USD718725S1 - LED package with encapsulant - Google Patents

LED package with encapsulant Download PDF

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Publication number
USD718725S1
USD718725S1 US29/462,353 US201329462353F USD718725S US D718725 S1 USD718725 S1 US D718725S1 US 201329462353 F US201329462353 F US 201329462353F US D718725 S USD718725 S US D718725S
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US
United States
Prior art keywords
led package
encapsulant
view
elevation view
package shown
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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US29/462,353
Inventor
Jesse Reiherzer
Andrew Signor
Joseph Gates Clark
Michael John Bergmann
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CreeLED Inc
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Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/462,353 priority Critical patent/USD718725S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BERGMANN, MICHAEL JOHN, CLARK, JOSEPH GATES, REIHERZER, JESSE, SIGNOR, ANDREW
Application granted granted Critical
Publication of USD718725S1 publication Critical patent/USD718725S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART MODULAR TECHNOLOGIES, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, CREELED, INC., SMART EMBEDDED COMPUTING, INC. reassignment SMART MODULAR TECHNOLOGIES, INC. RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
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FIG. 1 is a top perspective view of an LED package according to one embodiment of the present invention.
FIG. 2 is a top view of the LED package shown in FIG. 1.
FIG. 3 is a bottom view of the LED package shown in FIG. 1.
FIG. 4 is a front elevation view of the LED package shown in FIG. 1.
FIG. 5 is a back elevation view of the LED package as shown in FIG. 1.
FIG. 6 is a right elevation view of the LED package shown in FIG. 1.
FIG. 7 is a left elevation view of the LED package shown in FIG. 1.
FIG. 8 is a top perspective view of an LED package according to one embodiment of the present invention.
FIG. 9 is a top view of the LED package with encapsulant shown in FIG. 8.
FIG. 10 is a bottom view of the LED package shown in FIG. 8.
FIG. 11 is a front elevation view of the LED package shown in FIG. 8.
FIG. 12 is a back elevation view of the LED package as shown in FIG. 8.
FIG. 13 is a right elevation view of the LED package shown in FIG. 8.
FIG. 14 is a left elevation view of the LED package shown in FIG. 8.
FIG. 15 is a top perspective view of an LED package according to one embodiment of the present invention.
FIG. 16 is a top view of the LED package shown in FIG. 15.
FIG. 17 is a bottom view of the LED package shown in FIG. 15.
FIG. 18 is a front elevation view of the LED package shown in FIG. 15.
FIG. 19 is a back elevation view of the LED package as shown in FIG. 15.
FIG. 20 is a right elevation view of the LED package shown in FIG. 15.
FIG. 21 is a left elevation view of the LED package shown in FIG. 15.
FIG. 22 is a top perspective view of an LED package according to one embodiment of the present invention.
FIG. 23 is a top view of the LED package shown in FIG. 22.
FIG. 24 is a bottom view of the LED package shown in FIG. 22.
FIG. 25 is a front elevation view of the LED package shown in FIG. 22.
FIG. 26 is a back elevation view of the LED package as shown in FIG. 22.
FIG. 27 is a right elevation view of the LED package shown in FIG. 22.
FIG. 28 is a left elevation view of the LED package shown in FIG. 22.
FIG. 29 is a top perspective view of an LED package according to one embodiment of the present invention.
FIG. 30 is a top view of the LED package shown in FIG. 29.
FIG. 31 is a bottom view of the LED package shown in FIG. 29.
FIG. 32 is a front elevation view of the LED package shown in FIG. 29.
FIG. 33 is a back elevation view of the LED package as shown in FIG. 29.
FIG. 34 is a right elevation view of the LED package shown in FIG. 29.
FIG. 35 is a left elevation view of the LED package shown in FIG. 29.
FIG. 36 is a top perspective view of an LED package according to one embodiment of the present invention.
FIG. 37 is a top view of the LED package shown in FIG. 36;
FIG. 38 is a bottom view of the LED package shown in FIG. 36.
FIG. 39 is a front elevation view of the LED package shown in FIG. 36.
FIG. 40 is a back elevation view of the LED package as shown in FIG. 36.
FIG. 41 is a right elevation view of the LED package shown in FIG. 36; and,
FIG. 42 is a left elevation view of the LED package shown in FIG. 36.
The broken lines shown in the above figures depict environmental subject matter only and form no part of the claimed design in those embodiments.

Claims (1)

    CLAIM
  1. The ornamental design for LED package with encapsulant, as shown and described herein.
US29/462,353 2013-08-01 2013-08-01 LED package with encapsulant Active USD718725S1 (en)

Priority Applications (1)

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US29/462,353 USD718725S1 (en) 2013-08-01 2013-08-01 LED package with encapsulant

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US29/462,353 USD718725S1 (en) 2013-08-01 2013-08-01 LED package with encapsulant

Publications (1)

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USD718725S1 true USD718725S1 (en) 2014-12-02

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US29/462,353 Active USD718725S1 (en) 2013-08-01 2013-08-01 LED package with encapsulant

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US (1) USD718725S1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
USD800679S1 (en) 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
USD810035S1 (en) * 2017-03-10 2018-02-13 Kingbright Electronics Co. Ltd. LED component
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
USD833989S1 (en) * 2017-03-15 2018-11-20 Citizen Electronics Co., Ltd. Light emitting diode
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
US10431568B2 (en) * 2014-12-18 2019-10-01 Cree, Inc. Light emitting diodes, components and related methods
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package

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USD645416S1 (en) * 2009-12-22 2011-09-20 Panasonic Corporation Light-emitting diode
USD649943S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
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USD667802S1 (en) * 2011-03-09 2012-09-25 Citizen Electronics Co., Ltd. Light-emitting diode
USD670010S1 (en) * 2010-07-23 2012-10-30 Everlight Electronics Co., Ltd. Light emitting diode
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED
USD691973S1 (en) * 2011-07-08 2013-10-22 Cree, Inc. Lamp packages
US20130328074A1 (en) * 2012-06-11 2013-12-12 Cree, Inc. Led package with multiple element light source and encapsulant having planar surfaces
TWD158573S (en) 2012-06-11 2014-01-21 科銳公司 Led package
TWD158571S (en) 2012-12-10 2014-01-21 鴻海精密工業股份有限公司 Adaptor
USD698323S1 (en) * 2010-07-30 2014-01-28 Nichia Corporation Light emitting diode
USD698741S1 (en) * 2012-05-29 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD703348S1 (en) * 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD704154S1 (en) * 2012-04-06 2014-05-06 Cree, Inc. Light emitter package
USD709464S1 (en) * 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package

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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US11004890B2 (en) 2012-03-30 2021-05-11 Creeled, Inc. Substrate based light emitter devices, components, and related methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD892066S1 (en) * 2014-12-11 2020-08-04 Cree, Inc. LED package
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
US10431568B2 (en) * 2014-12-18 2019-10-01 Cree, Inc. Light emitting diodes, components and related methods
USD800679S1 (en) 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
USD810035S1 (en) * 2017-03-10 2018-02-13 Kingbright Electronics Co. Ltd. LED component
USD833989S1 (en) * 2017-03-15 2018-11-20 Citizen Electronics Co., Ltd. Light emitting diode
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package

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