USD722575S1 - Housing for electronic modules with cooling fins - Google Patents

Housing for electronic modules with cooling fins Download PDF

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Publication number
USD722575S1
USD722575S1 US29/478,925 US201429478925F USD722575S US D722575 S1 USD722575 S1 US D722575S1 US 201429478925 F US201429478925 F US 201429478925F US D722575 S USD722575 S US D722575S
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United States
Prior art keywords
housing
cooling fins
electronic modules
modules
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/478,925
Inventor
Martin Zimmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Liebherr Electronics and Drives GmbH
Original Assignee
Liebherr Elektronik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Assigned to LIEBHERR-ELEKTRONIK GMBH reassignment LIEBHERR-ELEKTRONIK GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ZIMMER, MARTIN
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FIG. 1 is a front view of a design for a housing for electronic modules with cooling fins according to the present disclosure.
FIG. 2 is a back view of the housing for electronic modules with cooling fins of FIG. 1.
FIG. 3 is a left view of the housing for electronic modules with cooling fins of FIG. 1.
FIG. 4 is a right view of the housing for electronic modules with cooling fins of FIG. 1.
FIG. 5 is a top view of the housing for electronic modules with cooling fins of FIG. 1.
FIG. 6 is a bottom view of the housing for electronic modules with cooling fins of FIG. 1; and,
FIG. 7 is a perspective view of the housing for electronic modules with cooling fins of FIG. 1.
The solid lines in FIGS. 1-7 illustrate a housing for electronic modules with cooling fins according to the present disclosure. The broken lines form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a housing for electronic modules with cooling fins, as shown and described.
US29/478,925 2013-07-12 2014-01-09 Housing for electronic modules with cooling fins Active USD722575S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EM22733910000 2013-07-12
EP2273391 2013-07-12

Publications (1)

Publication Number Publication Date
USD722575S1 true USD722575S1 (en) 2015-02-17

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US29/478,927 Active USD722577S1 (en) 2013-07-12 2014-01-09 Housing for electronic modules with cooling fins
US29/478,925 Active USD722575S1 (en) 2013-07-12 2014-01-09 Housing for electronic modules with cooling fins
US29/478,926 Active USD722576S1 (en) 2013-07-12 2014-01-09 Housing for electronic modules with cooling fins

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Application Number Title Priority Date Filing Date
US29/478,927 Active USD722577S1 (en) 2013-07-12 2014-01-09 Housing for electronic modules with cooling fins

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/478,926 Active USD722576S1 (en) 2013-07-12 2014-01-09 Housing for electronic modules with cooling fins

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US (3) USD722577S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD965541S1 (en) * 2022-01-19 2022-10-04 Yizhou Wang Heat sink
USD1024062S1 (en) * 2021-06-24 2024-04-23 Aptiv Technologies AG Electronic module housing
USD1042447S1 (en) * 2020-12-21 2024-09-17 Aptiv Technologies AG Electronic module housing
USD1080567S1 (en) * 2022-01-24 2025-06-24 Tata Consultancy Services Limited Integrated heat sink

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1541784S (en) * 2015-01-08 2016-01-18
USD774472S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD793350S1 (en) * 2015-07-01 2017-08-01 Denso International America, Inc. Heat sink
USD812022S1 (en) * 2015-09-12 2018-03-06 Ebullient, Llc Multi-chamber heat sink module
USD773409S1 (en) * 2015-09-16 2016-12-06 Ebullient, Llc Multi-chamber heat sink module
USD850487S1 (en) * 2016-08-31 2019-06-04 Sevcon Limited Electric motor controller
USD854497S1 (en) * 2016-12-05 2019-07-23 Delta-Q Technologies Corp. Battery charger
TWD191875S (en) * 2017-11-10 2018-07-21 雙鴻科技股份有限公司 A water cooling device
TWD195985S (en) * 2018-02-06 2019-02-11 雙鴻科技股份有限公司 A water cooling device
USD927438S1 (en) * 2019-09-09 2021-08-10 Thales Alenia Space France Housing for electronic modules
USD1004541S1 (en) * 2020-05-05 2023-11-14 Delta-Q Technologies Corp. Battery charger
USD1022880S1 (en) 2021-11-29 2024-04-16 Delta-Q Technologies Corp. Battery charger
USD1051824S1 (en) 2022-07-26 2024-11-19 Delta-Q Technologies Corp. Battery charger
USD1107664S1 (en) * 2024-07-15 2025-12-30 Nucular Limited Motor controller

Citations (16)

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Publication number Priority date Publication date Assignee Title
US3592260A (en) * 1969-12-05 1971-07-13 Espey Mfg & Electronics Corp Heat exchanger with inner guide strip
USD368253S (en) * 1993-07-19 1996-03-26 Rockford Corporation Heat sink
USD403666S (en) * 1998-04-01 1999-01-05 Rockford Corporation Heat sink
US6144092A (en) * 1998-02-02 2000-11-07 Delco Electronics Corp. Electronic power device heatsink clamping system
USD449587S1 (en) * 2001-02-28 2001-10-23 Andrew Corporation Heat sink
US6313399B1 (en) * 1997-11-21 2001-11-06 Muuntolaite Oy Cooling element for an unevenly distributed heat load
US6326761B1 (en) * 1999-03-25 2001-12-04 Mannesmann Sachs Ag Power electronics device for controlling an electric machine
US6421239B1 (en) * 2000-06-06 2002-07-16 Chaun-Choung Technology Corp. Integral heat dissipating device
USD483019S1 (en) * 2002-12-10 2003-12-02 Vanner, Inc. Heat sink for electronic equipment
US6671177B1 (en) * 2002-10-25 2003-12-30 Evga.Com Corporation Graphics card apparatus with improved heat dissipation
US6778390B2 (en) * 2001-05-15 2004-08-17 Nvidia Corporation High-performance heat sink for printed circuit boards
US6847525B1 (en) * 2002-05-24 2005-01-25 Unisys Corporation Forced convection heat sink system with fluid vector control
US20080291632A1 (en) * 2007-05-25 2008-11-27 Sma Technologie Ag Inverter casing
USD627316S1 (en) * 2009-01-07 2010-11-16 Graco Minnesota Inc. Heater board enclosure
US20110051370A1 (en) * 2009-08-25 2011-03-03 Ziehl-Abegg Ag Electronics Unit with Cooling Fins
US20120103589A1 (en) * 2010-10-28 2012-05-03 Samsung Electro-Mechanics Co., Ltd. Heat dissipation device for power conversion module

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3592260A (en) * 1969-12-05 1971-07-13 Espey Mfg & Electronics Corp Heat exchanger with inner guide strip
USD368253S (en) * 1993-07-19 1996-03-26 Rockford Corporation Heat sink
US6313399B1 (en) * 1997-11-21 2001-11-06 Muuntolaite Oy Cooling element for an unevenly distributed heat load
US6144092A (en) * 1998-02-02 2000-11-07 Delco Electronics Corp. Electronic power device heatsink clamping system
USD403666S (en) * 1998-04-01 1999-01-05 Rockford Corporation Heat sink
US6326761B1 (en) * 1999-03-25 2001-12-04 Mannesmann Sachs Ag Power electronics device for controlling an electric machine
US6421239B1 (en) * 2000-06-06 2002-07-16 Chaun-Choung Technology Corp. Integral heat dissipating device
USD449587S1 (en) * 2001-02-28 2001-10-23 Andrew Corporation Heat sink
US6778390B2 (en) * 2001-05-15 2004-08-17 Nvidia Corporation High-performance heat sink for printed circuit boards
US6847525B1 (en) * 2002-05-24 2005-01-25 Unisys Corporation Forced convection heat sink system with fluid vector control
US6671177B1 (en) * 2002-10-25 2003-12-30 Evga.Com Corporation Graphics card apparatus with improved heat dissipation
USD483019S1 (en) * 2002-12-10 2003-12-02 Vanner, Inc. Heat sink for electronic equipment
US20080291632A1 (en) * 2007-05-25 2008-11-27 Sma Technologie Ag Inverter casing
USD627316S1 (en) * 2009-01-07 2010-11-16 Graco Minnesota Inc. Heater board enclosure
US20110051370A1 (en) * 2009-08-25 2011-03-03 Ziehl-Abegg Ag Electronics Unit with Cooling Fins
US20120103589A1 (en) * 2010-10-28 2012-05-03 Samsung Electro-Mechanics Co., Ltd. Heat dissipation device for power conversion module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1042447S1 (en) * 2020-12-21 2024-09-17 Aptiv Technologies AG Electronic module housing
USD1024062S1 (en) * 2021-06-24 2024-04-23 Aptiv Technologies AG Electronic module housing
USD965541S1 (en) * 2022-01-19 2022-10-04 Yizhou Wang Heat sink
USD1080567S1 (en) * 2022-01-24 2025-06-24 Tata Consultancy Services Limited Integrated heat sink

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Publication number Publication date
USD722576S1 (en) 2015-02-17
USD722577S1 (en) 2015-02-17

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