USD665759S1 - Substrate transfer holder - Google Patents
Substrate transfer holder Download PDFInfo
- Publication number
- USD665759S1 USD665759S1 US29/393,919 US201129393919F USD665759S US D665759 S1 USD665759 S1 US D665759S1 US 201129393919 F US201129393919 F US 201129393919F US D665759 S USD665759 S US D665759S
- Authority
- US
- United States
- Prior art keywords
- substrate transfer
- transfer holder
- view
- holder
- design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The broken lines shown represent unclaimed subject matter and form no part of the claimed design. The alternating long and short dashed lines in the drawings define the boundaries between the claimed and unclaimed features. None of the broken lines form any part of the claim.
The article is a substrate transfer holder for holding and transferring a circular substrate, for example, a semiconductor wafer or the like. Parts indicated by solid lines are the part of article for which a design patent is sought.
Claims (1)
- The ornamental design for a substrate transfer holder, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-029767 | 2010-02-15 | ||
JP2010029767 | 2010-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD665759S1 true USD665759S1 (en) | 2012-08-21 |
Family
ID=46641914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/393,919 Active USD665759S1 (en) | 2010-12-14 | 2011-06-10 | Substrate transfer holder |
Country Status (2)
Country | Link |
---|---|
US (1) | USD665759S1 (en) |
TW (1) | TWD147585S (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD785578S1 (en) * | 2016-03-22 | 2017-05-02 | Asm Ip Holding B.V. | Substrate supporting arm for semiconductor manufacturing apparatus |
USD805044S1 (en) * | 2015-10-30 | 2017-12-12 | Hirata Corporation | Adhesive sheet for substrate |
USD811457S1 (en) * | 2015-11-02 | 2018-02-27 | Hirata Corporation | Substrate conveyance arm |
USD812014S1 (en) * | 2015-07-30 | 2018-03-06 | Japan Aviation Electronics Industry, Limited | Ring for holding the connections of the connectors |
USD813283S1 (en) * | 2015-06-17 | 2018-03-20 | Thk Co., Ltd. | Robot hand |
USD868012S1 (en) * | 2017-01-18 | 2019-11-26 | Kokusai Electric Corporation | Cassette receiving tool for semiconductor manufacturing apparatus |
USD868013S1 (en) * | 2017-01-18 | 2019-11-26 | Kokusai Electric Corporation | Cassette receiving tool for semiconductor manufacturing apparatus |
USD877706S1 (en) * | 2017-01-18 | 2020-03-10 | Kokusai Electric Corporation | Cassette displacement prevention jig of semiconductor manufacturing apparatus |
USD938373S1 (en) * | 2019-10-25 | 2021-12-14 | Applied Materials, Inc. | Substrate transfer structure |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6578891B1 (en) * | 1999-07-08 | 2003-06-17 | Ebara Corporation | Substrate holder and substrate transfer apparatus using the same |
US6874515B2 (en) * | 2001-04-25 | 2005-04-05 | Tokyo Electron Limited | Substrate dual-side processing apparatus |
US20070076345A1 (en) * | 2005-09-20 | 2007-04-05 | Bang Won B | Substrate placement determination using substrate backside pressure measurement |
USD552138S1 (en) * | 2005-06-29 | 2007-10-02 | Tokyo Electron Limited | Arm transferring substrate to be processed |
USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
-
2011
- 2011-06-10 US US29/393,919 patent/USD665759S1/en active Active
- 2011-06-14 TW TW100302983F patent/TWD147585S/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6578891B1 (en) * | 1999-07-08 | 2003-06-17 | Ebara Corporation | Substrate holder and substrate transfer apparatus using the same |
US6874515B2 (en) * | 2001-04-25 | 2005-04-05 | Tokyo Electron Limited | Substrate dual-side processing apparatus |
USD552138S1 (en) * | 2005-06-29 | 2007-10-02 | Tokyo Electron Limited | Arm transferring substrate to be processed |
US20070076345A1 (en) * | 2005-09-20 | 2007-04-05 | Bang Won B | Substrate placement determination using substrate backside pressure measurement |
USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD813283S1 (en) * | 2015-06-17 | 2018-03-20 | Thk Co., Ltd. | Robot hand |
USD812014S1 (en) * | 2015-07-30 | 2018-03-06 | Japan Aviation Electronics Industry, Limited | Ring for holding the connections of the connectors |
USD805044S1 (en) * | 2015-10-30 | 2017-12-12 | Hirata Corporation | Adhesive sheet for substrate |
USD811457S1 (en) * | 2015-11-02 | 2018-02-27 | Hirata Corporation | Substrate conveyance arm |
USD785578S1 (en) * | 2016-03-22 | 2017-05-02 | Asm Ip Holding B.V. | Substrate supporting arm for semiconductor manufacturing apparatus |
USD868012S1 (en) * | 2017-01-18 | 2019-11-26 | Kokusai Electric Corporation | Cassette receiving tool for semiconductor manufacturing apparatus |
USD868013S1 (en) * | 2017-01-18 | 2019-11-26 | Kokusai Electric Corporation | Cassette receiving tool for semiconductor manufacturing apparatus |
USD877706S1 (en) * | 2017-01-18 | 2020-03-10 | Kokusai Electric Corporation | Cassette displacement prevention jig of semiconductor manufacturing apparatus |
USD938373S1 (en) * | 2019-10-25 | 2021-12-14 | Applied Materials, Inc. | Substrate transfer structure |
Also Published As
Publication number | Publication date |
---|---|
TWD147585S (en) | 2012-06-11 |
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