USD962880S1 - Heat sink for memory modules - Google Patents

Heat sink for memory modules Download PDF

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Publication number
USD962880S1
USD962880S1 US29/745,479 US202029745479F USD962880S US D962880 S1 USD962880 S1 US D962880S1 US 202029745479 F US202029745479 F US 202029745479F US D962880 S USD962880 S US D962880S
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United States
Prior art keywords
heat sink
memory modules
modules
memory
view
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US29/745,479
Inventor
Young Suk Chung
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Essencore Ltd
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Essencore Ltd
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Priority to US29/745,479 priority Critical patent/USD962880S1/en
Assigned to ESSENCORE LIMITED reassignment ESSENCORE LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHUNG, YOUNG SUK
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Publication of USD962880S1 publication Critical patent/USD962880S1/en
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Description

FIG. 1 is a top, front perspective view of the heat sink for memory modules;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink for memory modules, as shown and described.
US29/745,479 2020-08-06 2020-08-06 Heat sink for memory modules Active USD962880S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/745,479 USD962880S1 (en) 2020-08-06 2020-08-06 Heat sink for memory modules

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Application Number Priority Date Filing Date Title
US29/745,479 USD962880S1 (en) 2020-08-06 2020-08-06 Heat sink for memory modules

Publications (1)

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USD962880S1 true USD962880S1 (en) 2022-09-06

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Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6377460B1 (en) * 1999-05-27 2002-04-23 Infineon Technologies Ag Electronic circuit having a flexible intermediate layer between electronic components and a heat sink
US20030011993A1 (en) * 2001-06-28 2003-01-16 Intel Corporation Heat transfer apparatus
US20030026076A1 (en) * 2001-08-06 2003-02-06 Wen-Chen Wei Memory heat sink device
USD531965S1 (en) * 2004-10-28 2006-11-14 Mushkin, Inc. Memory card heat sink
US20060268523A1 (en) * 2005-05-31 2006-11-30 Akust Technology Co., Ltd. Heat sink for memory
US7215551B2 (en) * 2004-09-29 2007-05-08 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7312996B2 (en) * 2005-03-14 2007-12-25 Wan Chien Chang Heat sink for memory strips
US7457122B2 (en) * 2006-02-22 2008-11-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clip for mounting a heat sink thereon
US20090034183A1 (en) * 2007-08-01 2009-02-05 Comptake Technology Co., Ltd. Cooling device for memory chips
US20090122481A1 (en) * 2007-11-09 2009-05-14 Chih-I Chang Memory heat sink device provided with extra heat sink area
US20090190304A1 (en) * 2008-01-29 2009-07-30 Meyer Iv George Anthony Cooling device for memory module
USD597966S1 (en) * 2008-10-09 2009-08-11 Asustek Computer Inc. Memory heat sink
US20090294099A1 (en) * 2008-05-30 2009-12-03 Comptake Technology Inc. Heat dispensing unit for memory chip
US7715197B2 (en) * 2008-06-05 2010-05-11 International Business Machines Corporation Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs)
US7738252B2 (en) * 2006-01-09 2010-06-15 Ocz Technology, Group, Inc. Method and apparatus for thermal management of computer memory modules
USD626521S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
US20110088870A1 (en) * 2009-10-16 2011-04-21 Wen-Yi Lee Memory Heatsink Set With Supplementary Retaining Devices
US8411443B2 (en) * 2011-01-21 2013-04-02 Comptake Technology Inc. Slidingly-engaged heat-dissipating assembly for memory and memory device having the same
US20130186595A1 (en) * 2012-01-20 2013-07-25 Ming-Yang Hsieh Heat sink clip and method for forming the same
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
US20140202675A1 (en) * 2013-01-22 2014-07-24 Comptake Technology Inc. Heat dissipation unit used in memory device
USD793400S1 (en) * 2016-05-09 2017-08-01 Kingston Digital, Inc. Heat sink for memory module
US10667431B1 (en) * 2019-04-29 2020-05-26 Hewlett Packard Enterprise Development Lp Memory module cooling

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6377460B1 (en) * 1999-05-27 2002-04-23 Infineon Technologies Ag Electronic circuit having a flexible intermediate layer between electronic components and a heat sink
US20030011993A1 (en) * 2001-06-28 2003-01-16 Intel Corporation Heat transfer apparatus
US20030026076A1 (en) * 2001-08-06 2003-02-06 Wen-Chen Wei Memory heat sink device
US7215551B2 (en) * 2004-09-29 2007-05-08 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
USD531965S1 (en) * 2004-10-28 2006-11-14 Mushkin, Inc. Memory card heat sink
US7312996B2 (en) * 2005-03-14 2007-12-25 Wan Chien Chang Heat sink for memory strips
US20060268523A1 (en) * 2005-05-31 2006-11-30 Akust Technology Co., Ltd. Heat sink for memory
US7738252B2 (en) * 2006-01-09 2010-06-15 Ocz Technology, Group, Inc. Method and apparatus for thermal management of computer memory modules
US7457122B2 (en) * 2006-02-22 2008-11-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clip for mounting a heat sink thereon
US20090034183A1 (en) * 2007-08-01 2009-02-05 Comptake Technology Co., Ltd. Cooling device for memory chips
US20090122481A1 (en) * 2007-11-09 2009-05-14 Chih-I Chang Memory heat sink device provided with extra heat sink area
US20090190304A1 (en) * 2008-01-29 2009-07-30 Meyer Iv George Anthony Cooling device for memory module
US20090294099A1 (en) * 2008-05-30 2009-12-03 Comptake Technology Inc. Heat dispensing unit for memory chip
US7715197B2 (en) * 2008-06-05 2010-05-11 International Business Machines Corporation Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs)
USD597966S1 (en) * 2008-10-09 2009-08-11 Asustek Computer Inc. Memory heat sink
US20110088870A1 (en) * 2009-10-16 2011-04-21 Wen-Yi Lee Memory Heatsink Set With Supplementary Retaining Devices
USD626521S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
US8411443B2 (en) * 2011-01-21 2013-04-02 Comptake Technology Inc. Slidingly-engaged heat-dissipating assembly for memory and memory device having the same
US20130186595A1 (en) * 2012-01-20 2013-07-25 Ming-Yang Hsieh Heat sink clip and method for forming the same
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
US20140202675A1 (en) * 2013-01-22 2014-07-24 Comptake Technology Inc. Heat dissipation unit used in memory device
USD793400S1 (en) * 2016-05-09 2017-08-01 Kingston Digital, Inc. Heat sink for memory module
US10667431B1 (en) * 2019-04-29 2020-05-26 Hewlett Packard Enterprise Development Lp Memory module cooling

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Klevv Urbane, DDR3 Gaming Memory; Essence Limited, 2015; 1 pg.;https://www.klevv.com/ken/products_details/memory/Klevv_Urbane. *
TechPowerUp, News Posts; Klevv Announces Two New DDR4 Memory Lines: Cras XR RGB and Bolt XR; Sep. 17, 2020; 2 pgs.;https://www.techpowerup.com/news-tags/Klevv. *

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