USD789311S1 - Pattern wafer - Google Patents
Pattern wafer Download PDFInfo
- Publication number
- USD789311S1 USD789311S1 US29/569,274 US201629569274F USD789311S US D789311 S1 USD789311 S1 US D789311S1 US 201629569274 F US201629569274 F US 201629569274F US D789311 S USD789311 S US D789311S
- Authority
- US
- United States
- Prior art keywords
- pattern wafer
- view
- wafer
- pattern
- taken along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-029187 | 2015-12-28 | ||
JPD2015-29187F JP1563719S (ja) | 2015-12-28 | 2015-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD789311S1 true USD789311S1 (en) | 2017-06-13 |
Family
ID=57321914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/569,274 Active USD789311S1 (en) | 2015-12-28 | 2016-06-24 | Pattern wafer |
Country Status (3)
Country | Link |
---|---|
US (1) | USD789311S1 (ja) |
JP (1) | JP1563719S (ja) |
TW (1) | TWD183002S (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD897974S1 (en) * | 2018-03-29 | 2020-10-06 | Hamamatsu Photonics K.K. | Semiconductor wafer |
USD940131S1 (en) * | 2019-07-29 | 2022-01-04 | Samsung Display Co., Ltd. | Display panel |
USD958094S1 (en) | 2019-07-29 | 2022-07-19 | Samsung Display Co., Ltd. | Display panel |
USD966276S1 (en) | 2019-07-29 | 2022-10-11 | Samsung Display Co., Ltd. | Display module for wearable device |
Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3461537A (en) * | 1965-11-23 | 1969-08-19 | Telefunken Patent | Separation of individual wafers of a semiconductor disc |
US4630093A (en) * | 1983-11-24 | 1986-12-16 | Sumitomo Electric Industries, Ltd. | Wafer of semiconductors |
US5182233A (en) * | 1989-08-02 | 1993-01-26 | Kabushiki Kaisha Toshiba | Compound semiconductor pellet, and method for dicing compound semiconductor wafer |
US5314844A (en) * | 1991-03-04 | 1994-05-24 | Kabushiki Kaisha Toshiba | Method for dicing a semiconductor wafer |
US20020121915A1 (en) * | 2001-03-05 | 2002-09-05 | Agere Systems Guardian Corp. | Automated pattern clustering detection for wafer probe maps |
US20040124413A1 (en) * | 2002-12-26 | 2004-07-01 | Kazuhisa Arai | Wafer support plate |
US20040259332A1 (en) * | 2002-04-11 | 2004-12-23 | Masateru Fukuoka | Method for manufacturing semiconductor chip |
US20050170616A1 (en) * | 2004-02-03 | 2005-08-04 | Disco Corporation | Wafer dividing method |
US7115984B2 (en) * | 2002-06-18 | 2006-10-03 | Micron Technology, Inc. | Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices |
US20070082508A1 (en) * | 2005-10-11 | 2007-04-12 | Chiang Tony P | Methods for discretized processing and process sequence integration of regions of a substrate |
USD552565S1 (en) * | 2005-09-08 | 2007-10-09 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
US7462094B2 (en) * | 2006-09-26 | 2008-12-09 | Disco Corporation | Wafer grinding method |
USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
US7705430B2 (en) * | 2005-04-27 | 2010-04-27 | Disco Corporation | Semiconductor wafer and processing method for same |
US7871928B2 (en) * | 2005-10-11 | 2011-01-18 | Intermolecular, Inc. | Methods for discretized processing of regions of a substrate |
US20110111593A1 (en) * | 2009-11-09 | 2011-05-12 | Masahiro Kanno | Pattern formation method, pattern formation system, and method for manufacturing semiconductor device |
USD651991S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
USD651992S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
USD655256S1 (en) * | 2010-08-17 | 2012-03-06 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
US8555492B2 (en) * | 2009-12-30 | 2013-10-15 | Harvatek Corporation | Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach |
US8865580B2 (en) * | 2012-02-22 | 2014-10-21 | Kabushiki Kaisha Toshiba | Pattern forming method, semiconductor device manufacturing method, and coating apparatus |
USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
US8882917B1 (en) * | 2009-12-31 | 2014-11-11 | Intermolecular, Inc. | Substrate processing including correction for deposition location |
USD720313S1 (en) * | 2014-06-16 | 2014-12-30 | Emcore Solar Power, Inc. | Semiconductor wafer with dicing positions for solar cell fabrication |
-
2015
- 2015-12-28 JP JPD2015-29187F patent/JP1563719S/ja active Active
-
2016
- 2016-06-24 US US29/569,274 patent/USD789311S1/en active Active
- 2016-06-24 TW TW105303661F patent/TWD183002S/zh unknown
Patent Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3461537A (en) * | 1965-11-23 | 1969-08-19 | Telefunken Patent | Separation of individual wafers of a semiconductor disc |
US4630093A (en) * | 1983-11-24 | 1986-12-16 | Sumitomo Electric Industries, Ltd. | Wafer of semiconductors |
US5182233A (en) * | 1989-08-02 | 1993-01-26 | Kabushiki Kaisha Toshiba | Compound semiconductor pellet, and method for dicing compound semiconductor wafer |
US5314844A (en) * | 1991-03-04 | 1994-05-24 | Kabushiki Kaisha Toshiba | Method for dicing a semiconductor wafer |
US20020121915A1 (en) * | 2001-03-05 | 2002-09-05 | Agere Systems Guardian Corp. | Automated pattern clustering detection for wafer probe maps |
US20040259332A1 (en) * | 2002-04-11 | 2004-12-23 | Masateru Fukuoka | Method for manufacturing semiconductor chip |
US7115984B2 (en) * | 2002-06-18 | 2006-10-03 | Micron Technology, Inc. | Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices |
US20040124413A1 (en) * | 2002-12-26 | 2004-07-01 | Kazuhisa Arai | Wafer support plate |
US20050170616A1 (en) * | 2004-02-03 | 2005-08-04 | Disco Corporation | Wafer dividing method |
US7705430B2 (en) * | 2005-04-27 | 2010-04-27 | Disco Corporation | Semiconductor wafer and processing method for same |
USD552565S1 (en) * | 2005-09-08 | 2007-10-09 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
US7871928B2 (en) * | 2005-10-11 | 2011-01-18 | Intermolecular, Inc. | Methods for discretized processing of regions of a substrate |
US20070082508A1 (en) * | 2005-10-11 | 2007-04-12 | Chiang Tony P | Methods for discretized processing and process sequence integration of regions of a substrate |
US7462094B2 (en) * | 2006-09-26 | 2008-12-09 | Disco Corporation | Wafer grinding method |
USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
US20110111593A1 (en) * | 2009-11-09 | 2011-05-12 | Masahiro Kanno | Pattern formation method, pattern formation system, and method for manufacturing semiconductor device |
US8555492B2 (en) * | 2009-12-30 | 2013-10-15 | Harvatek Corporation | Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach |
US8882917B1 (en) * | 2009-12-31 | 2014-11-11 | Intermolecular, Inc. | Substrate processing including correction for deposition location |
USD651991S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
USD651992S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
USD655256S1 (en) * | 2010-08-17 | 2012-03-06 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
US8865580B2 (en) * | 2012-02-22 | 2014-10-21 | Kabushiki Kaisha Toshiba | Pattern forming method, semiconductor device manufacturing method, and coating apparatus |
USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD720313S1 (en) * | 2014-06-16 | 2014-12-30 | Emcore Solar Power, Inc. | Semiconductor wafer with dicing positions for solar cell fabrication |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD897974S1 (en) * | 2018-03-29 | 2020-10-06 | Hamamatsu Photonics K.K. | Semiconductor wafer |
USD940131S1 (en) * | 2019-07-29 | 2022-01-04 | Samsung Display Co., Ltd. | Display panel |
USD958094S1 (en) | 2019-07-29 | 2022-07-19 | Samsung Display Co., Ltd. | Display panel |
USD966276S1 (en) | 2019-07-29 | 2022-10-11 | Samsung Display Co., Ltd. | Display module for wearable device |
Also Published As
Publication number | Publication date |
---|---|
TWD183002S (zh) | 2017-05-11 |
JP1563719S (ja) | 2016-11-21 |
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