USD819581S1 - Socket for electronic device testing apparatus - Google Patents

Socket for electronic device testing apparatus Download PDF

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Publication number
USD819581S1
USD819581S1 US29/601,371 US201729601371F USD819581S US D819581 S1 USD819581 S1 US D819581S1 US 201729601371 F US201729601371 F US 201729601371F US D819581 S USD819581 S US D819581S
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US
United States
Prior art keywords
socket
testing apparatus
electronic device
device testing
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/601,371
Inventor
Takeshi Okushi
Mitsunori Aizawa
Masanori Nagashima
Takashi Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to US29/601,371 priority Critical patent/USD819581S1/en
Application granted granted Critical
Publication of USD819581S1 publication Critical patent/USD819581S1/en
Assigned to ADVANTEST CORPORATION reassignment ADVANTEST CORPORATION CHANGE OF ADDRESS Assignors: ADVANTEST CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front view of a socket for electronic testing apparatus showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a top perspective view thereof;
FIG. 8 is a bottom perspective view thereof;
FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 3;
FIG. 10 is a cross-sectional view taken along line 10-10 of FIG. 3;
FIG. 11 is an enlarged portion view taken along line 11-11 of FIG. 9; and,
FIG. 12 is an enlarged portion view taken along line 12-12 of FIG. 10.
The even dashed broken lines shown in the drawings represent portions of the socket for an electronic testing apparatus, that form no part of the claimed design.
The dashed-dot line shown on the top and bottom of the socket for an electronic testing apparatus represents the boundary line between the claimed and unclaimed surface areas.
The outer boarder of the center broken line circles in FIG. 8 that form no part of the claimed design, show the step in FIGS. 11 and 12.

Claims (1)

    CLAIM
  1. The ornamental design for a socket for an electronic device testing apparatus, as shown and described.
US29/601,371 2014-07-17 2017-04-21 Socket for electronic device testing apparatus Active USD819581S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/601,371 USD819581S1 (en) 2014-07-17 2017-04-21 Socket for electronic device testing apparatus

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR30-2014-0035155 2014-07-17
KR20140035153 2014-07-17
KR20140035155 2014-07-17
KR30-2014-0035153 2014-07-17
US29/509,962 USD788722S1 (en) 2014-07-17 2014-11-24 Socket for an electronic device testing apparatus
US29/601,371 USD819581S1 (en) 2014-07-17 2017-04-21 Socket for electronic device testing apparatus

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/509,962 Division USD788722S1 (en) 2014-07-17 2014-11-24 Socket for an electronic device testing apparatus

Publications (1)

Publication Number Publication Date
USD819581S1 true USD819581S1 (en) 2018-06-05

Family

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Application Number Title Priority Date Filing Date
US29/509,962 Active USD788722S1 (en) 2014-07-17 2014-11-24 Socket for an electronic device testing apparatus
US29/601,371 Active USD819581S1 (en) 2014-07-17 2017-04-21 Socket for electronic device testing apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/509,962 Active USD788722S1 (en) 2014-07-17 2014-11-24 Socket for an electronic device testing apparatus

Country Status (1)

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US (2) USD788722S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD788722S1 (en) * 2014-07-17 2017-06-06 Advantest Corporation Socket for an electronic device testing apparatus

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD358806S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US20030032322A1 (en) 2001-08-08 2003-02-13 Yamaichi Electronics Co., Ltd. Semiconductor device-socket
US20040063241A1 (en) 2001-06-19 2004-04-01 Tomohiro Nakano Socket for semiconductor package
US20040212382A1 (en) 2003-04-28 2004-10-28 Cram Daniel P. Test socket for semiconductor components having serviceable nest
US20040248435A1 (en) * 2002-12-17 2004-12-09 Yamaichi Electronics Co., Ltd. Socket for semiconductor device
US20050136721A1 (en) 2003-12-19 2005-06-23 Yamaichi Electronics Co., Ltd. Semiconductor device socket
US20050231919A1 (en) 2004-04-16 2005-10-20 Yamaichi Electronics Co., Ltd. Semiconductor device socket
US20050250363A1 (en) 2002-07-09 2005-11-10 Yamaichi Electronics Co., Ltd. Socket for semiconductor device
US20050287837A1 (en) 2004-06-24 2005-12-29 Trobough Mark B Multi-portion socket and related apparatuses
USD522977S1 (en) 2004-08-31 2006-06-13 Yamaichi Electronics Co., Ltd. Socket for semiconductor device
US20070173081A1 (en) 2006-01-20 2007-07-26 Hon Hai Precision Ind. Co., Ltd. Socket assembly
US7335030B2 (en) * 2005-03-10 2008-02-26 Yamaichi Electronics Co., Ltd. Cartridge for contact terminals and semiconductor device socket provided with the same
US7568918B2 (en) * 2007-09-28 2009-08-04 Yamaichi Electronics Co., Ltd. Socket for semiconductor device
US20100062623A1 (en) 2008-09-08 2010-03-11 Hon Hai Precision Industry Co., Ltd. Ic socket with floatable pressing device for receiving testing ic packages of different sizes
US7819686B2 (en) * 2008-08-11 2010-10-26 Hon Hai Precision Ind. Co., Ltd. Burn-in socket
US7887355B2 (en) * 2008-11-13 2011-02-15 Yamaichi Electronics Co., Ltd. Semiconductor device socket
USD633880S1 (en) 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket housing
USD633879S1 (en) 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket cap
USD633878S1 (en) 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket cover cap
USD633877S1 (en) 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket frame
USD645426S1 (en) 2010-03-26 2011-09-20 Advanced Micro Devices, Inc. Socket assembly
USD788722S1 (en) * 2014-07-17 2017-06-06 Advantest Corporation Socket for an electronic device testing apparatus
US9755387B2 (en) * 2014-03-31 2017-09-05 Enplas Corporation Elevating mechanism and socket for electrical component

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD358806S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US20040063241A1 (en) 2001-06-19 2004-04-01 Tomohiro Nakano Socket for semiconductor package
US20030032322A1 (en) 2001-08-08 2003-02-13 Yamaichi Electronics Co., Ltd. Semiconductor device-socket
US20050250363A1 (en) 2002-07-09 2005-11-10 Yamaichi Electronics Co., Ltd. Socket for semiconductor device
US20040248435A1 (en) * 2002-12-17 2004-12-09 Yamaichi Electronics Co., Ltd. Socket for semiconductor device
US20040212382A1 (en) 2003-04-28 2004-10-28 Cram Daniel P. Test socket for semiconductor components having serviceable nest
US20050136721A1 (en) 2003-12-19 2005-06-23 Yamaichi Electronics Co., Ltd. Semiconductor device socket
US20050231919A1 (en) 2004-04-16 2005-10-20 Yamaichi Electronics Co., Ltd. Semiconductor device socket
US7230830B2 (en) * 2004-04-16 2007-06-12 Yamaichi Electronics Co., Ltd. Semiconductor device socket
US20050287837A1 (en) 2004-06-24 2005-12-29 Trobough Mark B Multi-portion socket and related apparatuses
USD522977S1 (en) 2004-08-31 2006-06-13 Yamaichi Electronics Co., Ltd. Socket for semiconductor device
US7335030B2 (en) * 2005-03-10 2008-02-26 Yamaichi Electronics Co., Ltd. Cartridge for contact terminals and semiconductor device socket provided with the same
US20070173081A1 (en) 2006-01-20 2007-07-26 Hon Hai Precision Ind. Co., Ltd. Socket assembly
US7568918B2 (en) * 2007-09-28 2009-08-04 Yamaichi Electronics Co., Ltd. Socket for semiconductor device
US7819686B2 (en) * 2008-08-11 2010-10-26 Hon Hai Precision Ind. Co., Ltd. Burn-in socket
US20100062623A1 (en) 2008-09-08 2010-03-11 Hon Hai Precision Industry Co., Ltd. Ic socket with floatable pressing device for receiving testing ic packages of different sizes
US7887355B2 (en) * 2008-11-13 2011-02-15 Yamaichi Electronics Co., Ltd. Semiconductor device socket
USD633878S1 (en) 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket cover cap
USD633879S1 (en) 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket cap
USD633880S1 (en) 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket housing
USD633877S1 (en) 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket frame
USD645426S1 (en) 2010-03-26 2011-09-20 Advanced Micro Devices, Inc. Socket assembly
USD648688S1 (en) 2010-03-26 2011-11-15 Advanced Micro Devices, Inc. Socket housing
USD661667S1 (en) 2010-03-26 2012-06-12 Advanced Micro Devices, Inc. Socket assembly
US9755387B2 (en) * 2014-03-31 2017-09-05 Enplas Corporation Elevating mechanism and socket for electrical component
USD788722S1 (en) * 2014-07-17 2017-06-06 Advantest Corporation Socket for an electronic device testing apparatus

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Office Action issued in Taiwan Counterpart Patent Appl. No. 103306664, dated Jul. 20, 2015.
Office Action issued in Taiwan Counterpart Patent Appl. No. 10420942510, dated Jul. 20, 2015.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus

Also Published As

Publication number Publication date
USD788722S1 (en) 2017-06-06

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