USD812014S1 - Ring for holding the connections of the connectors - Google Patents
Ring for holding the connections of the connectors Download PDFInfo
- Publication number
- USD812014S1 USD812014S1 US29/549,253 US201529549253F USD812014S US D812014 S1 USD812014 S1 US D812014S1 US 201529549253 F US201529549253 F US 201529549253F US D812014 S USD812014 S US D812014S
- Authority
- US
- United States
- Prior art keywords
- connections
- holding
- ring
- connectors
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-016952 | 2015-01-30 | ||
JPD2015-16952F JP1546755S (enrdf_load_stackoverflow) | 2015-07-30 | 2015-07-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD812014S1 true USD812014S1 (en) | 2018-03-06 |
Family
ID=55539580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/549,253 Active USD812014S1 (en) | 2015-07-30 | 2015-12-21 | Ring for holding the connections of the connectors |
Country Status (3)
Country | Link |
---|---|
US (1) | USD812014S1 (enrdf_load_stackoverflow) |
JP (1) | JP1546755S (enrdf_load_stackoverflow) |
TW (1) | TWD176974S (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD978799S1 (en) * | 2019-11-25 | 2023-02-21 | Richard Steininger | Shim for a rail insulator |
USD995279S1 (en) * | 2021-08-17 | 2023-08-15 | Shaheryar Sultan | Neck collar |
USD1059312S1 (en) * | 2022-08-04 | 2025-01-28 | Applied Materials, Inc. | Deposition ring of a process kit for semiconductor substrate processing |
USD1064005S1 (en) | 2022-08-04 | 2025-02-25 | Applied Materials, Inc. | Grounding ring of a process kit for semiconductor substrate processing |
USD1069863S1 (en) | 2022-08-04 | 2025-04-08 | Applied Materials, Inc. | Deposition ring of a process kit for semiconductor substrate processing |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4478381A (en) * | 1981-07-04 | 1984-10-23 | A. Raymond | Pipe clamp |
US6874515B2 (en) * | 2001-04-25 | 2005-04-05 | Tokyo Electron Limited | Substrate dual-side processing apparatus |
US7178203B2 (en) * | 2005-02-28 | 2007-02-20 | Illinois Tool Works Inc | Anti-removal ratchet clip |
USD665759S1 (en) * | 2010-12-14 | 2012-08-21 | Tokyo Electron Limited | Substrate transfer holder |
USD721652S1 (en) * | 2013-08-23 | 2015-01-27 | Bridgeport Fittings, Inc. | Split, non-metallic electrical insulating bushing |
-
2015
- 2015-07-30 JP JPD2015-16952F patent/JP1546755S/ja active Active
- 2015-12-21 US US29/549,253 patent/USD812014S1/en active Active
- 2015-12-24 TW TW104307169F patent/TWD176974S/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4478381A (en) * | 1981-07-04 | 1984-10-23 | A. Raymond | Pipe clamp |
US6874515B2 (en) * | 2001-04-25 | 2005-04-05 | Tokyo Electron Limited | Substrate dual-side processing apparatus |
US7178203B2 (en) * | 2005-02-28 | 2007-02-20 | Illinois Tool Works Inc | Anti-removal ratchet clip |
USD665759S1 (en) * | 2010-12-14 | 2012-08-21 | Tokyo Electron Limited | Substrate transfer holder |
USD721652S1 (en) * | 2013-08-23 | 2015-01-27 | Bridgeport Fittings, Inc. | Split, non-metallic electrical insulating bushing |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD978799S1 (en) * | 2019-11-25 | 2023-02-21 | Richard Steininger | Shim for a rail insulator |
USD995279S1 (en) * | 2021-08-17 | 2023-08-15 | Shaheryar Sultan | Neck collar |
USD1059312S1 (en) * | 2022-08-04 | 2025-01-28 | Applied Materials, Inc. | Deposition ring of a process kit for semiconductor substrate processing |
USD1064005S1 (en) | 2022-08-04 | 2025-02-25 | Applied Materials, Inc. | Grounding ring of a process kit for semiconductor substrate processing |
USD1069863S1 (en) | 2022-08-04 | 2025-04-08 | Applied Materials, Inc. | Deposition ring of a process kit for semiconductor substrate processing |
Also Published As
Publication number | Publication date |
---|---|
TWD176974S (zh) | 2016-07-11 |
JP1546755S (enrdf_load_stackoverflow) | 2016-03-28 |
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