3577027A (en) * 1968-08-30 1971-05-04 Zenith Radio Corp Low noise image intensifier
US3590304A (en) * 1969-11-13 1971-06-29 Zenith Radio Corp Image intensifier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3073981A (en) * 1960-08-30 1963-01-15 Rca Corp Photoconductive pickup tube having an electrically isolated mesh assembly
US3577027A (en) * 1968-08-30 1971-05-04 Zenith Radio Corp Low noise image intensifier
US3590304A (en) * 1969-11-13 1971-06-29 Zenith Radio Corp Image intensifier

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