USD911987S1 - Semiconductor element - Google Patents

Semiconductor element Download PDF

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Publication number
USD911987S1
USD911987S1 US29/704,641 US201929704641F USD911987S US D911987 S1 USD911987 S1 US D911987S1 US 201929704641 F US201929704641 F US 201929704641F US D911987 S USD911987 S US D911987S
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United States
Prior art keywords
semiconductor element
view
ornamental design
semiconductor
design
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US29/704,641
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English (en)
Inventor
Hirotoshi Aoki
Kiyotaka Yoshida
Tomohiko YOSHINO
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Tamura Corp
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Tamura Corp
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Assigned to TAMURA CORPORATION reassignment TAMURA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YOSHIDA, KIYOTAKA, AOKI, HIROTOSHI, YOSHINO, TOMOHIKO
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US29/704,641 2019-03-15 2019-09-05 Semiconductor element Active USD911987S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2019-5630F JP1643135S (enrdf_load_stackoverflow) 2019-03-15 2019-03-15
JP2019-005630 2019-03-15

Publications (1)

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USD911987S1 true USD911987S1 (en) 2021-03-02

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US29/704,641 Active USD911987S1 (en) 2019-03-15 2019-09-05 Semiconductor element

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US (1) USD911987S1 (enrdf_load_stackoverflow)
JP (1) JP1643135S (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD401567S (en) * 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
US6268650B1 (en) * 1999-05-25 2001-07-31 Micron Technology, Inc. Semiconductor device, ball grid array connection system, and method of making
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US20020064901A1 (en) * 1996-03-22 2002-05-30 Chuichi Miyazaki Semiconductor device and manufacturing method thereof
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US6774465B2 (en) * 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module
USD522470S1 (en) * 2004-09-09 2006-06-06 Kabushiki Kaisha Toshiba Portion of a semiconductor device
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US20020064901A1 (en) * 1996-03-22 2002-05-30 Chuichi Miyazaki Semiconductor device and manufacturing method thereof
USD401567S (en) * 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6268650B1 (en) * 1999-05-25 2001-07-31 Micron Technology, Inc. Semiconductor device, ball grid array connection system, and method of making
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US6774465B2 (en) * 2001-10-05 2004-08-10 Fairchild Korea Semiconductor, Ltd. Semiconductor power package module
USD522470S1 (en) * 2004-09-09 2006-06-06 Kabushiki Kaisha Toshiba Portion of a semiconductor device
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD773412S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module

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