USD737229S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD737229S1 USD737229S1 US29/481,535 US201429481535F USD737229S US D737229 S1 USD737229 S1 US D737229S1 US 201429481535 F US201429481535 F US 201429481535F US D737229 S USD737229 S US D737229S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- showing
- indicia
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken line showing is for illustrative purpose only and forms no part of the claimed design.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/481,535 USD737229S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD.2010-031446 | 2010-12-28 | ||
JP2010031447 | 2010-12-28 | ||
JP2010031448 | 2010-12-28 | ||
JPD.2010-031447 | 2010-12-28 | ||
JPD.2010-031448 | 2010-12-28 | ||
JP2010031446 | 2010-12-28 | ||
US29/389,545 USD701843S1 (en) | 2010-12-28 | 2011-04-13 | Semiconductor device |
US29/481,535 USD737229S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/389,545 Division USD701843S1 (en) | 2010-12-28 | 2011-04-13 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
USD737229S1 true USD737229S1 (en) | 2015-08-25 |
Family
ID=50349213
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/389,545 Active USD701843S1 (en) | 2010-12-28 | 2011-04-13 | Semiconductor device |
US29/481,536 Active USD737230S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
US29/481,535 Active USD737229S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/389,545 Active USD701843S1 (en) | 2010-12-28 | 2011-04-13 | Semiconductor device |
US29/481,536 Active USD737230S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (3) | USD701843S1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD761745S1 (en) * | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD793371S1 (en) * | 2015-10-26 | 2017-08-01 | Mitsubishi Electric Corporation | Antenna element |
USD793372S1 (en) * | 2015-10-26 | 2017-08-01 | Mitsubishi Electric Corporation | Antenna element |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD701843S1 (en) * | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
USD721047S1 (en) | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
TWD161478S (en) * | 2013-08-06 | 2014-07-01 | 璨圓光電股份有限公司 | Semiconductor light emitting device parts |
TWD161479S (en) * | 2013-08-06 | 2014-07-01 | 璨圓光電股份有限公司 | Semiconductor light emitting device part |
TWD164808S (en) * | 2013-08-06 | 2014-12-11 | 璨圓光電股份有限公司 | Semiconductor light emitting device parts |
JP1696315S (en) * | 2021-03-23 | 2021-10-04 | Power semiconductor device | |
USD1021831S1 (en) * | 2021-03-23 | 2024-04-09 | Rohm Co., Ltd. | Power semiconductor module |
USD1030686S1 (en) * | 2021-03-23 | 2024-06-11 | Rohm Co., Ltd. | Power semiconductor module |
Citations (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5447876A (en) * | 1993-11-19 | 1995-09-05 | Micrel, Inc. | Method of making a diamond shaped gate mesh for cellular MOS transistor array |
US5852315A (en) * | 1995-04-06 | 1998-12-22 | Ind Tech Res Inst | N-sided polygonal cell layout for multiple cell transistor |
US6184478B1 (en) * | 1998-09-30 | 2001-02-06 | Adtec Corporation | Printed wiring device with base layer having a grid pattern |
US6388292B1 (en) * | 1997-09-16 | 2002-05-14 | Winbond Electronics Corporation | Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering |
US20030136984A1 (en) * | 2002-01-21 | 2003-07-24 | Semiconductor Technology Academic Research Center | Semiconductor device |
US6713823B1 (en) * | 2002-03-08 | 2004-03-30 | Volterra Semiconductor Corporation | Conductive routings in integrated circuits |
US6897561B2 (en) * | 2003-06-06 | 2005-05-24 | Semiconductor Components Industries, Llc | Semiconductor power device having a diamond shaped metal interconnect scheme |
US6903460B2 (en) * | 2002-10-30 | 2005-06-07 | Denso Corporation | Semiconductor equipment |
US20050274977A1 (en) * | 2004-06-15 | 2005-12-15 | Kabushiki Kaisha Toshiba | Nitride semiconductor device |
US20060267030A1 (en) | 2002-04-24 | 2006-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing same |
US7166898B2 (en) * | 2002-12-20 | 2007-01-23 | Picor Corporation | Flip chip FET device |
USD574339S1 (en) | 2005-06-24 | 2008-08-05 | Nitto Denko Corporation | Pattern formed on the ground layer of a multilayer printed circuit board |
US20100000765A1 (en) | 2006-07-15 | 2010-01-07 | Sharp Kabushiki Kaisha | Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel |
US7663063B2 (en) * | 2006-12-22 | 2010-02-16 | Hon Hai Precision Industry Co., Ltd. | Circuit board with improved ground plane |
US20100132981A1 (en) | 2008-11-28 | 2010-06-03 | Kabushiki Kaisha Toshiba | Printed wiring board and electronic apparatus |
US20100163282A1 (en) | 2006-10-24 | 2010-07-01 | Hiroyoshi Tagi | Printed wiring board, method for manufacturing printed wiring board, and electric device |
US20100175912A1 (en) | 2009-01-15 | 2010-07-15 | Shih Juei-Tao | Ic package having colored pattern |
US20100200276A1 (en) | 2009-02-11 | 2010-08-12 | Broadcom Corporation | Implementations of twisted differential pairs on a circuit board |
US7981709B2 (en) | 2007-04-05 | 2011-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device and method for fabricating the same |
US20110186858A1 (en) * | 2009-08-04 | 2011-08-04 | John Roberts | Gallium Nitride Power Devices Using Island Topography |
US20110203834A1 (en) * | 2010-02-25 | 2011-08-25 | Hitachi, Ltd. | Printed circuit board |
US20120118614A1 (en) | 2009-11-20 | 2012-05-17 | Fujifilm Corporation | Conductive sheet, method for using conductive sheet, and capacitive touch panel |
US20120186855A1 (en) | 2011-01-24 | 2012-07-26 | Teh-Zheng Lin | Substrate of touch panel in manufacturing and the method for forming the same |
US20120205141A1 (en) | 2011-02-10 | 2012-08-16 | Fujikura Ltd. | Printed wiring board |
US8487377B2 (en) * | 2010-09-13 | 2013-07-16 | Green Solution Technology Co., Ltd. | MOSFET layout and structure with common source |
USD692843S1 (en) * | 2012-05-02 | 2013-11-05 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD701843S1 (en) * | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
US8791508B2 (en) * | 2010-04-13 | 2014-07-29 | Gan Systems Inc. | High density gallium nitride devices using island topology |
US8941012B2 (en) * | 2013-02-20 | 2015-01-27 | Novatek Microelectronics Corp. | Flexible circuit board and ground line structure |
-
2011
- 2011-04-13 US US29/389,545 patent/USD701843S1/en active Active
-
2014
- 2014-02-06 US US29/481,536 patent/USD737230S1/en active Active
- 2014-02-06 US US29/481,535 patent/USD737229S1/en active Active
Patent Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5447876A (en) * | 1993-11-19 | 1995-09-05 | Micrel, Inc. | Method of making a diamond shaped gate mesh for cellular MOS transistor array |
US5852315A (en) * | 1995-04-06 | 1998-12-22 | Ind Tech Res Inst | N-sided polygonal cell layout for multiple cell transistor |
US6388292B1 (en) * | 1997-09-16 | 2002-05-14 | Winbond Electronics Corporation | Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering |
US6184478B1 (en) * | 1998-09-30 | 2001-02-06 | Adtec Corporation | Printed wiring device with base layer having a grid pattern |
US20030136984A1 (en) * | 2002-01-21 | 2003-07-24 | Semiconductor Technology Academic Research Center | Semiconductor device |
US6713823B1 (en) * | 2002-03-08 | 2004-03-30 | Volterra Semiconductor Corporation | Conductive routings in integrated circuits |
US20060267030A1 (en) | 2002-04-24 | 2006-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing same |
US6903460B2 (en) * | 2002-10-30 | 2005-06-07 | Denso Corporation | Semiconductor equipment |
US7166898B2 (en) * | 2002-12-20 | 2007-01-23 | Picor Corporation | Flip chip FET device |
US6897561B2 (en) * | 2003-06-06 | 2005-05-24 | Semiconductor Components Industries, Llc | Semiconductor power device having a diamond shaped metal interconnect scheme |
US20050274977A1 (en) * | 2004-06-15 | 2005-12-15 | Kabushiki Kaisha Toshiba | Nitride semiconductor device |
USD574339S1 (en) | 2005-06-24 | 2008-08-05 | Nitto Denko Corporation | Pattern formed on the ground layer of a multilayer printed circuit board |
US20100000765A1 (en) | 2006-07-15 | 2010-01-07 | Sharp Kabushiki Kaisha | Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel |
US20100163282A1 (en) | 2006-10-24 | 2010-07-01 | Hiroyoshi Tagi | Printed wiring board, method for manufacturing printed wiring board, and electric device |
US7663063B2 (en) * | 2006-12-22 | 2010-02-16 | Hon Hai Precision Industry Co., Ltd. | Circuit board with improved ground plane |
US7981709B2 (en) | 2007-04-05 | 2011-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device and method for fabricating the same |
US8203151B2 (en) | 2007-04-05 | 2012-06-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device and method for fabricating the same |
US20100132981A1 (en) | 2008-11-28 | 2010-06-03 | Kabushiki Kaisha Toshiba | Printed wiring board and electronic apparatus |
US20100175912A1 (en) | 2009-01-15 | 2010-07-15 | Shih Juei-Tao | Ic package having colored pattern |
US20100200276A1 (en) | 2009-02-11 | 2010-08-12 | Broadcom Corporation | Implementations of twisted differential pairs on a circuit board |
US20110186858A1 (en) * | 2009-08-04 | 2011-08-04 | John Roberts | Gallium Nitride Power Devices Using Island Topography |
US20120118614A1 (en) | 2009-11-20 | 2012-05-17 | Fujifilm Corporation | Conductive sheet, method for using conductive sheet, and capacitive touch panel |
US20110203834A1 (en) * | 2010-02-25 | 2011-08-25 | Hitachi, Ltd. | Printed circuit board |
US8791508B2 (en) * | 2010-04-13 | 2014-07-29 | Gan Systems Inc. | High density gallium nitride devices using island topology |
US8487377B2 (en) * | 2010-09-13 | 2013-07-16 | Green Solution Technology Co., Ltd. | MOSFET layout and structure with common source |
USD701843S1 (en) * | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
US20120186855A1 (en) | 2011-01-24 | 2012-07-26 | Teh-Zheng Lin | Substrate of touch panel in manufacturing and the method for forming the same |
US20120205141A1 (en) | 2011-02-10 | 2012-08-16 | Fujikura Ltd. | Printed wiring board |
USD692843S1 (en) * | 2012-05-02 | 2013-11-05 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
US8941012B2 (en) * | 2013-02-20 | 2015-01-27 | Novatek Microelectronics Corp. | Flexible circuit board and ground line structure |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD761745S1 (en) * | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD793371S1 (en) * | 2015-10-26 | 2017-08-01 | Mitsubishi Electric Corporation | Antenna element |
USD793372S1 (en) * | 2015-10-26 | 2017-08-01 | Mitsubishi Electric Corporation | Antenna element |
Also Published As
Publication number | Publication date |
---|---|
USD737230S1 (en) | 2015-08-25 |
USD701843S1 (en) | 2014-04-01 |
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