TWD191875S - A water cooling device - Google Patents
A water cooling deviceInfo
- Publication number
- TWD191875S TWD191875S TW106306602F TW106306602F TWD191875S TW D191875 S TWD191875 S TW D191875S TW 106306602 F TW106306602 F TW 106306602F TW 106306602 F TW106306602 F TW 106306602F TW D191875 S TWD191875 S TW D191875S
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- design
- case
- flow channel
- water
- Prior art date
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title abstract description 17
- 238000001816 cooling Methods 0.000 title abstract description 14
- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 230000000007 visual effect Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract description 2
- 230000003796 beauty Effects 0.000 abstract 2
- 239000004570 mortar (masonry) Substances 0.000 abstract 1
Abstract
【物品用途】;本案係有關於一種水冷散熱裝置,特別是關於一種運用液體吸收物體熱能的水冷散熱裝置。;【設計說明】;本案整體設計係為一種外型輕巧並具有薄型水箱之水冷散熱裝置。;本案整體設計的基本線條,係為一水冷排,至少包含兩薄型水箱、兩流道結構以及一分流槽,且該兩薄型水箱分別位於該分流槽之左側邊以及右側邊,並藉由該兩流道結構連通於該分流槽,從而共同形成該水冷散熱裝置的線條設計。;請參閱本案之立體圖(代表圖)、前視圖及後視圖,由前視圖以及後視圖可得知,該分流槽位於該兩流道結構以及該兩薄型水箱之間,且可藉由該兩流道結構的長度設計不同,而使該分流槽與該兩流道結構的比例呈現不對稱的結構設計,從而具有線條獨特且簡約平衡的美感。其中,藉由該兩流道結構長度設計的不同,而使兩流道結構具有不同形狀的散熱表面,從而得以豐富視覺上的結構設計。;其次,請參閱本案之左視圖以及右視圖,由左視圖以及右視圖可得知,位於該分流槽之左右側邊的該兩薄型水箱,對應其厚度與寬度的尺寸係呈現一扁平圓角的長方形狀,從而得知該兩薄型水箱係為扁平輕薄的結構設計,在視覺以及應用上更符合現代美感的設計。;再者,請參閱本案之俯視圖以及仰視圖,由俯視圖以及仰視圖可得知,位於該分流槽之左側邊的該流道結構,其長度設計小於位於該分流槽之右側邊的該另一流道結構,而使該分流槽偏向位於整體水冷散熱裝置的左側邊,以使該兩流道結構呈現左右不對稱,而得以豐富視覺上的美感。;如此一來,本案水冷散熱裝置之整體外緣係為一扁平且趨近於長方形狀的結構設計,且藉由較大的散熱表面又扁平之該兩流道結構以及該兩薄型水箱的設計,以提升整體水冷散熱裝置的散熱效率;是以,本案確實可呈現出一種兼具實用性與時尚美觀的線條美感效果。;綜上所述,本案水冷散熱裝置之整體設計,線條十分簡約並兼具有不對稱但平衡的構成與散熱效率的美感,故本案乃完全迥異於習知設計之巢臼,應極符合設計專利之申請要件,蓋殆無疑義;為此,懇祈 鈞局惠予審查並賜准其專利,實感德便。[Use of article]; This case relates to a water-cooling heat dissipation device, especially a water-cooling heat dissipation device that uses liquid to absorb the heat energy of an object. ;[Design Description];The overall design of this case is a water-cooled heat dissipation device with a lightweight appearance and a thin water tank. ;The basic line of the overall design of this case is a water-cooled radiator, which includes at least two thin water tanks, two flow channel structures and a diverter trough, and the two thin water tanks are located on the left and right sides of the diverter trough respectively, and through the The two flow channel structures are connected to the shunt groove, thereby jointly forming the line design of the water cooling heat dissipation device. ; Please refer to the three-dimensional view (representative view), front view and rear view of this case. It can be seen from the front view and rear view that the diverter is located between the two flow channel structures and the two thin water tanks, and can be passed through the two The lengths of the flow channel structures are designed to be different, so that the ratio between the diverter trough and the two flow channel structures presents an asymmetrical structural design, thus having unique lines and a simple and balanced aesthetic. Among them, due to the different length designs of the two flow channel structures, the two flow channel structures have different shapes of heat dissipation surfaces, thereby enriching the visual structural design. ; Secondly, please refer to the left and right views of this case. It can be seen from the left and right views that the two thin water tanks located on the left and right sides of the shunt channel have a flat rounded corner corresponding to their thickness and width. The rectangular shape shows that the two thin water tanks are designed with a flat and thin structure, which is more in line with modern aesthetic design in terms of vision and application. ; Furthermore, please refer to the top view and bottom view of this case. It can be seen from the top view and bottom view that the length of the flow channel structure located on the left side of the diverter trough is designed to be shorter than that of the other flow channel located on the right side of the diverter trough. The channel structure is such that the shunt trough is biased to the left side of the overall water-cooling heat dissipation device, so that the two-channel structure appears left and right asymmetry, thereby enriching the visual beauty. ; In this way, the overall outer edge of the water cooling device in this case is a flat and nearly rectangular structural design, and through the design of the two flow channel structures and the two thin water tanks with a large heat dissipation surface, , to improve the heat dissipation efficiency of the overall water-cooled heat dissipation device; therefore, this case can indeed present a line aesthetic effect that is both practical and fashionable. ; To sum up, the overall design of the water-cooled heat dissipation device in this case has very simple lines and has an asymmetrical but balanced composition and the beauty of heat dissipation efficiency. Therefore, this case is completely different from the conventional design of the nest mortar, and it should be very consistent with the design. There is absolutely no doubt about the requirements for applying for a patent; for this reason, I sincerely pray that the Jun Bureau will review and grant the patent, which is really helpful.
Description
本案係有關於一種水冷散熱裝置,特別是關於一種運用液體吸收物體熱能的水冷散熱裝置。 This case relates to a water-cooling heat sink, and more particularly to a water-cooling heat sink using a liquid to absorb the heat energy of an object.
本案整體設計係為一種外型輕巧並具有薄型水箱之水冷散熱裝置。 The overall design of the case is a water-cooling heat sink with a light weight and a thin water tank.
本案整體設計的基本線條,係為一水冷排,至少包含兩薄型水箱、兩流道結構以及一分流槽,且該兩薄型水箱分別位於該分流槽之左側邊以及右側邊,並藉由該兩流道結構連通於該分流槽,從而共同形成該水冷散熱裝置的線條設計。 The basic line of the overall design of the present case is a water-cooled row, comprising at least two thin water tanks, two flow passage structures and a split flow tank, and the two thin water tanks are respectively located at the left side and the right side of the split flow tank, and by the two The flow path structure is in communication with the flow dividing groove to collectively form a line design of the water-cooling heat sink.
請參閱本案之立體圖(代表圖)、前視圖及後視圖,由前視圖以及後視圖可得知,該分流槽位於該兩流道結構以及該兩薄型水箱之間,且可藉由該兩流道結構的長度設計不同,而使該分流槽與該兩流道結構的比例呈現不 對稱的結構設計,從而具有線條獨特且簡約平衡的美感。其中,藉由該兩流道結構長度設計的不同,而使兩流道結構具有不同形狀的散熱表面,從而得以豐富視覺上的結構設計。 Please refer to the perspective view (representative view), the front view and the rear view of the present case. It can be seen from the front view and the rear view that the diverter groove is located between the two flow path structures and the two thin water tanks, and the two flows can be The length of the channel structure is different, and the ratio of the branching channel to the structure of the two channels is not Symmetrical structural design, with a unique and simple balance of lines. Wherein, the two flow channel structures have different shapes of heat dissipation surfaces by different design lengths of the two flow path structures, thereby enriching the visual structural design.
其次,請參閱本案之左視圖以及右視圖,由左視圖以及右視圖可得知,位於該分流槽之左右側邊的該兩薄型水箱,對應其厚度與寬度的尺寸係呈現一扁平圓角的長方形狀,從而得知該兩薄型水箱係為扁平輕薄的結構設計,在視覺以及應用上更符合現代美感的設計。 Next, please refer to the left side view and the right side view of the present case. It can be seen from the left side view and the right side view that the two thin water tanks located on the left and right sides of the splitter groove have a flat rounded shape corresponding to the thickness and the width thereof. The shape of the rectangle is such that the two thin water tanks are designed to be flat and light, and are more aesthetically pleasing in terms of vision and application.
再者,請參閱本案之俯視圖以及仰視圖,由俯視圖以及仰視圖可得知,位於該分流槽之左側邊的該流道結構,其長度設計小於位於該分流槽之右側邊的該另一流道結構,而使該分流槽偏向位於整體水冷散熱裝置的左側邊,以使該兩流道結構呈現左右不對稱,而得以豐富視覺上的美感。 Furthermore, referring to the top view and the bottom view of the present case, it can be seen from the top view and the bottom view that the flow path structure located on the left side of the splitter groove has a length design smaller than the other flow path located on the right side of the split flow groove. The structure is such that the shunt groove is biased to the left side of the integral water-cooling heat dissipating device, so that the two flow channel structures exhibit left-right asymmetry, thereby enriching the visual aesthetic.
如此一來,本案水冷散熱裝置之整體外緣係為一扁平且趨近於長方形狀的結構設計,且藉由較大的散熱表面又扁平之該兩流道結構以及該兩薄型水箱的設計,以提升整體水冷散熱裝置的散熱效率;是以,本案確實可呈現出一種兼具實用性與時尚美觀的線條美感效果。 In this way, the overall outer edge of the water-cooling heat dissipating device of the present invention is a flat design which is close to a rectangular shape, and the two flow path structures are flattened by a large heat dissipating surface and the design of the two thin water tanks. In order to improve the heat dissipation efficiency of the overall water-cooling heat dissipating device; therefore, the present case can present a line aesthetic effect that is both practical and fashionable.
綜上所述,本案水冷散熱裝置之整體設計,線條十分簡約並兼具有不對稱但平衡的構成與散熱效率的美感,故本案乃完全迥異於習知設計之巢臼,應極符合設計專利之申請要件,蓋殆無疑義;為此,懇祈 鈞局惠予審查並賜准其專利,實感德便。 In summary, the overall design of the water-cooling heat-dissipating device in this case is very simple and has an asymmetrical but balanced composition and heat dissipation efficiency. Therefore, the case is completely different from the custom design nest and should meet the design patent. The application requirements are undoubtedly unambiguous; for this reason, the praying bureau will give it a review and grant its patents.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106306602F TWD191875S (en) | 2017-11-10 | 2017-11-10 | A water cooling device |
| US29/634,391 USD848960S1 (en) | 2017-11-10 | 2018-01-22 | Water cooling radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106306602F TWD191875S (en) | 2017-11-10 | 2017-11-10 | A water cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD191875S true TWD191875S (en) | 2018-07-21 |
Family
ID=66479690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106306602F TWD191875S (en) | 2017-11-10 | 2017-11-10 | A water cooling device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD848960S1 (en) |
| TW (1) | TWD191875S (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD891327S1 (en) * | 2018-10-24 | 2020-07-28 | Specialty Auto Parts U.S.A., Inc. | Decorative shroud for a coolant radiator with flush-fit fan |
| USD892877S1 (en) * | 2019-02-28 | 2020-08-11 | Resource International Inc. | Transmission cooler for automotive applications |
| USD892878S1 (en) * | 2019-02-28 | 2020-08-11 | Resource International Inc. | Transmission cooler for automotive applications |
| USD1047941S1 (en) * | 2022-06-24 | 2024-10-22 | Dongguan Yichen Intelligent Electronics Co., Ltd. | Heat sink |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM539763U (en) | 2016-11-25 | 2017-04-11 | Evga Corp | Fixing device for fluid cooling of interface card |
| TWM543531U (en) | 2017-01-26 | 2017-06-11 | Vital-Cooler Technology Co Ltd | Radiator structure improvement |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| USD574790S1 (en) * | 2006-01-07 | 2008-08-12 | Apack Inc. | Radiator for electric equipment part |
| US20070246205A1 (en) * | 2006-04-25 | 2007-10-25 | Shn-Yung Lee | Heat dispensing device with radially flowing coolant |
| US8136576B2 (en) * | 2006-06-22 | 2012-03-20 | Nuventix, Inc. | Vibration isolation system for synthetic jet devices |
| TWD121164S1 (en) * | 2007-02-16 | 2008-01-21 | 建準電機工業股份有限公司 | Blower type micro heat dissipation module |
| WO2008109805A2 (en) * | 2007-03-07 | 2008-09-12 | Asetek Usa Inc. | Hybrid liquid-air cooled graphics display adapter |
| US20120103575A1 (en) * | 2010-11-03 | 2012-05-03 | Hon Hai Precision Industry Co., Ltd. | Cooling device |
| KR101294077B1 (en) * | 2011-12-09 | 2013-08-07 | 현대자동차주식회사 | Cooling system power conversion device |
| US20140008039A1 (en) * | 2012-07-03 | 2014-01-09 | Antec, Inc. | Liquid-cooling heat dissipation apparatus for electronic elements |
| USD694199S1 (en) * | 2012-11-30 | 2013-11-26 | Foxconn Technology Co., Ltd. | Heat dissipating device |
| USD722576S1 (en) * | 2013-07-12 | 2015-02-17 | Liebherr-Elektronik Gmbh | Housing for electronic modules with cooling fins |
| USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD777123S1 (en) * | 2014-07-24 | 2017-01-24 | Allen-Vanguard Corporation | Mezzanine board |
| US9693487B2 (en) * | 2015-02-06 | 2017-06-27 | Caterpillar Inc. | Heat management and removal assemblies for semiconductor devices |
| US9992910B2 (en) * | 2015-06-11 | 2018-06-05 | Cooler Master Co., Ltd. | Liquid supply mechanism and liquid cooling system |
| US20170030493A1 (en) * | 2015-07-31 | 2017-02-02 | Evga Corporation | Structure of water-cooling piping system |
| CN105263301B (en) * | 2015-11-12 | 2017-12-19 | 深圳市研派科技有限公司 | A kind of liquid cooling heat radiation system and its liquid radiating row |
| US20170186667A1 (en) * | 2015-12-26 | 2017-06-29 | Intel Corporation | Cooling of electronics using folded foil microchannels |
| USD803169S1 (en) * | 2016-02-22 | 2017-11-21 | Heatscape.Com, Inc. | Combined liquid cooling cold plate and vapor chamber |
| CN107148194B (en) * | 2016-03-01 | 2019-12-27 | 双鸿科技股份有限公司 | Water-cooling heat dissipation device |
| US10378836B2 (en) * | 2016-09-26 | 2019-08-13 | Asia Vital Components Co., Ltd. | Water-cooling radiator assembly |
| JP6281622B1 (en) * | 2016-10-24 | 2018-02-21 | 日本電気株式会社 | Cooling device, mounting method, cooling structure |
| US20180269131A1 (en) * | 2017-03-20 | 2018-09-20 | Facebook, Inc. | Component cooling system |
-
2017
- 2017-11-10 TW TW106306602F patent/TWD191875S/en unknown
-
2018
- 2018-01-22 US US29/634,391 patent/USD848960S1/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM539763U (en) | 2016-11-25 | 2017-04-11 | Evga Corp | Fixing device for fluid cooling of interface card |
| TWM543531U (en) | 2017-01-26 | 2017-06-11 | Vital-Cooler Technology Co Ltd | Radiator structure improvement |
Also Published As
| Publication number | Publication date |
|---|---|
| USD848960S1 (en) | 2019-05-21 |
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