USD825502S1 - Heater for substrate processing apparatus - Google Patents

Heater for substrate processing apparatus Download PDF

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Publication number
USD825502S1
USD825502S1 US29/596,960 US201729596960F USD825502S US D825502 S1 USD825502 S1 US D825502S1 US 201729596960 F US201729596960 F US 201729596960F US D825502 S USD825502 S US D825502S
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US
United States
Prior art keywords
heater
processing apparatus
substrate processing
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Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/596,960
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English (en)
Inventor
Tetsuya Kosugi
Takatomo Yamaguchi
Shuhei SAIDO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Hitachi Kokusai Electric Inc
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Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Assigned to HITACHI KOKUSAI ELECTRIC INC. reassignment HITACHI KOKUSAI ELECTRIC INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOSUGI, TETSUYA, SAIDO, SHUHEI, YAMAGUCHI, TAKATOMO
Application granted granted Critical
Publication of USD825502S1 publication Critical patent/USD825502S1/en
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI KOKUSAI ELECTRIC INC.
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US29/596,960 2016-10-14 2017-03-13 Heater for substrate processing apparatus Active USD825502S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-022415 2016-10-14
JPD2016-22415F JP1582475S (enrdf_load_stackoverflow) 2016-10-14 2016-10-14

Publications (1)

Publication Number Publication Date
USD825502S1 true USD825502S1 (en) 2018-08-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/596,960 Active USD825502S1 (en) 2016-10-14 2017-03-13 Heater for substrate processing apparatus

Country Status (3)

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US (1) USD825502S1 (enrdf_load_stackoverflow)
JP (1) JP1582475S (enrdf_load_stackoverflow)
TW (1) TWD187000S (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1053156S1 (en) * 2022-03-15 2024-12-03 Kokusai Electric Corporation Furnace for substrate processing apparatus
USD1070797S1 (en) * 2022-03-15 2025-04-15 Kokusai Electric Corporation Furnace for substrate processing apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1611565S (enrdf_load_stackoverflow) 2018-02-27 2018-08-20
JP1620676S (enrdf_load_stackoverflow) 2018-02-27 2018-12-17

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD516047S1 (en) * 2003-12-18 2006-02-28 Honeywell International Inc. Modular electronic housing and assemblies
US20080166882A1 (en) * 2004-10-07 2008-07-10 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus and Producing Method of Semiconductor Device
US20090291566A1 (en) * 2005-08-05 2009-11-26 Masaaki Ueno Substrate Processing Apparatus, Coolant Gas Supply Nozzle and Semiconductor Device Manufacturing Method
US20110065286A1 (en) * 2009-09-17 2011-03-17 Hitachi-Kokusai Electric Inc. Method of manufacturing semiconductor device and substrate processing apparatus
US20110065288A1 (en) * 2009-09-16 2011-03-17 Hitachi-Kokusai Electric Inc. Substrate processing method and substrate processing apparatus
US20110204036A1 (en) * 2010-02-23 2011-08-25 Hitachi Kokusai Electric Inc. Heat treatment apparatus
US20110212599A1 (en) * 2010-03-01 2011-09-01 Hitachi Kokusai Electric Inc. Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatus
US20110306212A1 (en) * 2010-06-10 2011-12-15 Hitachi Kokusai Electric Inc. Substrate processing apparatus, semiconductor device manufacturing method and substrate manufacturing method
USD790490S1 (en) * 2015-09-04 2017-06-27 Hitachi Kokusai Electric Inc. Reaction tube

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD516047S1 (en) * 2003-12-18 2006-02-28 Honeywell International Inc. Modular electronic housing and assemblies
USD518452S1 (en) * 2003-12-18 2006-04-04 Honeywell International Inc. Modular electronic housing and assemblies
USD519087S1 (en) * 2003-12-18 2006-04-18 Honeywell International Inc. Modular electronic housing and assemblies
US20080166882A1 (en) * 2004-10-07 2008-07-10 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus and Producing Method of Semiconductor Device
US20090291566A1 (en) * 2005-08-05 2009-11-26 Masaaki Ueno Substrate Processing Apparatus, Coolant Gas Supply Nozzle and Semiconductor Device Manufacturing Method
US20110065288A1 (en) * 2009-09-16 2011-03-17 Hitachi-Kokusai Electric Inc. Substrate processing method and substrate processing apparatus
US20110065286A1 (en) * 2009-09-17 2011-03-17 Hitachi-Kokusai Electric Inc. Method of manufacturing semiconductor device and substrate processing apparatus
US20110204036A1 (en) * 2010-02-23 2011-08-25 Hitachi Kokusai Electric Inc. Heat treatment apparatus
US20110212599A1 (en) * 2010-03-01 2011-09-01 Hitachi Kokusai Electric Inc. Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatus
US20110306212A1 (en) * 2010-06-10 2011-12-15 Hitachi Kokusai Electric Inc. Substrate processing apparatus, semiconductor device manufacturing method and substrate manufacturing method
USD790490S1 (en) * 2015-09-04 2017-06-27 Hitachi Kokusai Electric Inc. Reaction tube

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1053156S1 (en) * 2022-03-15 2024-12-03 Kokusai Electric Corporation Furnace for substrate processing apparatus
USD1070797S1 (en) * 2022-03-15 2025-04-15 Kokusai Electric Corporation Furnace for substrate processing apparatus

Also Published As

Publication number Publication date
JP1582475S (enrdf_load_stackoverflow) 2017-07-31
TWD187000S (zh) 2017-12-01

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