USD805042S1 - Combined heat exchanger base and embedded heat pipes - Google Patents

Combined heat exchanger base and embedded heat pipes Download PDF

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Publication number
USD805042S1
USD805042S1 US29/543,611 US201529543611F USD805042S US D805042 S1 USD805042 S1 US D805042S1 US 201529543611 F US201529543611 F US 201529543611F US D805042 S USD805042 S US D805042S
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Prior art keywords
heat exchanger
exchanger base
embedded
combined
heat pipes
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US29/543,611
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Tsung-Hsien Huang
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Individual
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Priority to US29/543,611 priority Critical patent/USD805042S1/en
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FIG. 1 is a front bottom perspective view of a combined heat exchanger base and embedded heat pipes, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a front top perspective view thereof.
The broken lines illustrate portions of the combined heat exchanger base and embedded heat pipes and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a combined heat exchanger base and embedded heat pipes, as shown and described.
US29/543,611 2015-10-27 2015-10-27 Combined heat exchanger base and embedded heat pipes Active USD805042S1 (en)

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US29/543,611 USD805042S1 (en) 2015-10-27 2015-10-27 Combined heat exchanger base and embedded heat pipes

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US29/543,611 USD805042S1 (en) 2015-10-27 2015-10-27 Combined heat exchanger base and embedded heat pipes

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USD805042S1 true USD805042S1 (en) 2017-12-12

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US29/543,611 Active USD805042S1 (en) 2015-10-27 2015-10-27 Combined heat exchanger base and embedded heat pipes

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD819578S1 (en) * 2016-07-14 2018-06-05 Enermax Technology Corporation Heat dissipating fin
USD827589S1 (en) * 2016-04-05 2018-09-04 Sumitomo Seika Chemicals Co., Ltd. Heat sink
US20190335620A1 (en) * 2018-04-28 2019-10-31 Cambricon Technologies Corporation Limited Heat dissipation device
USD924186S1 (en) * 2020-03-09 2021-07-06 Cambricon Technologies Corporation Limited Board card
USD954005S1 (en) 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
USD971862S1 (en) * 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
USD1113773S1 (en) * 2024-05-14 2026-02-17 Fortune Electric Co., Ltd. Heat sink

Citations (34)

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USD487885S1 (en) * 2003-03-14 2004-03-30 Datech Technology Co., Ltd. Heat pipe heat sink assembly
US6717813B1 (en) * 2003-04-14 2004-04-06 Thermal Corp. Heat dissipation unit with direct contact heat pipe
US20040201963A1 (en) * 2003-04-14 2004-10-14 Scott Garner Heat dissipation unit with direct contact heat pipe
US20050056400A1 (en) * 2003-09-12 2005-03-17 Chun-Chi Chen Heat pipe type heat dissipation device
US20050103476A1 (en) * 2003-11-17 2005-05-19 Chun-Chi Chen Heat dissipating assembly with heat pipes
US20050139347A1 (en) * 2003-12-26 2005-06-30 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
USD533145S1 (en) * 2005-08-04 2006-12-05 Molex Incorporated Heat sink
US20060291166A1 (en) * 2005-06-24 2006-12-28 Cpumate Inc. Thermal structure for electric devices
US20070211432A1 (en) * 2006-03-08 2007-09-13 Foxconn Technology Co.,Ltd. Heat dissipating device for computer add-on cards
USD567771S1 (en) * 2006-12-23 2008-04-29 Foxconn Technology Co., Ltd. Heat dissipation device
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US20090059536A1 (en) * 2007-07-24 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly
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US7753109B2 (en) * 2007-05-23 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US7866043B2 (en) * 2008-04-28 2011-01-11 Golden Sun News Techniques Co., Ltd. Method of flatting evaporating section of heat pipe embedded in heat dissipation device
US20110024087A1 (en) * 2009-07-29 2011-02-03 Kuo-Len Lin Heat-dissipating fins, large-area heat sink having such heat-dissipating fins and method for manufacturing the same
US20110048677A1 (en) * 2009-08-31 2011-03-03 Kuo-Len Lin Heat-conducting assembly for heat pipes of different diameters and heat sink having the same
US7990699B2 (en) * 2009-01-08 2011-08-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for memory module
US20120067550A1 (en) * 2010-09-22 2012-03-22 David Shih Heat sink structure embedded with heat pipes
US20130043006A1 (en) * 2011-08-15 2013-02-21 Foxconn Technology Co., Ltd. Heat disspation device
US8448694B2 (en) * 2009-10-28 2013-05-28 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation assembly
US20130168056A1 (en) * 2011-12-30 2013-07-04 Asia Vital Components Co., Ltd. Heat-dissipating device
US20140041838A1 (en) * 2009-09-04 2014-02-13 Golden Sun News Techniques Co., Ltd Heat pipe assembly and heat dissipation device having the same
US20140138074A1 (en) * 2012-11-16 2014-05-22 Tsung-Hsien Huang Heat sink module
US20140202666A1 (en) * 2013-01-22 2014-07-24 Asia Vital Components Co., Ltd. Thermal module
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
US20150062820A1 (en) * 2013-09-04 2015-03-05 Cisco Technology, Inc. Heat transfer for electronic equipment
US20150144307A1 (en) * 2013-11-25 2015-05-28 Cooler Master (Hui Zhou) Co., Ltd. Heat dissipating device and heat dissipating fin
US20150276321A1 (en) * 2014-04-01 2015-10-01 Tsung-Hsien Huang Heat transfer plate and heat pipe mounting structure and method
US20160209121A1 (en) * 2015-01-19 2016-07-21 Tai-Sol Electronics Co., Ltd. Heat-dissipating structure
US20160295679A1 (en) * 2015-04-03 2016-10-06 Motorola Solutions, Inc. Electronic device including an externally-mounted heat pipe
US20160298909A1 (en) * 2015-04-13 2016-10-13 Tai-Sol Electronics Co., Ltd. Heat Dissipation Structure with Heat Pipes Arranged in Two Spaced and Partially Overlapped Layers
US20160360639A1 (en) * 2015-06-08 2016-12-08 Advantech Co., Ltd. Dynamic heat conduction system

Patent Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD487885S1 (en) * 2003-03-14 2004-03-30 Datech Technology Co., Ltd. Heat pipe heat sink assembly
US6717813B1 (en) * 2003-04-14 2004-04-06 Thermal Corp. Heat dissipation unit with direct contact heat pipe
US20040201963A1 (en) * 2003-04-14 2004-10-14 Scott Garner Heat dissipation unit with direct contact heat pipe
US20050056400A1 (en) * 2003-09-12 2005-03-17 Chun-Chi Chen Heat pipe type heat dissipation device
US20050103476A1 (en) * 2003-11-17 2005-05-19 Chun-Chi Chen Heat dissipating assembly with heat pipes
US20050139347A1 (en) * 2003-12-26 2005-06-30 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20060291166A1 (en) * 2005-06-24 2006-12-28 Cpumate Inc. Thermal structure for electric devices
USD533145S1 (en) * 2005-08-04 2006-12-05 Molex Incorporated Heat sink
US20070211432A1 (en) * 2006-03-08 2007-09-13 Foxconn Technology Co.,Ltd. Heat dissipating device for computer add-on cards
USD567771S1 (en) * 2006-12-23 2008-04-29 Foxconn Technology Co., Ltd. Heat dissipation device
US7753109B2 (en) * 2007-05-23 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US20090008065A1 (en) * 2007-07-02 2009-01-08 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US20090059536A1 (en) * 2007-07-24 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly
US7609521B2 (en) * 2007-09-26 2009-10-27 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with a heat pipe
USD579423S1 (en) * 2007-11-19 2008-10-28 Foxconn Technology Co., Ltd. Heat sink
US7866043B2 (en) * 2008-04-28 2011-01-11 Golden Sun News Techniques Co., Ltd. Method of flatting evaporating section of heat pipe embedded in heat dissipation device
US7990699B2 (en) * 2009-01-08 2011-08-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for memory module
US20110024087A1 (en) * 2009-07-29 2011-02-03 Kuo-Len Lin Heat-dissipating fins, large-area heat sink having such heat-dissipating fins and method for manufacturing the same
US20110048677A1 (en) * 2009-08-31 2011-03-03 Kuo-Len Lin Heat-conducting assembly for heat pipes of different diameters and heat sink having the same
US20140041838A1 (en) * 2009-09-04 2014-02-13 Golden Sun News Techniques Co., Ltd Heat pipe assembly and heat dissipation device having the same
US8448694B2 (en) * 2009-10-28 2013-05-28 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation assembly
US20120067550A1 (en) * 2010-09-22 2012-03-22 David Shih Heat sink structure embedded with heat pipes
US20130043006A1 (en) * 2011-08-15 2013-02-21 Foxconn Technology Co., Ltd. Heat disspation device
US20130168056A1 (en) * 2011-12-30 2013-07-04 Asia Vital Components Co., Ltd. Heat-dissipating device
US20140138074A1 (en) * 2012-11-16 2014-05-22 Tsung-Hsien Huang Heat sink module
US20140202666A1 (en) * 2013-01-22 2014-07-24 Asia Vital Components Co., Ltd. Thermal module
US20150062820A1 (en) * 2013-09-04 2015-03-05 Cisco Technology, Inc. Heat transfer for electronic equipment
US20150144307A1 (en) * 2013-11-25 2015-05-28 Cooler Master (Hui Zhou) Co., Ltd. Heat dissipating device and heat dissipating fin
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
US20150276321A1 (en) * 2014-04-01 2015-10-01 Tsung-Hsien Huang Heat transfer plate and heat pipe mounting structure and method
US20160209121A1 (en) * 2015-01-19 2016-07-21 Tai-Sol Electronics Co., Ltd. Heat-dissipating structure
US20160295679A1 (en) * 2015-04-03 2016-10-06 Motorola Solutions, Inc. Electronic device including an externally-mounted heat pipe
US20160298909A1 (en) * 2015-04-13 2016-10-13 Tai-Sol Electronics Co., Ltd. Heat Dissipation Structure with Heat Pipes Arranged in Two Spaced and Partially Overlapped Layers
US20160360639A1 (en) * 2015-06-08 2016-12-08 Advantech Co., Ltd. Dynamic heat conduction system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Alibaba, "High quality industrial OEM ODM copper pipe embedded heat sink", Accessed Apr. 13, 2017. (https://www.alibaba.com/product-detail/High-quality-industrial-OEM-ODM-copper-2010407847.html). *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD827589S1 (en) * 2016-04-05 2018-09-04 Sumitomo Seika Chemicals Co., Ltd. Heat sink
USD819578S1 (en) * 2016-07-14 2018-06-05 Enermax Technology Corporation Heat dissipating fin
US20190335620A1 (en) * 2018-04-28 2019-10-31 Cambricon Technologies Corporation Limited Heat dissipation device
US11758688B2 (en) * 2018-04-28 2023-09-12 Cambricon Technologies Corporation Limited Heat dissipation device
USD971862S1 (en) * 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
USD954005S1 (en) 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
USD924186S1 (en) * 2020-03-09 2021-07-06 Cambricon Technologies Corporation Limited Board card
USD1113773S1 (en) * 2024-05-14 2026-02-17 Fortune Electric Co., Ltd. Heat sink

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