TWD192844S - A cooling device - Google Patents
A cooling deviceInfo
- Publication number
- TWD192844S TWD192844S TW107300056F TW107300056F TWD192844S TW D192844 S TWD192844 S TW D192844S TW 107300056 F TW107300056 F TW 107300056F TW 107300056 F TW107300056 F TW 107300056F TW D192844 S TWD192844 S TW D192844S
- Authority
- TW
- Taiwan
- Prior art keywords
- case
- design
- shaped
- cooling device
- heat dissipation
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract description 11
- 230000008878 coupling Effects 0.000 abstract description 5
- 238000010168 coupling process Methods 0.000 abstract description 5
- 238000005859 coupling reaction Methods 0.000 abstract description 5
- 230000003796 beauty Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 230000000007 visual effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract 5
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 abstract 1
Abstract
【物品用途】;本案係有關於一種冷卻裝置，特別是關於一種可與單/雙面電路板彈性組裝於一體的冷卻裝置。;【設計說明】;本案整體設計係為一種造形洗鍊並具有薄形化時尚美感之冷卻裝置。;本案整體設計的基本線條，係至少包含由一具有數道V型刻紋之散熱結構，與位於前述散熱結構之兩側結構區域的彈性結合元件所共同形成之線條設計。;其中，自本案立體圖與前/後側視圖中更可清楚得知，位於前述兩側結構區域之彈性結合元件，係分別呈現一接近C字型與倒C字型的設計；進一步而言，於前述接近C字型與倒C字型的對應內側面，皆呈現一彈性限位凹槽設計，以供與單/雙面電路板進行彈性組裝；另外，於接近C字型與倒C字型的各自外側面，則帶有具未來感的階梯式段差線條設計，以豐富視覺上的美感；如此一來，搭配著前述具有V型刻紋之散熱結構，本案整體科技感便躍然呈現於眼前。;另外，本案提供兩種將冷卻裝置與單/雙面電路板彈性組裝於一體時之不同視角的使用狀態參考圖，以輔助說明本案線條的特性；其中，藉由前述彈性結合元件將一單/雙面電路板與導熱件抵頂挾持住，使其緊密地貼合前述散熱結構以進行散熱的同時，因應本案整體的精實設計，確實可呈現出一種兼具實用性與時尚美觀的線條美感效果。;綜上所述，本案冷卻裝置之整體設計，線條十分簡潔並兼具有時尚簡約與科技效率的美感，故本案乃完全迥異於習知設計之巢臼，應極符合設計專利之申請要件，蓋殆無疑義；為此，懇祈 鈞局惠予審查並賜准其專利，實感德便。[Use of article] This case relates to a cooling device, especially a cooling device that can be flexibly assembled with a single/double-sided circuit board. ;[Design Description];The overall design of this case is a cooling device that is shaped like a chain and has a thin and fashionable aesthetic. The basic lines of the overall design of this case at least include a line design formed by a heat dissipation structure with several V-shaped carvings and elastic coupling elements located on both sides of the heat dissipation structure. ; Among them, it can be clearly seen from the three-dimensional view and the front/rear side view of this case that the elastic coupling elements located in the aforementioned structural areas on both sides present a design close to a C-shape and an inverted C-shape respectively; furthermore, On the corresponding inner sides of the aforementioned C-shaped and inverted C-shaped designs, there is an elastic limit groove design for flexible assembly with single/double-sided circuit boards; in addition, on the C-shaped and inverted C-shaped Each outer side of the model has a futuristic stepped step line design to enrich the visual beauty. In this way, combined with the aforementioned heat dissipation structure with V-shaped carvings, the overall sense of technology of this case is vividly presented. In front of you. ; In addition, this case provides two reference diagrams of different viewing angles when the cooling device and single/double-sided circuit boards are elastically assembled into one, to assist in explaining the characteristics of the lines of this case; among them, a single-sided circuit board is flexibly assembled through the aforementioned elastic coupling elements. / The double-sided circuit board and the thermal conductive member are pressed against the top to make it closely fit the aforementioned heat dissipation structure for heat dissipation. At the same time, in response to the overall compact design of this case, it can indeed present a line that is both practical and fashionable. Aesthetic effect. ;To sum up, the overall design of the cooling device in this case has very simple lines and combines the beauty of fashion, simplicity and technological efficiency. Therefore, this case is completely different from the conventional design and should be in compliance with the application requirements for a design patent. There is absolutely no doubt; for this reason, I sincerely pray that the Jun Bureau will review it and grant its patent, which is really beneficial.
Description
本案係有關於一種冷卻裝置，特別是關於一種可與單/雙面電路板彈性組裝於一體的冷卻裝置。 This case relates to a cooling device, and more particularly to a cooling device that can be elastically assembled with a single/double-sided circuit board.
本案整體設計係為一種造形洗鍊並具有薄形化時尚美感之冷卻裝置。 The overall design of the case is a cooling device that is shaped and washed and has a thin and stylish aesthetic.
本案整體設計的基本線條，係至少包含由一具有數道V型刻紋之散熱結構，與位於前述散熱結構之兩側結構區域的彈性結合元件所共同形成之線條設計。 The basic line of the overall design of the present case comprises at least a line design formed by a heat dissipating structure having a plurality of V-shaped engravings and elastic coupling elements located on the structural regions on both sides of the heat dissipating structure.
其中，自本案立體圖與前/後側視圖中更可清楚得知，位於前述兩側結構區域之彈性結合元件，係分別呈現一接近C字型與倒C字型的設計；進一步而言，於前述接近C字型與倒C字型的對應內側面，皆呈現一彈性限位凹槽設計，以供與單/雙面電路板進行彈性組裝；另外，於接近C字型與倒C字型的各自外側面，則帶有具未來感的階梯式段差線條設計，以豐富視覺上的美感；如此一來，搭配著前述具有V型刻紋之散熱結構，本案整體科技感便躍然呈現於眼前。 Among them, it can be clearly seen from the perspective view of the case and the front/rear side view that the elastic coupling elements located in the two side structural regions respectively present a design close to the C-shape and the inverted C-shape; further, The corresponding inner side surfaces of the C-shaped and inverted C-shaped shapes all have an elastic limiting groove design for elastic assembly with the single/double-sided circuit board; in addition, close to the C-shaped and inverted C-shaped The outer side of each has a futuristic stepped step line design to enrich the visual beauty; thus, with the above-mentioned heat-dissipating structure with V-shaped engraving, the overall technical sense of the case will be presented in front of the eyes. .
另外，本案提供兩種將冷卻裝置與單/雙面電路板彈性組裝於一體時之不同視角的使用狀態參考圖，以輔助說明本案線條的特性；其中，藉由前述彈性結合元件將一單/雙面電路板與導熱件抵頂挾持住，使其緊密地貼合前述散熱結構以進行散熱的同時，因應本案整體的精實設計，確實可呈現出一種兼具實用性與時尚美觀的線條美感效果。 In addition, the present invention provides two reference states of use for different viewing angles when the cooling device and the single/double-sided circuit board are elastically assembled, to assist in explaining the characteristics of the line of the case; wherein, by the aforementioned elastic bonding component, a single/ The double-sided circuit board and the heat-conducting member are held against the top, so that the heat-dissipating structure is closely attached to the heat-dissipating structure, and at the same time, according to the overall compact design of the present case, a practical and stylish aesthetic line can be presented. effect.
綜上所述，本案冷卻裝置之整體設計，線條十分簡潔並兼具有時尚簡約與科技效率的美感，故本案乃完全迥異於習知設計之巢臼，應極符合設計專利之申請要件，蓋殆無疑義；為此，懇祈 鈞局惠予審查並賜准其專利，實感德便。 In summary, the overall design of the cooling device in this case is very simple and has the beauty of sleek simplicity and scientific and technological efficiency. Therefore, this case is completely different from the nest of the custom design, and should meet the application requirements of the design patent. Undoubtedly, for this reason, the 恳 恳 惠 惠 审查 审查 审查 审查 审查 审查 审查 审查 审查 审查 审查 审查 审查 审查 审查
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107300056F TWD192844S (en) | 2018-01-05 | 2018-01-05 | A cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107300056F TWD192844S (en) | 2018-01-05 | 2018-01-05 | A cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD192844S true TWD192844S (en) | 2018-09-11 |
Family
ID=89075084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107300056F TWD192844S (en) | 2018-01-05 | 2018-01-05 | A cooling device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWD192844S (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD579455S1 (en) | 2007-08-28 | 2008-10-28 | Hon Hai Precision Industry Co., Ltd. | Notebook computer cooling pad |
| USD663276S1 (en) | 2011-06-22 | 2012-07-10 | Foxconn Technology Co., Ltd. | Cooling fin |
-
2018
- 2018-01-05 TW TW107300056F patent/TWD192844S/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD579455S1 (en) | 2007-08-28 | 2008-10-28 | Hon Hai Precision Industry Co., Ltd. | Notebook computer cooling pad |
| USD663276S1 (en) | 2011-06-22 | 2012-07-10 | Foxconn Technology Co., Ltd. | Cooling fin |
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