USD825502S1 - Heater for substrate processing apparatus - Google Patents
Heater for substrate processing apparatus Download PDFInfo
- Publication number
- USD825502S1 USD825502S1 US29/596,960 US201729596960F USD825502S US D825502 S1 USD825502 S1 US D825502S1 US 201729596960 F US201729596960 F US 201729596960F US D825502 S USD825502 S US D825502S
- Authority
- US
- United States
- Prior art keywords
- heater
- processing apparatus
- substrate processing
- view
- broken lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 3
Images
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2016-22415F JP1582475S (cs) | 2016-10-14 | 2016-10-14 | |
| JP2016-022415 | 2016-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD825502S1 true USD825502S1 (en) | 2018-08-14 |
Family
ID=59384954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/596,960 Active USD825502S1 (en) | 2016-10-14 | 2017-03-13 | Heater for substrate processing apparatus |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD825502S1 (cs) |
| JP (1) | JP1582475S (cs) |
| TW (1) | TWD187000S (cs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1053156S1 (en) * | 2022-03-15 | 2024-12-03 | Kokusai Electric Corporation | Furnace for substrate processing apparatus |
| USD1070797S1 (en) * | 2022-03-15 | 2025-04-15 | Kokusai Electric Corporation | Furnace for substrate processing apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1611565S (cs) | 2018-02-27 | 2018-08-20 | ||
| JP1620676S (cs) | 2018-02-27 | 2018-12-17 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD516047S1 (en) * | 2003-12-18 | 2006-02-28 | Honeywell International Inc. | Modular electronic housing and assemblies |
| US20080166882A1 (en) * | 2004-10-07 | 2008-07-10 | Hitachi Kokusai Electric Inc. | Substrate Processing Apparatus and Producing Method of Semiconductor Device |
| US20090291566A1 (en) * | 2005-08-05 | 2009-11-26 | Masaaki Ueno | Substrate Processing Apparatus, Coolant Gas Supply Nozzle and Semiconductor Device Manufacturing Method |
| US20110065286A1 (en) * | 2009-09-17 | 2011-03-17 | Hitachi-Kokusai Electric Inc. | Method of manufacturing semiconductor device and substrate processing apparatus |
| US20110065288A1 (en) * | 2009-09-16 | 2011-03-17 | Hitachi-Kokusai Electric Inc. | Substrate processing method and substrate processing apparatus |
| US20110204036A1 (en) * | 2010-02-23 | 2011-08-25 | Hitachi Kokusai Electric Inc. | Heat treatment apparatus |
| US20110212599A1 (en) * | 2010-03-01 | 2011-09-01 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatus |
| US20110306212A1 (en) * | 2010-06-10 | 2011-12-15 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus, semiconductor device manufacturing method and substrate manufacturing method |
| USD790490S1 (en) * | 2015-09-04 | 2017-06-27 | Hitachi Kokusai Electric Inc. | Reaction tube |
-
2016
- 2016-10-14 JP JPD2016-22415F patent/JP1582475S/ja active Active
-
2017
- 2017-03-13 US US29/596,960 patent/USD825502S1/en active Active
- 2017-03-13 TW TW106301241F patent/TWD187000S/zh unknown
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD516047S1 (en) * | 2003-12-18 | 2006-02-28 | Honeywell International Inc. | Modular electronic housing and assemblies |
| USD518452S1 (en) * | 2003-12-18 | 2006-04-04 | Honeywell International Inc. | Modular electronic housing and assemblies |
| USD519087S1 (en) * | 2003-12-18 | 2006-04-18 | Honeywell International Inc. | Modular electronic housing and assemblies |
| US20080166882A1 (en) * | 2004-10-07 | 2008-07-10 | Hitachi Kokusai Electric Inc. | Substrate Processing Apparatus and Producing Method of Semiconductor Device |
| US20090291566A1 (en) * | 2005-08-05 | 2009-11-26 | Masaaki Ueno | Substrate Processing Apparatus, Coolant Gas Supply Nozzle and Semiconductor Device Manufacturing Method |
| US20110065288A1 (en) * | 2009-09-16 | 2011-03-17 | Hitachi-Kokusai Electric Inc. | Substrate processing method and substrate processing apparatus |
| US20110065286A1 (en) * | 2009-09-17 | 2011-03-17 | Hitachi-Kokusai Electric Inc. | Method of manufacturing semiconductor device and substrate processing apparatus |
| US20110204036A1 (en) * | 2010-02-23 | 2011-08-25 | Hitachi Kokusai Electric Inc. | Heat treatment apparatus |
| US20110212599A1 (en) * | 2010-03-01 | 2011-09-01 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatus |
| US20110306212A1 (en) * | 2010-06-10 | 2011-12-15 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus, semiconductor device manufacturing method and substrate manufacturing method |
| USD790490S1 (en) * | 2015-09-04 | 2017-06-27 | Hitachi Kokusai Electric Inc. | Reaction tube |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1053156S1 (en) * | 2022-03-15 | 2024-12-03 | Kokusai Electric Corporation | Furnace for substrate processing apparatus |
| USD1070797S1 (en) * | 2022-03-15 | 2025-04-15 | Kokusai Electric Corporation | Furnace for substrate processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD187000S (zh) | 2017-12-01 |
| JP1582475S (cs) | 2017-07-31 |
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