USD665759S1 - Substrate transfer holder - Google Patents

Substrate transfer holder Download PDF

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Publication number
USD665759S1
USD665759S1 US29/393,919 US201129393919F USD665759S US D665759 S1 USD665759 S1 US D665759S1 US 201129393919 F US201129393919 F US 201129393919F US D665759 S USD665759 S US D665759S
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US
United States
Prior art keywords
substrate transfer
transfer holder
view
holder
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/393,919
Inventor
Norifumi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SATO, NORIFUMI
Application granted granted Critical
Publication of USD665759S1 publication Critical patent/USD665759S1/en
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Description

FIG. 1 is a top perspective view of a substrate transfer holder showing my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side view thereof, the right side being a mirror image;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is an enlarged fragmental view taken along 7-7 of FIG. 5 thereof; and,
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 7 thereof.
The broken lines shown represent unclaimed subject matter and form no part of the claimed design. The alternating long and short dashed lines in the drawings define the boundaries between the claimed and unclaimed features. None of the broken lines form any part of the claim.
The article is a substrate transfer holder for holding and transferring a circular substrate, for example, a semiconductor wafer or the like. Parts indicated by solid lines are the part of article for which a design patent is sought.

Claims (1)

  1. The ornamental design for a substrate transfer holder, as shown and described.
US29/393,919 2010-12-14 2011-06-10 Substrate transfer holder Active USD665759S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-029767 2010-02-15
JP2010029767 2010-12-14

Publications (1)

Publication Number Publication Date
USD665759S1 true USD665759S1 (en) 2012-08-21

Family

ID=46641914

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/393,919 Active USD665759S1 (en) 2010-12-14 2011-06-10 Substrate transfer holder

Country Status (2)

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US (1) USD665759S1 (en)
TW (1) TWD147585S (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
USD805044S1 (en) * 2015-10-30 2017-12-12 Hirata Corporation Adhesive sheet for substrate
USD811457S1 (en) * 2015-11-02 2018-02-27 Hirata Corporation Substrate conveyance arm
USD812014S1 (en) * 2015-07-30 2018-03-06 Japan Aviation Electronics Industry, Limited Ring for holding the connections of the connectors
USD813283S1 (en) * 2015-06-17 2018-03-20 Thk Co., Ltd. Robot hand
USD868012S1 (en) * 2017-01-18 2019-11-26 Kokusai Electric Corporation Cassette receiving tool for semiconductor manufacturing apparatus
USD868013S1 (en) * 2017-01-18 2019-11-26 Kokusai Electric Corporation Cassette receiving tool for semiconductor manufacturing apparatus
USD877706S1 (en) * 2017-01-18 2020-03-10 Kokusai Electric Corporation Cassette displacement prevention jig of semiconductor manufacturing apparatus
USD938373S1 (en) * 2019-10-25 2021-12-14 Applied Materials, Inc. Substrate transfer structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6578891B1 (en) * 1999-07-08 2003-06-17 Ebara Corporation Substrate holder and substrate transfer apparatus using the same
US6874515B2 (en) * 2001-04-25 2005-04-05 Tokyo Electron Limited Substrate dual-side processing apparatus
US20070076345A1 (en) * 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
USD552138S1 (en) * 2005-06-29 2007-10-02 Tokyo Electron Limited Arm transferring substrate to be processed
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6578891B1 (en) * 1999-07-08 2003-06-17 Ebara Corporation Substrate holder and substrate transfer apparatus using the same
US6874515B2 (en) * 2001-04-25 2005-04-05 Tokyo Electron Limited Substrate dual-side processing apparatus
USD552138S1 (en) * 2005-06-29 2007-10-02 Tokyo Electron Limited Arm transferring substrate to be processed
US20070076345A1 (en) * 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD813283S1 (en) * 2015-06-17 2018-03-20 Thk Co., Ltd. Robot hand
USD812014S1 (en) * 2015-07-30 2018-03-06 Japan Aviation Electronics Industry, Limited Ring for holding the connections of the connectors
USD805044S1 (en) * 2015-10-30 2017-12-12 Hirata Corporation Adhesive sheet for substrate
USD811457S1 (en) * 2015-11-02 2018-02-27 Hirata Corporation Substrate conveyance arm
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
USD868012S1 (en) * 2017-01-18 2019-11-26 Kokusai Electric Corporation Cassette receiving tool for semiconductor manufacturing apparatus
USD868013S1 (en) * 2017-01-18 2019-11-26 Kokusai Electric Corporation Cassette receiving tool for semiconductor manufacturing apparatus
USD877706S1 (en) * 2017-01-18 2020-03-10 Kokusai Electric Corporation Cassette displacement prevention jig of semiconductor manufacturing apparatus
USD938373S1 (en) * 2019-10-25 2021-12-14 Applied Materials, Inc. Substrate transfer structure

Also Published As

Publication number Publication date
TWD147585S (en) 2012-06-11

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