USD648686S1 - Light emitting diode (LED) package - Google Patents

Light emitting diode (LED) package Download PDF

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Publication number
USD648686S1
USD648686S1 US29/360,791 US36079110F USD648686S US D648686 S1 USD648686 S1 US D648686S1 US 36079110 F US36079110 F US 36079110F US D648686 S USD648686 S US D648686S
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US
United States
Prior art keywords
led
package
light emitting
emitting diode
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/360,791
Inventor
Christopher P. Hussell
Shuying Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/360,791 priority Critical patent/USD648686S1/en
Priority to US12/825,075 priority patent/US8598602B2/en
Priority to TW099305566F priority patent/TWD146222S/en
Priority to TW100305347F priority patent/TWD148144S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, SHUYING, HUSSELL, CHRISTOPHER P.
Priority to US29/401,692 priority patent/USD659657S1/en
Publication of USD648686S1 publication Critical patent/USD648686S1/en
Application granted granted Critical
Priority to US14/094,341 priority patent/US9123874B2/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART MODULAR TECHNOLOGIES, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, CREELED, INC., SMART EMBEDDED COMPUTING, INC. reassignment SMART MODULAR TECHNOLOGIES, INC. RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

FIG. 1 is a top perspective view of an light emitting diode (LED) package showing our design;
FIG. 2 is a top view thereof;
FIG. 3 is a top end view thereof;
FIG. 4 is an opposing bottom end view thereof;
FIG. 5 is a bottom view thereof opposite the view of FIG. 2;
FIG. 6 is a side view thereof;
FIG. 7 is an opposing side view thereof; and,
FIG. 8 is a back perspective view thereof.
The broken lines immediately adjacent to the shaded areas represent the boundaries of the claimed design. Other broken lines are for illustrative purpose only and form no part of the claimed design. None of the broken lines form part of the claimed design.

Claims (1)

  1. The ornamental design for a light emitting diode (LED) package, as shown and described.
US29/360,791 2009-01-12 2010-04-30 Light emitting diode (LED) package Expired - Lifetime USD648686S1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US29/360,791 USD648686S1 (en) 2010-04-30 2010-04-30 Light emitting diode (LED) package
US12/825,075 US8598602B2 (en) 2009-01-12 2010-06-28 Light emitting device packages with improved heat transfer
TW099305566F TWD146222S (en) 2010-04-30 2010-10-29 Light emitting diode (led) package
TW100305347F TWD148144S1 (en) 2010-04-30 2010-10-29 Light emitting diode (led) package
US29/401,692 USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package
US14/094,341 US9123874B2 (en) 2009-01-12 2013-12-02 Light emitting device packages with improved heat transfer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/360,791 USD648686S1 (en) 2010-04-30 2010-04-30 Light emitting diode (LED) package

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US29/338,186 Continuation-In-Part USD641719S1 (en) 2009-01-12 2009-06-05 Light emitting diode
US29/401,692 Division USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package

Publications (1)

Publication Number Publication Date
USD648686S1 true USD648686S1 (en) 2011-11-15

Family

ID=44907302

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/360,791 Expired - Lifetime USD648686S1 (en) 2009-01-12 2010-04-30 Light emitting diode (LED) package
US29/401,692 Active USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/401,692 Active USD659657S1 (en) 2010-04-30 2011-09-14 Light emitting diode (LED) package

Country Status (2)

Country Link
US (2) USD648686S1 (en)
TW (2) TWD146222S (en)

Cited By (17)

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US20110180827A1 (en) * 2009-06-05 2011-07-28 Hussell Christopher P Solid state lighting device
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
USD659657S1 (en) 2010-04-30 2012-05-15 Cree, Inc. Light emitting diode (LED) package
USD661264S1 (en) 2009-06-05 2012-06-05 Cree, Inc. Light emiting device package
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US10683971B2 (en) 2015-04-30 2020-06-16 Cree, Inc. Solid state lighting components
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
USD1052791S1 (en) * 2021-12-31 2024-11-26 Foshan Nationstar Optoelectronics Co., Ltd. Light emitting diode lead-frame
USD1117119S1 (en) * 2023-03-20 2026-03-10 Rohm Co., Ltd. Light-emitting semiconductor module

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US9685592B2 (en) 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
CN102934228B (en) 2011-03-02 2017-09-01 惠州科锐半导体照明有限公司 Light emission diode package member and light emitting diode
USD691100S1 (en) * 2011-03-02 2013-10-08 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device
USD777694S1 (en) * 2015-05-15 2017-01-31 Citizen Electronics Co., Ltd. Light-emitting diode
USD782989S1 (en) * 2015-05-15 2017-04-04 Citizen Electronics Co., Ltd. Light-emitting diode
TWD204008S (en) 2019-03-22 2020-04-11 晶元光電股份有限公司 Part of light-emitting device
TWD204009S (en) 2019-03-22 2020-04-11 晶元光電股份有限公司 Part of light-emitting device

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