US20060001133A1 - Optical sub-assembly for a transceiver - Google Patents
Optical sub-assembly for a transceiver Download PDFInfo
- Publication number
- US20060001133A1 US20060001133A1 US11/226,370 US22637005A US2006001133A1 US 20060001133 A1 US20060001133 A1 US 20060001133A1 US 22637005 A US22637005 A US 22637005A US 2006001133 A1 US2006001133 A1 US 2006001133A1
- Authority
- US
- United States
- Prior art keywords
- lead frame
- ground plane
- electro
- locating feature
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000003287 optical effect Effects 0.000 title description 3
- 238000000465 moulding Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 13
- 239000000835 fiber Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000356 contaminant Substances 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 description 9
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
An electro-optical device (1) has a lead frame (3) having a through-hole (10) acting as a locating feature for a mould pin for moulding a body (4) incorporating a lens (5). The hole (10) is also used as a reference for a placement machine placing a component (2) within 1.5 mm of it. Subsequently, after withdrawal of the mould pin a recess (35) remains, which can act as a locating feature for a waveguide termination connecting to the device. Also, the device comprises a ground plane (55) bonded to the back of the moulded body (53) or (72) incorporated in the lead frame.
Description
- 1. Field of the Invention
- The invention relates to electro-optical devices such as transceivers, transmitters, or receivers, particularly for high frequency operation.
- 2. Prior Art Discussion
- FIG. A shows cross-sectional front and side views of a prior art device, and FIG. B shows a side view cross-section of an assembly incorporating the device and a fibre termination. FIG. C shows a strip of metallic lead frames (LF) used during production of the device. Components such as a photo diode (PD) are placed on the lead frame (LF). These ends of the lead frame are placed in a mould in which bodies (MB) of transparent epoxy material are moulded around the ends of the lead frame (LF) and the component (PD).
- After moulding, the individual parts are cut from the lead frame strip, leaving portions of the lead frame protruding from the moulded body, so as to act as electrical leads for the device. It is also known:
-
- to incorporate a lens (L) into such moulded encapsulation;
- to place a component so made into a housing (H) which forms a socket allowing a plug (P) attached to the end of an optical fibre (F) to be engaged so that the fibre is aligned with the lens; and
- to incorporate a guide feature (GF) in the moulded body to assist in the alignment of the plug and the fibre with the lens.
- While this approach is satisfactory in some situations, for high frequency applications it is very difficult to achieve sufficient alignment between the optical component and the moulded lens and ultimately the optical fibre.
- Another aspect of high frequency electro-optical devices is that signal integrity problems arise because of discontinuity of a ground plane between the drive circuit into which the device is connected and the device itself. These problems lead to bit errors. It is known that the transmission of high frequency signals along an electrical conductor will be most effective if that electrical conductor is a constant small distance from, but insulated from, another conductor, this second conductor being connected to electrical ground. This second conductor is commonly known as the “ground plane”. In printed circuit boards, this is commonly achieved by constructing the board with multiple layers of conductors separated by insulating material. One of these layers, known as a “ground plane”, is connected to electrical ground.
- In existing electro-optical device circuits there is a discontinuity in the “ground plane” effect at the point where the signal leaves a printed circuit board and enters the leads of the device. This discontinuity, though the dimensions may only be in the order of a few millimetres, can cause serious problems in the transmission of high frequency electronic signals.
- The invention is therefore directed towards providing improved electro-optical devices for high-frequency operation, and methods of manufacturing them.
- According to the invention, there is provided a method of manufacturing an electro-optical device having a lead frame supporting a component and a moulded body around the component and part of the lead frame, the method comprising the steps of:
-
- providing a locating feature in the lead frame; and
- engaging a feature of the mould with the lead pin locating feature during moulding.
- In one embodiment, the lead frame locating feature is used as a reference by a vision system when placing the component on the lead frame.
- In another embodiment, the lead frame locating feature is within an area of the lead frame surrounded by the moulded body.
- In a further embodiment, the lead frame locating feature is an aperture in the lead frame, and a mould feature is a pin.
- In one embodiment, the aperture extends fully through the lead frame.
- In a further embodiment, the mould pin is removed, leaving a recess in the moulded body.
- In one embodiment, the recess is used subsequently as a device locating feature for connection of a fibre termination to the moulded body.
- In another embodiment, a part of the fibre termination extends into the recess.
- In a further embodiment, the recess is at least partially filled to prevent ingress of contaminants.
- In one embodiment, the lead frame includes a spring element, allowing the part of the lead frame in which the locating feature is located to move for guiding of the mould feature into engagement.
- In a further embodiment, the lead frame spring element comprises a cranked portion of a lead frame leg.
- In one embodiment, the method comprises the further step of providing a ground plane in the device.
- In a further embodiment, the ground plane is adhered to the moulded body.
- In one embodiment, the ground plane also extends to lie alongside the exposed part of the lead frame.
- In another embodiment, the ground plane is incorporated in the lead frame.
- In a further embodiment, the lead frame is multi-layered, comprising:
-
- a lead frame conducting layer,
- an insulating layer, and
- a ground plane layer separated from the conducting layer by the insulating layer.
- In another aspect, the invention provides an electro-optical device comprising a lead frame on which is mounted a component, wherein the device further comprises a ground plane separated from a lead frame conductor.
- In one embodiment, the ground plane is adhered to a moulded body encapsulated around part of the lead frame and the component.
- In another embodiment, the ground plane is a layer of the lead frame.
- In a further embodiment, the ground plane extends alongside an exposed part of the lead frame.
- In one embodiment, the ground plane comprises legs for insertion in apertures of a circuit board.
- In another embodiment, the lead frame legs are cranked to allow surface mounting of the device with the lead frame lying in the general plane of a circuit board.
- The invention also provides an assembly comprising a device as defined above and a waveguide connected to the device.
- The invention also provides a circuit comprising a circuit board having a ground plane and a device as defined above, wherein the ground plane of the device is electrically connected to the ground plane of the circuit board.
- The invention will be more clearly understood from the following description of some embodiments thereof, given by way of example only with reference to the accompanying drawings in which:
-
FIG. 1 (a) is a set of views of an electro-optical device, andFIG. 1 (b) is a diagrammatic view of an alternative lead frame; -
FIG. 2 is a diagrammatic side view of a device after application of a ground plane; -
FIG. 3 is a diagrammatic perspective view of another device of the invention when mounted on a circuit board; -
FIG. 4 is a perspective view of an alterative lead frame; -
FIG. 5 is a diagrammatic side view of a further device of the invention; and -
FIG. 6 is a side view of a still further device. - FIG. (1) shows an electro-
optical device 1 of the invention, having a photo-diode 2 mounted on alead frame 3 and around which a transparentepoxy body 4 is moulded. Thebody 4 incorporates alens 5. - The
lead frame 3 comprises a locatinghole 10 close to thecomponent 2 and within the mouldedbody 4. Section A-A shows registry of thecomponent 2 with thelens 5. Very accurate registry is achieved because the locatinghole 10 provides a reference during moulding because a moulding pin is inserted in it, thus allowing highly accurate moulding and hence location of thelens 5 with respect to thecomponent 2. The leadframe locating hole 10 provides a rigid link between the lead frame in close proximity to thecomponent 2 and the mould body. The dimensions of the locating hole are typically 1 mm in diameter and the distance from thecomponent 2 to the centre of the locating hole is typically 1.5 mm. - As shown in the B-B Section, after removal of the mould pin from the
hole 10 there is adeep recess 35. This is partially filled in a subsequent operation withpolymer 36, leaving a more shallow recess for use in alignment of the end of a waveguide. - The locating feature on the lead frame is also used as the reference by the machine placing the electro-
optical component 2, thus allowing even greater accuracy. Thus, the locatinghole 10 provides a single reference for both component placement and moulding. This is particularly advantageous for the level of accuracy required for high frequency use of the device. - Turning again to the moulding, as the lead frame is inserted into the mould the tapered end of the mould pin will engage in the
hole 10, and guide it to the correct location relative to the mould. To facilitate this guiding action, it may be advantageous to incorporate resilience in a part of the lead frame to allow the portion of the lead frame carrying the electro-optical component and the locating hole to move relative to the rest of the lead frame, so as to allow it to be guided by the pin. This is illustrated inFIG. 1 (b), which is similar in function to the lead frame shown inFIG. 1 (a), except that the member carrying the locating hole has acurved support portion 20, providing a spring effect between the lower main strip with the tooling holes and the point where the locating pin accurately positions the portion of the lead frame carrying the electro-optical component. - As mentioned above the effect of the pin will be to leave a hole in the finished moulded component. After completion of the moulding operation, this is partially filled to prevent the ingress of moisture to the lead frame at a point dose to the location of the electro-optical component.
- The shape of the pin is such that this hole, (or as much of it as remains after part of it is filled) acts as a locating element for the light guide, or for a carrier which locates the light guide or optical fibre in the correct location relative to the lens or other appropriate feature on the device.
- In an alternative embodiment, the locating feature may be located just outside the portion of the lead frame that is encapsulated in the mould. In this case the pin or other feature of the mould that locates the locating feature will not leave an impression in the finished moulded part, but the provision of such a locating pin or other locating mechanism close to the electro-optical component in each cavity of the mould will serve to precisely locate the electro-optical components relative to the moulded features.
- Referring to
FIG. 2 , in a further method step for producing adevice 50 having alead frame 51, acomponent 52, and amoulded body 53, aground plane 55 is bonded at the rear surface of thebody 53. Theground plane 55 may be connected by a soldered link to the circuit board's ground plane. This provides continuity between the circuit board's ground plane, and that of the device. - Referring to
FIG. 3 a device 60 is shown mounted in acircuit board 61 having aground plane 62. Aground plane 63 is adhered to the back of a mouldedbody 64, and it extends down at the back of thelead frame 64. At the board level it is located inholes 66 for electrical connection with the circuit'sground plane 62. - Thus the signals flowing in the tracks parallel to the
ground plane 62 continue to be a similar distance from theground plane 63 as they flow up the leads formed by thelead frame 64. - However, other arrangements are possible. The leads could be bent to facilitate surface mounting, or the component may be inserted in an appropriate socket or connected to wires or other discrete conductors.
- In another embodiment the lead frame material is assembled with the ground plane material and a thin layer of insulating material, which is between them. This is then used as a basis on which to mount the electronic or electro-optical components. This construction is illustrated in
FIGS. 4 and 5 .FIG. 4 shows alead frame 70 prepared with insulatingmaterial 71,ground plane material 72, and conductingmaterial 73. Anadditional member 74 on the bottom serves to hold the elements of the lead frame together until the moulding operation has been completed. Thiselement 74 will be cut away after moulding. This drawing shows a locating hole 75 close to where a component is placed. - In
FIG. 5 the whole device is shown, including a mouldedbody 81 and an electro-optical component 85 which is mounted on the signal-carryinglayer 73 of thelead frame 70. The ground plane layer of the lead frame, 72, is separated from the signal-carryinglayer 73 by the insulatinglayer 71. - Parts made according to this construction may be particularly suitable for surface mounting, by arranging for the lead or leads corresponding to the ground plane to be longer than, shorter than, or shaped differently from the other leads and for one or both sets of leads to be bent to bring them to the same plane. This is illustrated in
FIG. 6 , showing adevice 100 with abody 101 and alens 102 moulded on a composite lead frame consisting of asignal carrying layer 105 and aground plane layer 106, both of metal, with an intermediate insulatinglayer 107. The leads formed by the portions of the lead frame which protrude from the body of the component are bent so that when the component is laid flat on a printed circuit board, the ground plane leads and the signal leads will all come in contact with different portions of the printed circuit board, to which they may be attached by solder. - The distance between the conductor carrying the high frequency signal and the ground plane should be altered if the dielectric constant of the material between them changes. Thus, for example, if the dielectric constant of the material used between the lead frame and the ground plane in the device is different from the dielectric constant of the material used between the signal conductor and the ground plane conductor in the printed circuit board, it may be appropriate that the distance between the first pair be correspondingly greater or less than the distance between the latter pair. For example, fr4 PCB material has a dielectric constant of 4.6 and the gap between the active layer and ground plane is 0.30 mm. Optical plastic package material has a typical dielectric constant of 3.8. So the distance between the data leads and ground plane within the package should be set to 0.25 mm provided the data leads are the same width inside the package as they are outside. The impedance may also be matched by adjusting the data lead width in cases where the thickness of package cannot be adjusted.
- It will be appreciated that the invention provides for elimination of the manufacturing error in lead frame dimensions between tooling hole and reference. Location of the moulded body is made by the same reference as is used for the vision system of the component placing machine. Errors arising from relative thermal expansion of the lead frame and the moulded body are reduced by a large factor because of the short distance between the component placement position and the locating hole. The invention also reduces errors in mould dimensions and registry between the lens and the fibre if the mould pin recess is used for registration of the fibre termination. It will also be appreciated that the invention provides for significantly enhanced electro-optical performance because of the ground plane arrangement.
- The invention is not limited to the embodiments described but may be varied in construction and detail.
Claims (25)
1-29. (canceled)
30. A method of manufacturing an electro-optical device having a lead frame supporting a component and a moulded body around the component and part of the lead frame, the method comprising the steps of:
providing a locating feature in the lead frame;
engaging a feature of the mould with the lead frame locating feature during moulding; and
the lead frame including a spring element allowing the part of the lead frame in which the locating feature is located to move for guiding engagement with the mould feature.
31. The method as claimed in claim 30 , wherein the lead frame comprises a base and a plurality of legs extending from the base, at least one of said legs having the locating feature and the spring element, the spring element being between the locating feature and the base.
32. The method as claimed in claim 30 , wherein the lead frame locating feature is used as a reference by a vision system when placing the component on the lead frame.
33. The method as claimed in claim 30 , wherein the lead frame locating feature is within an area of the lead frame surrounded by the moulded body.
34. The method as claimed in claim 30 , wherein the lead frame locating feature is an aperture in the lead frame, and a mould feature is a pin.
35. The method as claimed in claim 34 , wherein the aperture extends fully through the lead frame.
36. The method as claimed in claim 34 , wherein the mould pin is removed, leaving a recess in the moulded body.
37. The method as claimed in claim 36 , wherein the recess is used subsequently as a device locating feature for connection of a fibre termination to the moulded body.
38. The method as claimed in claim 37 , wherein a part of the fibre termination extends into the recess.
39. The method as claimed in claim 36 , wherein the recess is at least partially filled to prevent ingress of contaminants.
40. The method as claimed in claim 30 , wherein the lead frame spring element comprises a cranked portion of a lead frame leg.
41. The method as claimed in claim 30 , comprising the further step of providing a ground plane in the device.
42. The method as claimed in claim 41 , wherein the ground plane is adhered to the moulded body.
43. The method as claimed in claim 42 , wherein the ground plane also extends to lie alongside the exposed part of the lead frame.
44. The method as claimed in claim 41 , wherein the ground plane is incorporated in the lead frame.
45. The method as claimed in claim 44 , wherein the lead frame is multi-layered, comprising:
a lead frame conducting layer,
an insulating layer, and
a ground plane layer separated from the conducting layer by the insulating layer.
46. The electro-optical device manufactured in a method according to claim 30 comprising a lead frame on which is mounted a component, wherein the device further comprises a ground plane separated from a lead frame conductor.
47. The electro-optical device as claimed in claim 46 , wherein the ground plane is adhered to a moulded body encapsulated around part of the lead frame and the component.
48. The electro-optical device as claimed in claim 46 , wherein the ground plane is a layer of the lead frame.
49. The electro-optical device as claimed in claim 46 , wherein the ground plane extends alongside an exposed part of the lead frame.
50. The electro-optical device as claimed in claim 49 , wherein the ground plane comprises legs for insertion in apertures of a circuit board.
51. The electro-optical device as claimed in claim 48 , wherein the lead frame legs are cranked to allow surface mounting of the device with the lead frame lying in the general plane of a circuit board.
52. The assembly comprising a device of claim 46 , and a waveguide connected to the device.
53. The circuit comprising a circuit board having a ground plane and a device of claim 46 , wherein the ground plane of the device is electrically connected to the ground plane of the circuit board.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IEIE2003/0207 | 2003-03-20 | ||
IE20030207 | 2003-03-20 | ||
PCT/IE2004/000038 WO2004084317A2 (en) | 2003-03-20 | 2004-03-22 | An optical sub-assembly for a transceiver |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IE2004/000038 Continuation WO2004084317A2 (en) | 2003-03-20 | 2004-03-22 | An optical sub-assembly for a transceiver |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060001133A1 true US20060001133A1 (en) | 2006-01-05 |
Family
ID=33017808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/226,370 Abandoned US20060001133A1 (en) | 2003-03-20 | 2005-09-15 | Optical sub-assembly for a transceiver |
Country Status (2)
Country | Link |
---|---|
US (1) | US20060001133A1 (en) |
WO (1) | WO2004084317A2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8581173B2 (en) | 2010-10-27 | 2013-11-12 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Fiber optic transceiver module having a molded cover in which an optical beam transformer made of an elastomer is integrally formed |
EP2329538B1 (en) * | 2008-09-22 | 2019-02-20 | OSRAM Opto Semiconductors GmbH | Housing for an optoelectronic component |
JP2020170802A (en) * | 2019-04-04 | 2020-10-15 | ローム株式会社 | Photo interrupter and electronic component |
USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
US20220321226A1 (en) * | 2019-09-20 | 2022-10-06 | Lipac Co., Ltd. | Subminiature optical transmission module and method for manufacturing same by using semiconductor packaging scheme |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1722258A1 (en) | 2005-05-13 | 2006-11-15 | STMicroelectronics S.r.l. | Optical radiation coupling module |
WO2012110994A1 (en) | 2011-02-16 | 2012-08-23 | Firecomms Limited | An electro-optical device and method of manufacture |
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US5208188A (en) * | 1989-10-02 | 1993-05-04 | Advanced Micro Devices, Inc. | Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process |
US6265764B1 (en) * | 1998-04-01 | 2001-07-24 | Micron Technology, Inc. | Interdigitated capacitor design for integrated circuit lead frames |
US6312624B1 (en) * | 1997-03-07 | 2001-11-06 | Infineon Technologies Ag | Method for producing an electrooptical module |
US20030113120A1 (en) * | 2001-11-30 | 2003-06-19 | Nobuyuki Ohe | Optical transmitter-receiver module and electronic device using the same |
US6617200B2 (en) * | 2000-07-05 | 2003-09-09 | Seiko Epson Corporation | System and method for fabricating a semiconductor device |
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JPS55129307A (en) * | 1979-02-06 | 1980-10-07 | Texas Instruments Inc | Self matching fiberroptical package |
JPS61108180A (en) * | 1984-10-31 | 1986-05-26 | Tatsuta Electric Wire & Cable Co Ltd | Photoelectric conversion element |
JP2862585B2 (en) * | 1989-09-11 | 1999-03-03 | 沖電気工業株式会社 | Resin-sealed semiconductor device and method of manufacturing the same |
JPH05326822A (en) * | 1992-05-15 | 1993-12-10 | Shinko Electric Ind Co Ltd | Multilayer lead frame |
US5302778A (en) * | 1992-08-28 | 1994-04-12 | Eastman Kodak Company | Semiconductor insulation for optical devices |
JP2001007130A (en) * | 1999-06-21 | 2001-01-12 | Mitsubishi Electric Corp | Apparatus and method for manufacturing semiconductor device |
-
2004
- 2004-03-22 WO PCT/IE2004/000038 patent/WO2004084317A2/en active Application Filing
-
2005
- 2005-09-15 US US11/226,370 patent/US20060001133A1/en not_active Abandoned
Patent Citations (5)
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US5208188A (en) * | 1989-10-02 | 1993-05-04 | Advanced Micro Devices, Inc. | Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process |
US6312624B1 (en) * | 1997-03-07 | 2001-11-06 | Infineon Technologies Ag | Method for producing an electrooptical module |
US6265764B1 (en) * | 1998-04-01 | 2001-07-24 | Micron Technology, Inc. | Interdigitated capacitor design for integrated circuit lead frames |
US6617200B2 (en) * | 2000-07-05 | 2003-09-09 | Seiko Epson Corporation | System and method for fabricating a semiconductor device |
US20030113120A1 (en) * | 2001-11-30 | 2003-06-19 | Nobuyuki Ohe | Optical transmitter-receiver module and electronic device using the same |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2329538B1 (en) * | 2008-09-22 | 2019-02-20 | OSRAM Opto Semiconductors GmbH | Housing for an optoelectronic component |
US8581173B2 (en) | 2010-10-27 | 2013-11-12 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Fiber optic transceiver module having a molded cover in which an optical beam transformer made of an elastomer is integrally formed |
JP2020170802A (en) * | 2019-04-04 | 2020-10-15 | ローム株式会社 | Photo interrupter and electronic component |
JP7271270B2 (en) | 2019-04-04 | 2023-05-11 | ローム株式会社 | Photo interrupters and electronic components |
USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
US20220321226A1 (en) * | 2019-09-20 | 2022-10-06 | Lipac Co., Ltd. | Subminiature optical transmission module and method for manufacturing same by using semiconductor packaging scheme |
Also Published As
Publication number | Publication date |
---|---|
WO2004084317A3 (en) | 2005-02-17 |
WO2004084317A2 (en) | 2004-09-30 |
IE20040179A1 (en) | 2004-11-03 |
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AS | Assignment |
Owner name: FIRECOMMS LIMITED, IRELAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MCGARVEY, BRIAN;MORIARTY, THOMAS;REEL/FRAME:016995/0426 Effective date: 20050907 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |