USD962880S1 - Heat sink for memory modules - Google Patents
Heat sink for memory modules Download PDFInfo
- Publication number
- USD962880S1 USD962880S1 US29/745,479 US202029745479F USD962880S US D962880 S1 USD962880 S1 US D962880S1 US 202029745479 F US202029745479 F US 202029745479F US D962880 S USD962880 S US D962880S
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- US
- United States
- Prior art keywords
- heat sink
- memory modules
- modules
- memory
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for a heat sink for memory modules, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/745,479 USD962880S1 (en) | 2020-08-06 | 2020-08-06 | Heat sink for memory modules |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/745,479 USD962880S1 (en) | 2020-08-06 | 2020-08-06 | Heat sink for memory modules |
Publications (1)
Publication Number | Publication Date |
---|---|
USD962880S1 true USD962880S1 (en) | 2022-09-06 |
Family
ID=83112701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/745,479 Active USD962880S1 (en) | 2020-08-06 | 2020-08-06 | Heat sink for memory modules |
Country Status (1)
Country | Link |
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US (1) | USD962880S1 (en) |
Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6377460B1 (en) * | 1999-05-27 | 2002-04-23 | Infineon Technologies Ag | Electronic circuit having a flexible intermediate layer between electronic components and a heat sink |
US20030011993A1 (en) * | 2001-06-28 | 2003-01-16 | Intel Corporation | Heat transfer apparatus |
US20030026076A1 (en) * | 2001-08-06 | 2003-02-06 | Wen-Chen Wei | Memory heat sink device |
USD531965S1 (en) * | 2004-10-28 | 2006-11-14 | Mushkin, Inc. | Memory card heat sink |
US20060268523A1 (en) * | 2005-05-31 | 2006-11-30 | Akust Technology Co., Ltd. | Heat sink for memory |
US7215551B2 (en) * | 2004-09-29 | 2007-05-08 | Super Talent Electronics, Inc. | Memory module assembly including heat sink attached to integrated circuits by adhesive |
US7312996B2 (en) * | 2005-03-14 | 2007-12-25 | Wan Chien Chang | Heat sink for memory strips |
US7457122B2 (en) * | 2006-02-22 | 2008-11-25 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly including a clip for mounting a heat sink thereon |
US20090034183A1 (en) * | 2007-08-01 | 2009-02-05 | Comptake Technology Co., Ltd. | Cooling device for memory chips |
US20090122481A1 (en) * | 2007-11-09 | 2009-05-14 | Chih-I Chang | Memory heat sink device provided with extra heat sink area |
US20090190304A1 (en) * | 2008-01-29 | 2009-07-30 | Meyer Iv George Anthony | Cooling device for memory module |
USD597966S1 (en) * | 2008-10-09 | 2009-08-11 | Asustek Computer Inc. | Memory heat sink |
US20090294099A1 (en) * | 2008-05-30 | 2009-12-03 | Comptake Technology Inc. | Heat dispensing unit for memory chip |
US7715197B2 (en) * | 2008-06-05 | 2010-05-11 | International Business Machines Corporation | Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs) |
US7738252B2 (en) * | 2006-01-09 | 2010-06-15 | Ocz Technology, Group, Inc. | Method and apparatus for thermal management of computer memory modules |
USD626521S1 (en) * | 2010-03-23 | 2010-11-02 | Comptake Technology Inc. | Heat-dissipating device for memory |
US20110088870A1 (en) * | 2009-10-16 | 2011-04-21 | Wen-Yi Lee | Memory Heatsink Set With Supplementary Retaining Devices |
US8411443B2 (en) * | 2011-01-21 | 2013-04-02 | Comptake Technology Inc. | Slidingly-engaged heat-dissipating assembly for memory and memory device having the same |
US20130186595A1 (en) * | 2012-01-20 | 2013-07-25 | Ming-Yang Hsieh | Heat sink clip and method for forming the same |
USD689829S1 (en) * | 2013-01-02 | 2013-09-17 | Comptake Technology Inc. | Heat dissipating module of memory |
US20140202675A1 (en) * | 2013-01-22 | 2014-07-24 | Comptake Technology Inc. | Heat dissipation unit used in memory device |
USD793400S1 (en) * | 2016-05-09 | 2017-08-01 | Kingston Digital, Inc. | Heat sink for memory module |
US10667431B1 (en) * | 2019-04-29 | 2020-05-26 | Hewlett Packard Enterprise Development Lp | Memory module cooling |
-
2020
- 2020-08-06 US US29/745,479 patent/USD962880S1/en active Active
Patent Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6377460B1 (en) * | 1999-05-27 | 2002-04-23 | Infineon Technologies Ag | Electronic circuit having a flexible intermediate layer between electronic components and a heat sink |
US20030011993A1 (en) * | 2001-06-28 | 2003-01-16 | Intel Corporation | Heat transfer apparatus |
US20030026076A1 (en) * | 2001-08-06 | 2003-02-06 | Wen-Chen Wei | Memory heat sink device |
US7215551B2 (en) * | 2004-09-29 | 2007-05-08 | Super Talent Electronics, Inc. | Memory module assembly including heat sink attached to integrated circuits by adhesive |
USD531965S1 (en) * | 2004-10-28 | 2006-11-14 | Mushkin, Inc. | Memory card heat sink |
US7312996B2 (en) * | 2005-03-14 | 2007-12-25 | Wan Chien Chang | Heat sink for memory strips |
US20060268523A1 (en) * | 2005-05-31 | 2006-11-30 | Akust Technology Co., Ltd. | Heat sink for memory |
US7738252B2 (en) * | 2006-01-09 | 2010-06-15 | Ocz Technology, Group, Inc. | Method and apparatus for thermal management of computer memory modules |
US7457122B2 (en) * | 2006-02-22 | 2008-11-25 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly including a clip for mounting a heat sink thereon |
US20090034183A1 (en) * | 2007-08-01 | 2009-02-05 | Comptake Technology Co., Ltd. | Cooling device for memory chips |
US20090122481A1 (en) * | 2007-11-09 | 2009-05-14 | Chih-I Chang | Memory heat sink device provided with extra heat sink area |
US20090190304A1 (en) * | 2008-01-29 | 2009-07-30 | Meyer Iv George Anthony | Cooling device for memory module |
US20090294099A1 (en) * | 2008-05-30 | 2009-12-03 | Comptake Technology Inc. | Heat dispensing unit for memory chip |
US7715197B2 (en) * | 2008-06-05 | 2010-05-11 | International Business Machines Corporation | Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs) |
USD597966S1 (en) * | 2008-10-09 | 2009-08-11 | Asustek Computer Inc. | Memory heat sink |
US20110088870A1 (en) * | 2009-10-16 | 2011-04-21 | Wen-Yi Lee | Memory Heatsink Set With Supplementary Retaining Devices |
USD626521S1 (en) * | 2010-03-23 | 2010-11-02 | Comptake Technology Inc. | Heat-dissipating device for memory |
US8411443B2 (en) * | 2011-01-21 | 2013-04-02 | Comptake Technology Inc. | Slidingly-engaged heat-dissipating assembly for memory and memory device having the same |
US20130186595A1 (en) * | 2012-01-20 | 2013-07-25 | Ming-Yang Hsieh | Heat sink clip and method for forming the same |
USD689829S1 (en) * | 2013-01-02 | 2013-09-17 | Comptake Technology Inc. | Heat dissipating module of memory |
US20140202675A1 (en) * | 2013-01-22 | 2014-07-24 | Comptake Technology Inc. | Heat dissipation unit used in memory device |
USD793400S1 (en) * | 2016-05-09 | 2017-08-01 | Kingston Digital, Inc. | Heat sink for memory module |
US10667431B1 (en) * | 2019-04-29 | 2020-05-26 | Hewlett Packard Enterprise Development Lp | Memory module cooling |
Non-Patent Citations (2)
Title |
---|
Klevv Urbane, DDR3 Gaming Memory; Essence Limited, 2015; 1 pg.;https://www.klevv.com/ken/products_details/memory/Klevv_Urbane. * |
TechPowerUp, News Posts; Klevv Announces Two New DDR4 Memory Lines: Cras XR RGB and Bolt XR; Sep. 17, 2020; 2 pgs.;https://www.techpowerup.com/news-tags/Klevv. * |
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