USD791091S1 - Pattern wafer - Google Patents

Pattern wafer Download PDF

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Publication number
USD791091S1
USD791091S1 US29/569,263 US201629569263F USD791091S US D791091 S1 USD791091 S1 US D791091S1 US 201629569263 F US201629569263 F US 201629569263F US D791091 S USD791091 S US D791091S
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US
United States
Prior art keywords
pattern wafer
view
wafer
pattern
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/569,263
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English (en)
Inventor
Hiromi Okada
Shinya Morita
Satoshi Aizawa
Masayoshi Minami
Kazuyuki Okuda
Masayuki Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Hitachi Kokusai Electric Inc
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Publication date
Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Assigned to HITACHI KOKUSAI ELECTRIC INC. reassignment HITACHI KOKUSAI ELECTRIC INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AIZAWA, SATOSHI, MINAMI, MASAYOSHI, MORITA, SHINYA, OKADA, HIROMI, OKUDA, KAZUYUKI, YAMADA, MASAYUKI
Application granted granted Critical
Publication of USD791091S1 publication Critical patent/USD791091S1/en
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI KOKUSAI ELECTRIC INC.
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US29/569,263 2015-12-28 2016-06-24 Pattern wafer Active USD791091S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-029186 2015-12-28
JPD2015-29186F JP1563718S (cs) 2015-12-28 2015-12-28

Publications (1)

Publication Number Publication Date
USD791091S1 true USD791091S1 (en) 2017-07-04

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ID=57321959

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/569,263 Active USD791091S1 (en) 2015-12-28 2016-06-24 Pattern wafer

Country Status (3)

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US (1) USD791091S1 (cs)
JP (1) JP1563718S (cs)
TW (1) TWD187175S (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD849422S1 (en) * 2014-12-17 2019-05-28 Ngk Insulators, Ltd. Composite substrate for acoustic wave device
USD897974S1 (en) * 2018-03-29 2020-10-06 Hamamatsu Photonics K.K. Semiconductor wafer
USD940131S1 (en) * 2019-07-29 2022-01-04 Samsung Display Co., Ltd. Display panel
USD958094S1 (en) 2019-07-29 2022-07-19 Samsung Display Co., Ltd. Display panel
USD966276S1 (en) 2019-07-29 2022-10-11 Samsung Display Co., Ltd. Display module for wearable device

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3461537A (en) * 1965-11-23 1969-08-19 Telefunken Patent Separation of individual wafers of a semiconductor disc
US4630093A (en) * 1983-11-24 1986-12-16 Sumitomo Electric Industries, Ltd. Wafer of semiconductors
US5182233A (en) * 1989-08-02 1993-01-26 Kabushiki Kaisha Toshiba Compound semiconductor pellet, and method for dicing compound semiconductor wafer
US5314844A (en) * 1991-03-04 1994-05-24 Kabushiki Kaisha Toshiba Method for dicing a semiconductor wafer
US20020121915A1 (en) * 2001-03-05 2002-09-05 Agere Systems Guardian Corp. Automated pattern clustering detection for wafer probe maps
US20040124413A1 (en) * 2002-12-26 2004-07-01 Kazuhisa Arai Wafer support plate
US20040259332A1 (en) * 2002-04-11 2004-12-23 Masateru Fukuoka Method for manufacturing semiconductor chip
US20050170616A1 (en) * 2004-02-03 2005-08-04 Disco Corporation Wafer dividing method
US7115984B2 (en) * 2002-06-18 2006-10-03 Micron Technology, Inc. Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
US20070082508A1 (en) * 2005-10-11 2007-04-12 Chiang Tony P Methods for discretized processing and process sequence integration of regions of a substrate
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
US7462094B2 (en) * 2006-09-26 2008-12-09 Disco Corporation Wafer grinding method
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US7705430B2 (en) * 2005-04-27 2010-04-27 Disco Corporation Semiconductor wafer and processing method for same
US7871928B2 (en) * 2005-10-11 2011-01-18 Intermolecular, Inc. Methods for discretized processing of regions of a substrate
US20110111593A1 (en) * 2009-11-09 2011-05-12 Masahiro Kanno Pattern formation method, pattern formation system, and method for manufacturing semiconductor device
USD651991S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD651992S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD655256S1 (en) * 2010-08-17 2012-03-06 Sumitomo Electric Industries, Ltd. Semiconductor substrate
US8555492B2 (en) * 2009-12-30 2013-10-15 Harvatek Corporation Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach
US8865580B2 (en) * 2012-02-22 2014-10-21 Kabushiki Kaisha Toshiba Pattern forming method, semiconductor device manufacturing method, and coating apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
US8882917B1 (en) * 2009-12-31 2014-11-11 Intermolecular, Inc. Substrate processing including correction for deposition location
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3461537A (en) * 1965-11-23 1969-08-19 Telefunken Patent Separation of individual wafers of a semiconductor disc
US4630093A (en) * 1983-11-24 1986-12-16 Sumitomo Electric Industries, Ltd. Wafer of semiconductors
US5182233A (en) * 1989-08-02 1993-01-26 Kabushiki Kaisha Toshiba Compound semiconductor pellet, and method for dicing compound semiconductor wafer
US5314844A (en) * 1991-03-04 1994-05-24 Kabushiki Kaisha Toshiba Method for dicing a semiconductor wafer
US20020121915A1 (en) * 2001-03-05 2002-09-05 Agere Systems Guardian Corp. Automated pattern clustering detection for wafer probe maps
US20040259332A1 (en) * 2002-04-11 2004-12-23 Masateru Fukuoka Method for manufacturing semiconductor chip
US7115984B2 (en) * 2002-06-18 2006-10-03 Micron Technology, Inc. Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
US20040124413A1 (en) * 2002-12-26 2004-07-01 Kazuhisa Arai Wafer support plate
US20050170616A1 (en) * 2004-02-03 2005-08-04 Disco Corporation Wafer dividing method
US7705430B2 (en) * 2005-04-27 2010-04-27 Disco Corporation Semiconductor wafer and processing method for same
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
US7871928B2 (en) * 2005-10-11 2011-01-18 Intermolecular, Inc. Methods for discretized processing of regions of a substrate
US20070082508A1 (en) * 2005-10-11 2007-04-12 Chiang Tony P Methods for discretized processing and process sequence integration of regions of a substrate
US7462094B2 (en) * 2006-09-26 2008-12-09 Disco Corporation Wafer grinding method
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US20110111593A1 (en) * 2009-11-09 2011-05-12 Masahiro Kanno Pattern formation method, pattern formation system, and method for manufacturing semiconductor device
US8555492B2 (en) * 2009-12-30 2013-10-15 Harvatek Corporation Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach
US8882917B1 (en) * 2009-12-31 2014-11-11 Intermolecular, Inc. Substrate processing including correction for deposition location
USD651991S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD651992S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD655256S1 (en) * 2010-08-17 2012-03-06 Sumitomo Electric Industries, Ltd. Semiconductor substrate
US8865580B2 (en) * 2012-02-22 2014-10-21 Kabushiki Kaisha Toshiba Pattern forming method, semiconductor device manufacturing method, and coating apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD849422S1 (en) * 2014-12-17 2019-05-28 Ngk Insulators, Ltd. Composite substrate for acoustic wave device
USD897974S1 (en) * 2018-03-29 2020-10-06 Hamamatsu Photonics K.K. Semiconductor wafer
USD940131S1 (en) * 2019-07-29 2022-01-04 Samsung Display Co., Ltd. Display panel
USD958094S1 (en) 2019-07-29 2022-07-19 Samsung Display Co., Ltd. Display panel
USD966276S1 (en) 2019-07-29 2022-10-11 Samsung Display Co., Ltd. Display module for wearable device

Also Published As

Publication number Publication date
TWD187175S (zh) 2017-12-11
JP1563718S (cs) 2016-11-21

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