USD711331S1 - Upper chamber liner - Google Patents

Upper chamber liner Download PDF

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Publication number
USD711331S1
USD711331S1 US29/472,048 US201329472048F USD711331S US D711331 S1 USD711331 S1 US D711331S1 US 201329472048 F US201329472048 F US 201329472048F US D711331 S USD711331 S US D711331S
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United States
Prior art keywords
upper chamber
chamber liner
view
liner
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/472,048
Inventor
Shu-Kwan Lau
Mehmet Tugrul Samir
Anzhong Chang
Paul Brillhart
Richard O. Collins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/472,048 priority Critical patent/USD711331S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COLLINS, RICHARD O., CHANG, ANZHONG, LAU, Shu-Kwan, SAMIR, MEHMET TUGRUL, BRILLHART, PAUL
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Publication of USD711331S1 publication Critical patent/USD711331S1/en
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FIG. 1 is a top perspective view of an upper chamber liner showing our new design;
FIG. 2 is another top perspective view thereof;
FIG. 3 is a bottom perspective view thereof;
FIG. 4 is another bottom perspective view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a side view thereof;
FIG. 8 is another side view thereof;
FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 5;
FIG. 10 is an enlarged top view of the upper portion of FIG. 9; and,
FIG. 11 is an enlarged bottom view of the lower portion of FIG. 9.
The broken lines in the figures form no part of the claimed design.
The upper chamber liner is shown broken away in FIGS. 10 and 11 to indicate that no particular length is claimed.
All surfaces not shown, form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an upper chamber liner, as shown and described.
US29/472,048 2013-11-07 2013-11-07 Upper chamber liner Active USD711331S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/472,048 USD711331S1 (en) 2013-11-07 2013-11-07 Upper chamber liner

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Application Number Priority Date Filing Date Title
US29/472,048 USD711331S1 (en) 2013-11-07 2013-11-07 Upper chamber liner

Publications (1)

Publication Number Publication Date
USD711331S1 true USD711331S1 (en) 2014-08-19

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US29/472,048 Active USD711331S1 (en) 2013-11-07 2013-11-07 Upper chamber liner

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD736261S1 (en) * 2012-11-29 2015-08-11 Cummins Inc. Shroud
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
US20160033070A1 (en) * 2014-08-01 2016-02-04 Applied Materials, Inc. Recursive pumping member
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD910400S1 (en) * 2019-09-04 2021-02-16 Yongkang Moyi Tools Co., Ltd. Grinder dust shroud
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD1051867S1 (en) * 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1064005S1 (en) 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1069863S1 (en) * 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
US12553133B2 (en) 2022-08-04 2026-02-17 Applied Materials Inc. Substrate handling system, method, and apparatus

Citations (22)

* Cited by examiner, † Cited by third party
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USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6099651A (en) * 1997-09-11 2000-08-08 Applied Materials, Inc. Temperature controlled chamber liner
US6170429B1 (en) * 1998-09-30 2001-01-09 Lam Research Corporation Chamber liner for semiconductor process chambers
US6234219B1 (en) * 1999-05-25 2001-05-22 Micron Technology, Inc. Liner for use in processing chamber
US7066107B2 (en) * 2001-08-28 2006-06-27 Hynix Semiconductor Manufacturing America Inc. Shielding system for plasma chamber
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD593969S1 (en) * 2006-10-10 2009-06-09 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
USD599827S1 (en) * 2008-05-07 2009-09-08 Komatsu Ltd. Fan shroud for construction machinery
USD600722S1 (en) * 2008-05-07 2009-09-22 Komatsu Ltd. Fan shroud for construction machinery
USD605206S1 (en) * 2008-05-07 2009-12-01 Komatsu Ltd. Fan shroud for construction machinery
USD620031S1 (en) * 2008-05-07 2010-07-20 Komatsu Ltd. Fan shroud for construction machinery
USD655262S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD655258S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
US8617672B2 (en) * 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US6099651A (en) * 1997-09-11 2000-08-08 Applied Materials, Inc. Temperature controlled chamber liner
US6170429B1 (en) * 1998-09-30 2001-01-09 Lam Research Corporation Chamber liner for semiconductor process chambers
US6234219B1 (en) * 1999-05-25 2001-05-22 Micron Technology, Inc. Liner for use in processing chamber
US7066107B2 (en) * 2001-08-28 2006-06-27 Hynix Semiconductor Manufacturing America Inc. Shielding system for plasma chamber
US8617672B2 (en) * 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
USD593969S1 (en) * 2006-10-10 2009-06-09 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
USD599827S1 (en) * 2008-05-07 2009-09-08 Komatsu Ltd. Fan shroud for construction machinery
USD605206S1 (en) * 2008-05-07 2009-12-01 Komatsu Ltd. Fan shroud for construction machinery
USD620031S1 (en) * 2008-05-07 2010-07-20 Komatsu Ltd. Fan shroud for construction machinery
USD600722S1 (en) * 2008-05-07 2009-09-22 Komatsu Ltd. Fan shroud for construction machinery
USD655262S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD655258S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD736261S1 (en) * 2012-11-29 2015-08-11 Cummins Inc. Shroud
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
US20160033070A1 (en) * 2014-08-01 2016-02-04 Applied Materials, Inc. Recursive pumping member
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD910400S1 (en) * 2019-09-04 2021-02-16 Yongkang Moyi Tools Co., Ltd. Grinder dust shroud
USD1051867S1 (en) * 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1064005S1 (en) 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1069863S1 (en) * 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
US12553133B2 (en) 2022-08-04 2026-02-17 Applied Materials Inc. Substrate handling system, method, and apparatus
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

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