USD737229S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

Info

Publication number
USD737229S1
USD737229S1 US29/481,535 US201429481535F USD737229S US D737229 S1 USD737229 S1 US D737229S1 US 201429481535 F US201429481535 F US 201429481535F US D737229 S USD737229 S US D737229S
Authority
US
United States
Prior art keywords
semiconductor device
view
showing
indicia
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/481,535
Inventor
Takeyoshi Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to US29/481,535 priority Critical patent/USD737229S1/en
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MASUDA, TAKEYOSHI
Application granted granted Critical
Publication of USD737229S1 publication Critical patent/USD737229S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a front view of a semiconductor device showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is an enlarged perspective view showing the area defined by indicia 7A and 7B of FIG. 1 thereof; and,
FIG. 8 is an enlarged perspective view showing the area defined by indicia 7A and 8C of FIG. 1 thereof.
The broken line showing is for illustrative purpose only and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/481,535 2010-12-28 2014-02-06 Semiconductor device Active USD737229S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/481,535 USD737229S1 (en) 2010-12-28 2014-02-06 Semiconductor device

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JPD.2010-031446 2010-12-28
JP2010031447 2010-12-28
JP2010031448 2010-12-28
JPD.2010-031447 2010-12-28
JPD.2010-031448 2010-12-28
JP2010031446 2010-12-28
US29/389,545 USD701843S1 (en) 2010-12-28 2011-04-13 Semiconductor device
US29/481,535 USD737229S1 (en) 2010-12-28 2014-02-06 Semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/389,545 Division USD701843S1 (en) 2010-12-28 2011-04-13 Semiconductor device

Publications (1)

Publication Number Publication Date
USD737229S1 true USD737229S1 (en) 2015-08-25

Family

ID=50349213

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/389,545 Active USD701843S1 (en) 2010-12-28 2011-04-13 Semiconductor device
US29/481,536 Active USD737230S1 (en) 2010-12-28 2014-02-06 Semiconductor device
US29/481,535 Active USD737229S1 (en) 2010-12-28 2014-02-06 Semiconductor device

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US29/389,545 Active USD701843S1 (en) 2010-12-28 2011-04-13 Semiconductor device
US29/481,536 Active USD737230S1 (en) 2010-12-28 2014-02-06 Semiconductor device

Country Status (1)

Country Link
US (3) USD701843S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD793371S1 (en) * 2015-10-26 2017-08-01 Mitsubishi Electric Corporation Antenna element
USD793372S1 (en) * 2015-10-26 2017-08-01 Mitsubishi Electric Corporation Antenna element

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD721047S1 (en) 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
TWD161478S (en) * 2013-08-06 2014-07-01 璨圓光電股份有限公司 Semiconductor light emitting device parts
TWD161479S (en) * 2013-08-06 2014-07-01 璨圓光電股份有限公司 Semiconductor light emitting device part
TWD164808S (en) * 2013-08-06 2014-12-11 璨圓光電股份有限公司 Semiconductor light emitting device parts
JP1696315S (en) * 2021-03-23 2021-10-04 Power semiconductor device
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
USD1030686S1 (en) * 2021-03-23 2024-06-11 Rohm Co., Ltd. Power semiconductor module

Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5447876A (en) * 1993-11-19 1995-09-05 Micrel, Inc. Method of making a diamond shaped gate mesh for cellular MOS transistor array
US5852315A (en) * 1995-04-06 1998-12-22 Ind Tech Res Inst N-sided polygonal cell layout for multiple cell transistor
US6184478B1 (en) * 1998-09-30 2001-02-06 Adtec Corporation Printed wiring device with base layer having a grid pattern
US6388292B1 (en) * 1997-09-16 2002-05-14 Winbond Electronics Corporation Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering
US20030136984A1 (en) * 2002-01-21 2003-07-24 Semiconductor Technology Academic Research Center Semiconductor device
US6713823B1 (en) * 2002-03-08 2004-03-30 Volterra Semiconductor Corporation Conductive routings in integrated circuits
US6897561B2 (en) * 2003-06-06 2005-05-24 Semiconductor Components Industries, Llc Semiconductor power device having a diamond shaped metal interconnect scheme
US6903460B2 (en) * 2002-10-30 2005-06-07 Denso Corporation Semiconductor equipment
US20050274977A1 (en) * 2004-06-15 2005-12-15 Kabushiki Kaisha Toshiba Nitride semiconductor device
US20060267030A1 (en) 2002-04-24 2006-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing same
US7166898B2 (en) * 2002-12-20 2007-01-23 Picor Corporation Flip chip FET device
USD574339S1 (en) 2005-06-24 2008-08-05 Nitto Denko Corporation Pattern formed on the ground layer of a multilayer printed circuit board
US20100000765A1 (en) 2006-07-15 2010-01-07 Sharp Kabushiki Kaisha Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel
US7663063B2 (en) * 2006-12-22 2010-02-16 Hon Hai Precision Industry Co., Ltd. Circuit board with improved ground plane
US20100132981A1 (en) 2008-11-28 2010-06-03 Kabushiki Kaisha Toshiba Printed wiring board and electronic apparatus
US20100163282A1 (en) 2006-10-24 2010-07-01 Hiroyoshi Tagi Printed wiring board, method for manufacturing printed wiring board, and electric device
US20100175912A1 (en) 2009-01-15 2010-07-15 Shih Juei-Tao Ic package having colored pattern
US20100200276A1 (en) 2009-02-11 2010-08-12 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US7981709B2 (en) 2007-04-05 2011-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device and method for fabricating the same
US20110186858A1 (en) * 2009-08-04 2011-08-04 John Roberts Gallium Nitride Power Devices Using Island Topography
US20110203834A1 (en) * 2010-02-25 2011-08-25 Hitachi, Ltd. Printed circuit board
US20120118614A1 (en) 2009-11-20 2012-05-17 Fujifilm Corporation Conductive sheet, method for using conductive sheet, and capacitive touch panel
US20120186855A1 (en) 2011-01-24 2012-07-26 Teh-Zheng Lin Substrate of touch panel in manufacturing and the method for forming the same
US20120205141A1 (en) 2011-02-10 2012-08-16 Fujikura Ltd. Printed wiring board
US8487377B2 (en) * 2010-09-13 2013-07-16 Green Solution Technology Co., Ltd. MOSFET layout and structure with common source
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
US8791508B2 (en) * 2010-04-13 2014-07-29 Gan Systems Inc. High density gallium nitride devices using island topology
US8941012B2 (en) * 2013-02-20 2015-01-27 Novatek Microelectronics Corp. Flexible circuit board and ground line structure

Patent Citations (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5447876A (en) * 1993-11-19 1995-09-05 Micrel, Inc. Method of making a diamond shaped gate mesh for cellular MOS transistor array
US5852315A (en) * 1995-04-06 1998-12-22 Ind Tech Res Inst N-sided polygonal cell layout for multiple cell transistor
US6388292B1 (en) * 1997-09-16 2002-05-14 Winbond Electronics Corporation Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering
US6184478B1 (en) * 1998-09-30 2001-02-06 Adtec Corporation Printed wiring device with base layer having a grid pattern
US20030136984A1 (en) * 2002-01-21 2003-07-24 Semiconductor Technology Academic Research Center Semiconductor device
US6713823B1 (en) * 2002-03-08 2004-03-30 Volterra Semiconductor Corporation Conductive routings in integrated circuits
US20060267030A1 (en) 2002-04-24 2006-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing same
US6903460B2 (en) * 2002-10-30 2005-06-07 Denso Corporation Semiconductor equipment
US7166898B2 (en) * 2002-12-20 2007-01-23 Picor Corporation Flip chip FET device
US6897561B2 (en) * 2003-06-06 2005-05-24 Semiconductor Components Industries, Llc Semiconductor power device having a diamond shaped metal interconnect scheme
US20050274977A1 (en) * 2004-06-15 2005-12-15 Kabushiki Kaisha Toshiba Nitride semiconductor device
USD574339S1 (en) 2005-06-24 2008-08-05 Nitto Denko Corporation Pattern formed on the ground layer of a multilayer printed circuit board
US20100000765A1 (en) 2006-07-15 2010-01-07 Sharp Kabushiki Kaisha Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel
US20100163282A1 (en) 2006-10-24 2010-07-01 Hiroyoshi Tagi Printed wiring board, method for manufacturing printed wiring board, and electric device
US7663063B2 (en) * 2006-12-22 2010-02-16 Hon Hai Precision Industry Co., Ltd. Circuit board with improved ground plane
US7981709B2 (en) 2007-04-05 2011-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device and method for fabricating the same
US8203151B2 (en) 2007-04-05 2012-06-19 Sumitomo Electric Industries, Ltd. Semiconductor device and method for fabricating the same
US20100132981A1 (en) 2008-11-28 2010-06-03 Kabushiki Kaisha Toshiba Printed wiring board and electronic apparatus
US20100175912A1 (en) 2009-01-15 2010-07-15 Shih Juei-Tao Ic package having colored pattern
US20100200276A1 (en) 2009-02-11 2010-08-12 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US20110186858A1 (en) * 2009-08-04 2011-08-04 John Roberts Gallium Nitride Power Devices Using Island Topography
US20120118614A1 (en) 2009-11-20 2012-05-17 Fujifilm Corporation Conductive sheet, method for using conductive sheet, and capacitive touch panel
US20110203834A1 (en) * 2010-02-25 2011-08-25 Hitachi, Ltd. Printed circuit board
US8791508B2 (en) * 2010-04-13 2014-07-29 Gan Systems Inc. High density gallium nitride devices using island topology
US8487377B2 (en) * 2010-09-13 2013-07-16 Green Solution Technology Co., Ltd. MOSFET layout and structure with common source
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
US20120186855A1 (en) 2011-01-24 2012-07-26 Teh-Zheng Lin Substrate of touch panel in manufacturing and the method for forming the same
US20120205141A1 (en) 2011-02-10 2012-08-16 Fujikura Ltd. Printed wiring board
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
US8941012B2 (en) * 2013-02-20 2015-01-27 Novatek Microelectronics Corp. Flexible circuit board and ground line structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD793371S1 (en) * 2015-10-26 2017-08-01 Mitsubishi Electric Corporation Antenna element
USD793372S1 (en) * 2015-10-26 2017-08-01 Mitsubishi Electric Corporation Antenna element

Also Published As

Publication number Publication date
USD737230S1 (en) 2015-08-25
USD701843S1 (en) 2014-04-01

Similar Documents

Publication Publication Date Title
USD648290S1 (en) Semiconductor device
USD737230S1 (en) Semiconductor device
USD717254S1 (en) Semiconductor device
USD717256S1 (en) Semiconductor device
USD719113S1 (en) Semiconductor device
USD636768S1 (en) Electronic device
USD682829S1 (en) Integrated access device
USD648336S1 (en) Display device
USD632401S1 (en) Anti-thumb sucking device
USD689483S1 (en) Integrated access device
USD649135S1 (en) Infant data collection device
USD679208S1 (en) Scale
USD676606S1 (en) Exfoliation device
USD635683S1 (en) Teat
USD677888S1 (en) Case for electronic device
USD692843S1 (en) Semiconductor device
USD624524S1 (en) Recording device
USD678501S1 (en) Aspirator
USD725403S1 (en) Sensor
USD725809S1 (en) Illuminating device
USD680887S1 (en) Marking device
USD651720S1 (en) Medical immunoassay device
USD838544S1 (en) Venturi device
USD640378S1 (en) Medical immunoassay device
USD640337S1 (en) Fitness device