USD793400S1 - Heat sink for memory module - Google Patents
Heat sink for memory module Download PDFInfo
- Publication number
- USD793400S1 USD793400S1 US29/563,885 US201629563885F USD793400S US D793400 S1 USD793400 S1 US D793400S1 US 201629563885 F US201629563885 F US 201629563885F US D793400 S USD793400 S US D793400S
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- US
- United States
- Prior art keywords
- heat sink
- memory module
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- showing
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Description
The broken lines in FIG. 2 are employed merely to indicate which portions of the heat sink are shown in enlargement in FIGS. 9 and 10 , and form no part of the claimed design.
The illustrative broken line showing of a card placed within the heat sink in FIGS. 11 and 12 depicts an exemplary component which might be used with the heat sink for memory module, and forms no part of the claimed design.
Claims (1)
- We claim the ornamental design for a heat sink for memory module, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US29/563,885 USD793400S1 (en) | 2016-05-09 | 2016-05-09 | Heat sink for memory module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/563,885 USD793400S1 (en) | 2016-05-09 | 2016-05-09 | Heat sink for memory module |
Publications (1)
Publication Number | Publication Date |
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USD793400S1 true USD793400S1 (en) | 2017-08-01 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US29/563,885 Active USD793400S1 (en) | 2016-05-09 | 2016-05-09 | Heat sink for memory module |
Country Status (1)
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US (1) | USD793400S1 (en) |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD827589S1 (en) * | 2016-04-05 | 2018-09-04 | Sumitomo Seika Chemicals Co., Ltd. | Heat sink |
USD842304S1 (en) * | 2017-12-21 | 2019-03-05 | Corsair Memory, Inc. | Memory module |
USD849566S1 (en) * | 2016-12-21 | 2019-05-28 | Mecalc (Pty) Limited | Electronic instruments casing |
USD849567S1 (en) * | 2016-12-21 | 2019-05-28 | Mecalc (Pty) Limited | Electronic instruments casing |
USD862402S1 (en) * | 2017-12-18 | 2019-10-08 | Kingston Digital, Inc. | Memory heat dissipation sink |
USD868069S1 (en) * | 2017-06-29 | 2019-11-26 | V-Color Technology Inc. | Memory device |
USD889052S1 (en) * | 2020-03-17 | 2020-06-30 | B2B International Pty Ltd | Pets ergonomic feeder |
USD896229S1 (en) * | 2018-11-30 | 2020-09-15 | Samsung Electronics Co., Ltd. | SSD storage device |
USD896231S1 (en) * | 2018-11-30 | 2020-09-15 | Samsung Electronics Co., Ltd. | SSD storage device |
USD896230S1 (en) * | 2018-11-30 | 2020-09-15 | Samsung Electronics Co., Ltd. | SSD storage device |
USD897345S1 (en) * | 2018-12-07 | 2020-09-29 | Sung-Yu Chen | Double-data-rate SDRAM card |
USD904323S1 (en) * | 2019-01-17 | 2020-12-08 | Telefonaktiebolaget Lm Ericsson (Publ) | Heat sink |
USD928161S1 (en) * | 2019-03-14 | 2021-08-17 | Cambricon Technologies Corporation Limited | Graphics card |
USD951937S1 (en) * | 2018-12-06 | 2022-05-17 | Samsung Electronics Co., Ltd. | Solid state drive storage device |
USD954061S1 (en) * | 2018-12-07 | 2022-06-07 | Sung-Yu Chen | Double-data-rate SDRAM card |
USD956706S1 (en) * | 2020-08-06 | 2022-07-05 | Essencore Limited | Heat sink for memory modules |
USD962880S1 (en) * | 2020-08-06 | 2022-09-06 | Essencore Limited | Heat sink for memory modules |
USD964947S1 (en) * | 2021-06-03 | 2022-09-27 | Kingston Digital, Inc. | Heat sink for memory module |
US11968805B2 (en) | 2018-11-02 | 2024-04-23 | Telefonaktiebolaget Lm Ericsson (Publ) | Heatsink having air partitioning baffle |
USD1035597S1 (en) * | 2022-12-15 | 2024-07-16 | Kingston Digital, Inc. | Heat sink for memory module |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060056154A1 (en) * | 2004-09-15 | 2006-03-16 | International Business Machines Corporation | Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board |
US20060268523A1 (en) * | 2005-05-31 | 2006-11-30 | Akust Technology Co., Ltd. | Heat sink for memory |
US20080101036A1 (en) * | 2006-10-26 | 2008-05-01 | Chiung Yi Chen | Heat-dissipating assembly structure |
US7738252B2 (en) * | 2006-01-09 | 2010-06-15 | Ocz Technology, Group, Inc. | Method and apparatus for thermal management of computer memory modules |
USD657756S1 (en) * | 2011-10-17 | 2012-04-17 | Corsair Memory, Inc. | Low profile heat spreader for a computer memory module |
USD689829S1 (en) * | 2013-01-02 | 2013-09-17 | Comptake Technology Inc. | Heat dissipating module of memory |
USD698792S1 (en) * | 2012-01-05 | 2014-02-04 | Kingston Digital, Inc. | Memory module |
USD702690S1 (en) * | 2012-10-17 | 2014-04-15 | Kingston Digital, Inc. | Memory module |
USD702689S1 (en) * | 2012-08-17 | 2014-04-15 | Kingston Digital, Inc. | Memory module |
US20140367077A1 (en) * | 2013-06-17 | 2014-12-18 | Che Yuan Wu | Complex heat dissipation assembly |
USD733145S1 (en) * | 2014-03-14 | 2015-06-30 | Kingston Digital, Inc. | Memory module |
USD735201S1 (en) * | 2014-07-30 | 2015-07-28 | Kingston Digital, Inc. | Memory module |
-
2016
- 2016-05-09 US US29/563,885 patent/USD793400S1/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060056154A1 (en) * | 2004-09-15 | 2006-03-16 | International Business Machines Corporation | Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board |
US20060268523A1 (en) * | 2005-05-31 | 2006-11-30 | Akust Technology Co., Ltd. | Heat sink for memory |
US7738252B2 (en) * | 2006-01-09 | 2010-06-15 | Ocz Technology, Group, Inc. | Method and apparatus for thermal management of computer memory modules |
US20080101036A1 (en) * | 2006-10-26 | 2008-05-01 | Chiung Yi Chen | Heat-dissipating assembly structure |
USD657756S1 (en) * | 2011-10-17 | 2012-04-17 | Corsair Memory, Inc. | Low profile heat spreader for a computer memory module |
USD698792S1 (en) * | 2012-01-05 | 2014-02-04 | Kingston Digital, Inc. | Memory module |
USD702689S1 (en) * | 2012-08-17 | 2014-04-15 | Kingston Digital, Inc. | Memory module |
USD702690S1 (en) * | 2012-10-17 | 2014-04-15 | Kingston Digital, Inc. | Memory module |
USD689829S1 (en) * | 2013-01-02 | 2013-09-17 | Comptake Technology Inc. | Heat dissipating module of memory |
US20140367077A1 (en) * | 2013-06-17 | 2014-12-18 | Che Yuan Wu | Complex heat dissipation assembly |
USD733145S1 (en) * | 2014-03-14 | 2015-06-30 | Kingston Digital, Inc. | Memory module |
USD735201S1 (en) * | 2014-07-30 | 2015-07-28 | Kingston Digital, Inc. | Memory module |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD827589S1 (en) * | 2016-04-05 | 2018-09-04 | Sumitomo Seika Chemicals Co., Ltd. | Heat sink |
USD849566S1 (en) * | 2016-12-21 | 2019-05-28 | Mecalc (Pty) Limited | Electronic instruments casing |
USD849567S1 (en) * | 2016-12-21 | 2019-05-28 | Mecalc (Pty) Limited | Electronic instruments casing |
USD868069S1 (en) * | 2017-06-29 | 2019-11-26 | V-Color Technology Inc. | Memory device |
USD862402S1 (en) * | 2017-12-18 | 2019-10-08 | Kingston Digital, Inc. | Memory heat dissipation sink |
USD842304S1 (en) * | 2017-12-21 | 2019-03-05 | Corsair Memory, Inc. | Memory module |
US11968805B2 (en) | 2018-11-02 | 2024-04-23 | Telefonaktiebolaget Lm Ericsson (Publ) | Heatsink having air partitioning baffle |
USD896229S1 (en) * | 2018-11-30 | 2020-09-15 | Samsung Electronics Co., Ltd. | SSD storage device |
USD896231S1 (en) * | 2018-11-30 | 2020-09-15 | Samsung Electronics Co., Ltd. | SSD storage device |
USD896230S1 (en) * | 2018-11-30 | 2020-09-15 | Samsung Electronics Co., Ltd. | SSD storage device |
USD951937S1 (en) * | 2018-12-06 | 2022-05-17 | Samsung Electronics Co., Ltd. | Solid state drive storage device |
USD897345S1 (en) * | 2018-12-07 | 2020-09-29 | Sung-Yu Chen | Double-data-rate SDRAM card |
USD954061S1 (en) * | 2018-12-07 | 2022-06-07 | Sung-Yu Chen | Double-data-rate SDRAM card |
USD936622S1 (en) * | 2019-01-17 | 2021-11-23 | Telefonaktiebolaget Lm Ericsson (Publ) | Baffle for heat sink |
USD904323S1 (en) * | 2019-01-17 | 2020-12-08 | Telefonaktiebolaget Lm Ericsson (Publ) | Heat sink |
USD928161S1 (en) * | 2019-03-14 | 2021-08-17 | Cambricon Technologies Corporation Limited | Graphics card |
USD889052S1 (en) * | 2020-03-17 | 2020-06-30 | B2B International Pty Ltd | Pets ergonomic feeder |
USD956706S1 (en) * | 2020-08-06 | 2022-07-05 | Essencore Limited | Heat sink for memory modules |
USD962880S1 (en) * | 2020-08-06 | 2022-09-06 | Essencore Limited | Heat sink for memory modules |
USD964947S1 (en) * | 2021-06-03 | 2022-09-27 | Kingston Digital, Inc. | Heat sink for memory module |
USD1035597S1 (en) * | 2022-12-15 | 2024-07-16 | Kingston Digital, Inc. | Heat sink for memory module |
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