USD654881S1 - Bridge rectifier package with heat sink - Google Patents

Bridge rectifier package with heat sink Download PDF

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Publication number
USD654881S1
USD654881S1 US29/359,100 US35910010F USD654881S US D654881 S1 USD654881 S1 US D654881S1 US 35910010 F US35910010 F US 35910010F US D654881 S USD654881 S US D654881S
Authority
US
United States
Prior art keywords
heat sink
bridge rectifier
rectifier package
package
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/359,100
Inventor
Ta-Te Chou
Xiong-Jie Zhang
Xian Li
Hai Fu
Yong-Qi Tian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay General Semiconductor LLC
Original Assignee
Vishay General Semiconductor LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay General Semiconductor LLC filed Critical Vishay General Semiconductor LLC
Priority to US29/359,100 priority Critical patent/USD654881S1/en
Assigned to VISHAY GENERAL SEMICONDUCTOR LLC reassignment VISHAY GENERAL SEMICONDUCTOR LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FU, HAI, CHOU, TA-TE, LI, XIAN, TIAN, YONG-QI, ZHANG, XIONG-JIE
Application granted granted Critical
Publication of USD654881S1 publication Critical patent/USD654881S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a left, top perspective view of a new bridge rectifier package with heat sink showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a left view thereof;
FIG. 5 is a right view thereof;
FIG. 6 is a front view thereof; and,
FIG. 7 is a back view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a new bridge rectifier package with heat sink, as shown and described.
US29/359,100 2006-10-19 2010-04-06 Bridge rectifier package with heat sink Expired - Lifetime USD654881S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/359,100 USD654881S1 (en) 2006-10-19 2010-04-06 Bridge rectifier package with heat sink

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29/267,653 USD573116S1 (en) 2006-10-19 2006-10-19 Bridge rectifier package with heat sink
US29/321,381 USD616387S1 (en) 2006-10-19 2008-07-15 Bridge rectifier package
US29/359,100 USD654881S1 (en) 2006-10-19 2010-04-06 Bridge rectifier package with heat sink

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/321,381 Division USD616387S1 (en) 2006-10-19 2008-07-15 Bridge rectifier package

Publications (1)

Publication Number Publication Date
USD654881S1 true USD654881S1 (en) 2012-02-28

Family

ID=39597057

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/267,653 Expired - Lifetime USD573116S1 (en) 2006-10-19 2006-10-19 Bridge rectifier package with heat sink
US29/321,381 Expired - Lifetime USD616387S1 (en) 2006-10-19 2008-07-15 Bridge rectifier package
US29/359,100 Expired - Lifetime USD654881S1 (en) 2006-10-19 2010-04-06 Bridge rectifier package with heat sink

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US29/267,653 Expired - Lifetime USD573116S1 (en) 2006-10-19 2006-10-19 Bridge rectifier package with heat sink
US29/321,381 Expired - Lifetime USD616387S1 (en) 2006-10-19 2008-07-15 Bridge rectifier package

Country Status (2)

Country Link
US (3) USD573116S1 (en)
TW (4) TWD134144S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD742842S1 (en) * 2014-03-24 2015-11-10 Lem Intellectual Property Sa Electrical current transducer
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
US11555831B2 (en) 2020-08-20 2023-01-17 Vishay Dale Electronics, Llc Resistors, current sense resistors, battery shunts, shunt resistors, and methods of making

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD573116S1 (en) 2006-10-19 2008-07-15 Vishay General Semiconductor Llc Bridge rectifier package with heat sink
USD692377S1 (en) * 2012-12-04 2013-10-29 Remy Technologies, Llc Mosfet rectifier bridge power pack
USD954666S1 (en) * 2019-05-03 2022-06-14 Lumileds Holding B.V. Flexible circuit board
USD1049065S1 (en) * 2021-07-12 2024-10-29 Jmj Korea Co., Ltd. Semiconductor package

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4503452A (en) 1981-05-18 1985-03-05 Matsushita Electronics Corporation Plastic encapsulated semiconductor device and method for manufacturing the same
US4803545A (en) 1988-03-17 1989-02-07 Motorola, Inc. Self-fixturing heat sink
US4827329A (en) 1985-10-05 1989-05-02 Telefunken Electronic Gmbh Semiconductor array
US5450284A (en) 1994-02-17 1995-09-12 Spacelabs Medical, Inc. Heat sink and transistor retaining assembly
US5886400A (en) 1995-08-31 1999-03-23 Motorola, Inc. Semiconductor device having an insulating layer and method for making
US6255722B1 (en) 1998-06-11 2001-07-03 International Rectifier Corp. High current capacity semiconductor device housing
US6362517B1 (en) 1999-09-22 2002-03-26 Michael Ray Bell High voltage package for electronic device
US6476481B2 (en) 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
US20040145037A1 (en) 2003-01-24 2004-07-29 Niko Semiconductor Co., Ltd. Power semiconductor able of fast heat sinking
US6828170B2 (en) 1999-03-15 2004-12-07 Gentex Corporation Method of making a semiconductor radiation emitter package
US6891256B2 (en) 2001-10-22 2005-05-10 Fairchild Semiconductor Corporation Thin, thermally enhanced flip chip in a leaded molded package
US20050145998A1 (en) 2001-05-15 2005-07-07 Gem Services, Inc. Surface mount package
US20060001133A1 (en) 2003-03-20 2006-01-05 Mcgarvey Brian Optical sub-assembly for a transceiver
US20060033122A1 (en) 2004-08-11 2006-02-16 Mark Pavier Half-bridge package
US7095099B2 (en) 2003-11-12 2006-08-22 International Rectifier Corporation Low profile package having multiple die
US20060255362A1 (en) 2005-04-22 2006-11-16 Ralf Otremba Semiconductor Component in a Standard Housing and Method for the Production Thereof
US20070012947A1 (en) 2002-07-15 2007-01-18 International Rectifier Corporation Direct FET device for high frequency application
US20080164590A1 (en) * 2007-01-10 2008-07-10 Diodes, Inc. Semiconductor power device
USD573116S1 (en) 2006-10-19 2008-07-15 Vishay General Semiconductor Llc Bridge rectifier package with heat sink
US7586179B2 (en) 2007-10-09 2009-09-08 Fairchild Semiconductor Corporation Wireless semiconductor package for efficient heat dissipation

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005039000A1 (en) * 2003-10-15 2005-04-28 Sanyo Electric Co., Ltd Semiconductor laser apparatus

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4503452A (en) 1981-05-18 1985-03-05 Matsushita Electronics Corporation Plastic encapsulated semiconductor device and method for manufacturing the same
US4827329A (en) 1985-10-05 1989-05-02 Telefunken Electronic Gmbh Semiconductor array
US4803545A (en) 1988-03-17 1989-02-07 Motorola, Inc. Self-fixturing heat sink
US5450284A (en) 1994-02-17 1995-09-12 Spacelabs Medical, Inc. Heat sink and transistor retaining assembly
US5886400A (en) 1995-08-31 1999-03-23 Motorola, Inc. Semiconductor device having an insulating layer and method for making
US6476481B2 (en) 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
US6255722B1 (en) 1998-06-11 2001-07-03 International Rectifier Corp. High current capacity semiconductor device housing
US6828170B2 (en) 1999-03-15 2004-12-07 Gentex Corporation Method of making a semiconductor radiation emitter package
US6362517B1 (en) 1999-09-22 2002-03-26 Michael Ray Bell High voltage package for electronic device
US20050145998A1 (en) 2001-05-15 2005-07-07 Gem Services, Inc. Surface mount package
US6891256B2 (en) 2001-10-22 2005-05-10 Fairchild Semiconductor Corporation Thin, thermally enhanced flip chip in a leaded molded package
US20070012947A1 (en) 2002-07-15 2007-01-18 International Rectifier Corporation Direct FET device for high frequency application
US20040145037A1 (en) 2003-01-24 2004-07-29 Niko Semiconductor Co., Ltd. Power semiconductor able of fast heat sinking
US20060001133A1 (en) 2003-03-20 2006-01-05 Mcgarvey Brian Optical sub-assembly for a transceiver
US7095099B2 (en) 2003-11-12 2006-08-22 International Rectifier Corporation Low profile package having multiple die
US20060033122A1 (en) 2004-08-11 2006-02-16 Mark Pavier Half-bridge package
US20060255362A1 (en) 2005-04-22 2006-11-16 Ralf Otremba Semiconductor Component in a Standard Housing and Method for the Production Thereof
USD573116S1 (en) 2006-10-19 2008-07-15 Vishay General Semiconductor Llc Bridge rectifier package with heat sink
USD616387S1 (en) * 2006-10-19 2010-05-25 Vishay General Semiconductor Llc Bridge rectifier package
US20080164590A1 (en) * 2007-01-10 2008-07-10 Diodes, Inc. Semiconductor power device
US7586179B2 (en) 2007-10-09 2009-09-08 Fairchild Semiconductor Corporation Wireless semiconductor package for efficient heat dissipation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Taiwan Fiber-Optic Transceiver Industry Gets a Lift from Japan," Asian Sources, Electronic Components, Jul. 2004, 2 pages.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD742842S1 (en) * 2014-03-24 2015-11-10 Lem Intellectual Property Sa Electrical current transducer
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
US11555831B2 (en) 2020-08-20 2023-01-17 Vishay Dale Electronics, Llc Resistors, current sense resistors, battery shunts, shunt resistors, and methods of making
US12196783B2 (en) 2020-08-20 2025-01-14 Vishay Dale Electronics, Llc Resistors, current sense resistors, battery shunts, shunt resistors, and methods of making

Also Published As

Publication number Publication date
TWD134143S1 (en) 2010-04-01
USD573116S1 (en) 2008-07-15
TWD138337S1 (en) 2010-12-21
TWD134144S1 (en) 2010-04-01
USD616387S1 (en) 2010-05-25
TWD132656S1 (en) 2009-12-21

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