USD730304S1 - Substrate for an electronic circuit - Google Patents

Substrate for an electronic circuit Download PDF

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Publication number
USD730304S1
USD730304S1 US29/500,867 US201429500867F USD730304S US D730304 S1 USD730304 S1 US D730304S1 US 201429500867 F US201429500867 F US 201429500867F US D730304 S USD730304 S US D730304S
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United States
Prior art keywords
electronic circuit
substrate
view
elevational view
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US29/500,867
Inventor
Manabu Matsumoto
Isao Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATSUMOTO, MANABU, OZAWA, ISAO
Application granted granted Critical
Publication of USD730304S1 publication Critical patent/USD730304S1/en
Assigned to TOSHIBA MEMORY CORPORATION reassignment TOSHIBA MEMORY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KABUSHIKI KAISHA TOSHIBA
Assigned to KIOXIA CORPORATION reassignment KIOXIA CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: TOSHIBA MEMORY CORPORATION
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Description

The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application with color drawings(s) will be provided by the Office upon request and payment of the necessary fee.
FIG. 1 is a perspective view of a substrate for an electronic circuit showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view, a left side elevational view being a mirror image thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The black circles shown in FIGS. 2 and 4 are flat on the surface of the electronic circuit.
The even dashed broken lines shown in the drawings represent portions of the substrate for an electronic circuit that form no part of the claimed design. The dashed-dot-dashed broken lines define the boundaries of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a substrate for an electronic circuit, as shown and described.
US29/500,867 2014-05-15 2014-08-29 Substrate for an electronic circuit Active USD730304S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2014-10413F JP1519750S (en) 2014-05-15 2014-05-15
JP2014-010413 2014-05-15

Publications (1)

Publication Number Publication Date
USD730304S1 true USD730304S1 (en) 2015-05-26

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ID=53176777

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US29/500,867 Active USD730304S1 (en) 2014-05-15 2014-08-29 Substrate for an electronic circuit

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US (1) USD730304S1 (en)
JP (1) JP1519750S (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD770991S1 (en) * 2013-11-05 2016-11-08 Nok Corporation Integrated circuit tag
USD776801S1 (en) * 2014-06-24 2017-01-17 Kobe Steel, Ltd Heat exchanger tube
USD780184S1 (en) * 2013-03-13 2017-02-28 Nagrastar Llc Smart card interface
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787457S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD792410S1 (en) * 2013-03-13 2017-07-18 Nagrastar Llc Smart card interface
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD840404S1 (en) 2013-03-13 2019-02-12 Nagrastar, Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD942974S1 (en) * 2018-11-20 2022-02-08 Thales Dis Ais Deutschland Gmbh Cellular module

Citations (17)

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US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
USD264963S (en) * 1979-06-01 1982-06-15 Perception Electronics, Inc. Component mounting plate for a PC board indicator and control device
US20020027762A1 (en) * 1998-09-29 2002-03-07 Shinji Yamaguchi Electrostatic chuck
USD459706S1 (en) 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
US6500059B2 (en) * 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
US20040179323A1 (en) * 2003-03-11 2004-09-16 Alon Litman Electrostatic chuck for wafer metrology and inspection equipment
USD526972S1 (en) * 2004-10-14 2006-08-22 Toshiba Lighting & Technology Corporation Light emitting diode module
USD531139S1 (en) * 2004-10-14 2006-10-31 Toshiba Lighting & Technology Corporation Light emitting diode module
USD637193S1 (en) 2010-11-19 2011-05-03 Apple Inc. Electronic device
US8177993B2 (en) * 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
USD670917S1 (en) * 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD686175S1 (en) * 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) * 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD702445S1 (en) * 2012-05-11 2014-04-15 Columbia Sportswear North America, Inc. Printed cooling material

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
USD264963S (en) * 1979-06-01 1982-06-15 Perception Electronics, Inc. Component mounting plate for a PC board indicator and control device
US20020027762A1 (en) * 1998-09-29 2002-03-07 Shinji Yamaguchi Electrostatic chuck
US6500059B2 (en) * 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
USD459706S1 (en) 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD471524S1 (en) 2001-04-27 2003-03-11 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
US20040179323A1 (en) * 2003-03-11 2004-09-16 Alon Litman Electrostatic chuck for wafer metrology and inspection equipment
USD531139S1 (en) * 2004-10-14 2006-10-31 Toshiba Lighting & Technology Corporation Light emitting diode module
USD526972S1 (en) * 2004-10-14 2006-08-22 Toshiba Lighting & Technology Corporation Light emitting diode module
US8177993B2 (en) * 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD704155S1 (en) * 2010-08-19 2014-05-06 Epistar Corporation Wafer carrier
USD637193S1 (en) 2010-11-19 2011-05-03 Apple Inc. Electronic device
USD670917S1 (en) * 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD686175S1 (en) * 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) * 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD702445S1 (en) * 2012-05-11 2014-04-15 Columbia Sportswear North America, Inc. Printed cooling material
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD780184S1 (en) * 2013-03-13 2017-02-28 Nagrastar Llc Smart card interface
USD840404S1 (en) 2013-03-13 2019-02-12 Nagrastar, Llc Smart card interface
USD792411S1 (en) * 2013-03-13 2017-07-18 Nagrastar Llc Smart card interface
USD792410S1 (en) * 2013-03-13 2017-07-18 Nagrastar Llc Smart card interface
USD949864S1 (en) * 2013-03-13 2022-04-26 Nagrastar Llc Smart card interface
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD942406S1 (en) 2013-10-17 2022-02-01 Vicor Corporation Electric terminal
USD775092S1 (en) 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD834548S1 (en) 2013-10-17 2018-11-27 Vlt, Inc. Electric terminal
USD877708S1 (en) 2013-10-17 2020-03-10 Vlt, Inc. Electrical terminal
USD775093S1 (en) 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD798249S1 (en) 2013-10-17 2017-09-26 Vlt, Inc. Electric terminal
USD770991S1 (en) * 2013-11-05 2016-11-08 Nok Corporation Integrated circuit tag
USD778852S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778851S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778850S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD776801S1 (en) * 2014-06-24 2017-01-17 Kobe Steel, Ltd Heat exchanger tube
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787457S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD904355S1 (en) 2015-12-11 2020-12-08 Gemalto M2M Gmbh Radio module
USD942974S1 (en) * 2018-11-20 2022-02-08 Thales Dis Ais Deutschland Gmbh Cellular module
USD1054404S1 (en) 2018-11-20 2024-12-17 Kontron Europe Gmbh Cellular module
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937233S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device

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JP1519750S (en) 2015-03-23

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