TWD176974S - 光連接器用脫離防止環 - Google Patents

光連接器用脫離防止環

Info

Publication number
TWD176974S
TWD176974S TW104307169F TW104307169F TWD176974S TW D176974 S TWD176974 S TW D176974S TW 104307169 F TW104307169 F TW 104307169F TW 104307169 F TW104307169 F TW 104307169F TW D176974 S TWD176974 S TW D176974S
Authority
TW
Taiwan
Prior art keywords
connectors
rings
connections
holding
prevent
Prior art date
Application number
TW104307169F
Other languages
English (en)
Chinese (zh)
Inventor
Naoki Katagiyama
Yuichi Koreeda
Original Assignee
Japan Aviation Electronics Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electronics Ind Ltd filed Critical Japan Aviation Electronics Ind Ltd
Publication of TWD176974S publication Critical patent/TWD176974S/zh

Links

TW104307169F 2015-07-30 2015-12-24 光連接器用脫離防止環 TWD176974S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-16952F JP1546755S (enrdf_load_stackoverflow) 2015-07-30 2015-07-30

Publications (1)

Publication Number Publication Date
TWD176974S true TWD176974S (zh) 2016-07-11

Family

ID=55539580

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104307169F TWD176974S (zh) 2015-07-30 2015-12-24 光連接器用脫離防止環

Country Status (3)

Country Link
US (1) USD812014S1 (enrdf_load_stackoverflow)
JP (1) JP1546755S (enrdf_load_stackoverflow)
TW (1) TWD176974S (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD978799S1 (en) * 2019-11-25 2023-02-21 Richard Steininger Shim for a rail insulator
USD995279S1 (en) * 2021-08-17 2023-08-15 Shaheryar Sultan Neck collar
USD1069863S1 (en) 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1059312S1 (en) * 2022-08-04 2025-01-28 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1064005S1 (en) 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3126488C2 (de) * 1981-07-04 1983-04-21 Fa. A. Raymond, 7850 Lörrach Rohrschelle
JP3888608B2 (ja) * 2001-04-25 2007-03-07 東京エレクトロン株式会社 基板両面処理装置
US7178203B2 (en) * 2005-02-28 2007-02-20 Illinois Tool Works Inc Anti-removal ratchet clip
USD665759S1 (en) * 2010-12-14 2012-08-21 Tokyo Electron Limited Substrate transfer holder
USD721652S1 (en) * 2013-08-23 2015-01-27 Bridgeport Fittings, Inc. Split, non-metallic electrical insulating bushing

Also Published As

Publication number Publication date
USD812014S1 (en) 2018-03-06
JP1546755S (enrdf_load_stackoverflow) 2016-03-28

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