TWD195985S - A water cooling device - Google Patents
A water cooling deviceInfo
- Publication number
- TWD195985S TWD195985S TW107300755F TW107300755F TWD195985S TW D195985 S TWD195985 S TW D195985S TW 107300755 F TW107300755 F TW 107300755F TW 107300755 F TW107300755 F TW 107300755F TW D195985 S TWD195985 S TW D195985S
- Authority
- TW
- Taiwan
- Prior art keywords
- water
- cooling
- case
- radiator
- design
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title abstract 11
- 230000017525 heat dissipation Effects 0.000 abstract 7
- 239000007788 liquid Substances 0.000 abstract 2
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
Abstract
【物品用途】;本案係有關於一種水冷散熱裝置,特別是關於一種運用液體吸收物體熱能的水冷散熱裝置。;【設計說明】;本案整體設計係為一種外型輕巧並具有薄型體積之水冷散熱裝置。;本案整體設計中主要元件的基本線條,係為:一水冷排,至少包含左右兩個水箱、兩側流道結構、一分流槽與兩個水冷排連通接口;另,具有兩個水冷頭連通接口之一水冷頭、一水泵、以及用以提供該水冷頭結合鎖固於該冷排之一鎖固片。;接著說明,該兩側流道結構與該兩個水箱分別位於該分流槽之左側邊以及右側邊,並連通於該分流槽;再者,該兩個水冷排連通接口中之一者,係與該兩個水冷頭連通接口中之一者直接相互套接,中間無任何連通管;另外,該兩個水冷排連通接口中之另一者,連通於該水泵之一側,且該水泵之另一側再與該兩個水冷頭連通接口中之另一者相連通,從而共同形成該水冷散熱裝置的線條設計,且如此一來,一散熱液(圖未揭示)即可流通於該水冷排、該水泵與該水冷頭之間,以形成一循環式水冷散熱系統。;請參閱本案之各立體圖、前視圖及後視圖,由此些圖示中可得知,該分流槽位於該兩側流道結構與該兩個水箱之間,且藉由該兩側流道結構之寬度與高度的不對等設計,以使得該分流槽與該兩流道結構的比例呈現線條上的不對稱美感。;其中,前述兩個水冷排連通接口中之另一者連通於該水泵之一側的連通管,恰好被設置於藉由前述兩側流道結構之寬度與高度的不對等設計所讓出的空間內,以使整體空間結構呈現出一種精實、俐落,又兼具平衡視覺的線條美學。;其次,請參閱本案之左側視圖、右側視圖、俯視圖以及仰視圖,由此些圖示中可得知,前述兩個水冷排連通接口中之一者與前述兩個水冷頭連通接口中之一者直接相互套接,中間無設置任何連通管,而使該水冷頭緊貼著該水冷排,再加上該水泵位於該水冷排與該水冷頭之間的空間有效利用與安排,如此,即可使得整體水冷散熱裝置的體積呈現出扁平輕薄的簡約設計。;再則,本案另提供兩個參考圖,以輔助說明本案線條的特性;其中,此些參考圖用以表示該水冷頭、該鎖固片、該水冷排與該水泵之間的組裝關係與呈現出來的線條特徵。;綜上所述,本案之整體設計,確實可呈現出一種兼具精簡體積的實用性與時尚美觀的線條美感效果,故本案乃完全迥異於習知設計之巢臼,應極符合設計專利之申請要件,蓋殆無疑義;為此,懇祈 鈞局惠予審查並賜准其專利,實感德便。[Use of article]; This case relates to a water-cooling heat dissipation device, especially a water-cooling heat dissipation device that uses liquid to absorb the heat energy of an object. ;[Design Description];The overall design of this case is a water-cooled heat dissipation device that is lightweight and thin in size. ;The basic lines of the main components in the overall design of this case are: a water-cooled radiator, which includes at least two left and right water tanks, flow channel structures on both sides, a shunt and two water-cooled radiator connecting interfaces; in addition, there are two water-cooled heads connected The interface includes a water-cooling head, a water pump, and a locking piece for coupling and locking the water-cooling head to the radiator. ; Next, the flow channel structure on both sides and the two water tanks are located on the left side and the right side of the shunt trough respectively, and are connected to the shunt trough; Furthermore, one of the two water-cooling radiator connection interfaces is One of the two water-cooling head connection interfaces is directly connected to each other without any connecting pipe in between; in addition, the other of the two water-cooling radiator connection interfaces is connected to one side of the water pump, and the water pump The other side is connected to the other one of the two water-cooling head communication interfaces, thereby jointly forming the line design of the water-cooling heat dissipation device, and in this way, a heat dissipation liquid (not shown in the figure) can flow through the water-cooling device. between the water pump and the water-cooling head to form a circulating water-cooling heat dissipation system. ; Please refer to the three-dimensional views, front views and rear views of this case. From these figures, we can know that the diverter is located between the flow channel structure on both sides and the two water tanks, and through the flow channels on both sides The unequal width and height of the structure are designed so that the proportions of the shunt trough and the two-flow channel structure present an aesthetic asymmetry in lines. ; Among them, the other one of the two water-cooling radiator communication interfaces is connected to the communication pipe on one side of the water pump, and is exactly located in the space given by the unequal design of the width and height of the flow channel structure on both sides. In the space, the overall spatial structure presents a line aesthetic that is precise, neat and visually balanced. ; Secondly, please refer to the left view, right view, top view and bottom view of this case. From these illustrations, we can know that one of the two water-cooling radiator connection interfaces is connected to one of the two water-cooling head connection interfaces. The two are directly connected to each other without any connecting pipe in the middle, so that the water-cooling head is close to the water-cooling radiator. In addition, the space between the water-cooling radiator and the water-cooling head of the water pump is effectively utilized and arranged. In this way, that is It can make the volume of the overall water-cooling heat dissipation device present a flat, thin and simple design. ;Furthermore, this case provides two additional reference drawings to assist in explaining the characteristics of the lines in this case; among them, these reference drawings are used to represent the assembly relationship and relationship between the water-cooling head, the locking piece, the water-cooling radiator and the water pump. The line characteristics presented. ; To sum up, the overall design of this case can indeed present an aesthetic effect that combines practicality with streamlined volume and fashionable and beautiful lines. Therefore, this case is completely different from the conventional design and should be very consistent with the design patent. There is absolutely no doubt about the application requirements; for this reason, I sincerely pray that the Jun Bureau will review it and grant its patent, which is really helpful.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107300755F TWD195985S (en) | 2018-02-06 | 2018-02-06 | A water cooling device |
| US29/636,557 USD848961S1 (en) | 2018-02-06 | 2018-02-09 | Water cooling device |
| US29/647,821 USD848962S1 (en) | 2018-02-06 | 2018-05-16 | Water cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107300755F TWD195985S (en) | 2018-02-06 | 2018-02-06 | A water cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD195985S true TWD195985S (en) | 2019-02-11 |
Family
ID=66479751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107300755F TWD195985S (en) | 2018-02-06 | 2018-02-06 | A water cooling device |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | USD848961S1 (en) |
| TW (1) | TWD195985S (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD976851S1 (en) * | 2021-05-31 | 2023-01-31 | EKWB d.o.o. | Radiator |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD574790S1 (en) * | 2006-01-07 | 2008-08-12 | Apack Inc. | Radiator for electric equipment part |
| US20070246205A1 (en) * | 2006-04-25 | 2007-10-25 | Shn-Yung Lee | Heat dispensing device with radially flowing coolant |
| US8136576B2 (en) * | 2006-06-22 | 2012-03-20 | Nuventix, Inc. | Vibration isolation system for synthetic jet devices |
| TWD121164S1 (en) * | 2007-02-16 | 2008-01-21 | 建準電機工業股份有限公司 | Blower type micro heat dissipation module |
| WO2008109805A2 (en) * | 2007-03-07 | 2008-09-12 | Asetek Usa Inc. | Hybrid liquid-air cooled graphics display adapter |
| US20120103575A1 (en) * | 2010-11-03 | 2012-05-03 | Hon Hai Precision Industry Co., Ltd. | Cooling device |
| KR101294077B1 (en) * | 2011-12-09 | 2013-08-07 | 현대자동차주식회사 | Cooling system power conversion device |
| US20140008039A1 (en) * | 2012-07-03 | 2014-01-09 | Antec, Inc. | Liquid-cooling heat dissipation apparatus for electronic elements |
| USD694199S1 (en) * | 2012-11-30 | 2013-11-26 | Foxconn Technology Co., Ltd. | Heat dissipating device |
| USD722576S1 (en) * | 2013-07-12 | 2015-02-17 | Liebherr-Elektronik Gmbh | Housing for electronic modules with cooling fins |
| USD777123S1 (en) * | 2014-07-24 | 2017-01-24 | Allen-Vanguard Corporation | Mezzanine board |
| US20170186667A1 (en) * | 2015-12-26 | 2017-06-29 | Intel Corporation | Cooling of electronics using folded foil microchannels |
| CN107148194B (en) * | 2016-03-01 | 2019-12-27 | 双鸿科技股份有限公司 | Water-cooling heat dissipation device |
| CN106249827B (en) * | 2016-07-25 | 2023-04-28 | 东莞市真品科技有限公司 | CPU water pump radiator |
| JP6281622B1 (en) * | 2016-10-24 | 2018-02-21 | 日本電気株式会社 | Cooling device, mounting method, cooling structure |
| US10015909B1 (en) * | 2017-01-04 | 2018-07-03 | Evga Corporation | Fixing device for interface card fluid-cooling structure |
| US20180269131A1 (en) * | 2017-03-20 | 2018-09-20 | Facebook, Inc. | Component cooling system |
-
2018
- 2018-02-06 TW TW107300755F patent/TWD195985S/en unknown
- 2018-02-09 US US29/636,557 patent/USD848961S1/en active Active
- 2018-05-16 US US29/647,821 patent/USD848962S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD848962S1 (en) | 2019-05-21 |
| USD848961S1 (en) | 2019-05-21 |
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